JPS62185323A - 半導体ウエハ−のプラズマ処理装置 - Google Patents
半導体ウエハ−のプラズマ処理装置Info
- Publication number
- JPS62185323A JPS62185323A JP2756786A JP2756786A JPS62185323A JP S62185323 A JPS62185323 A JP S62185323A JP 2756786 A JP2756786 A JP 2756786A JP 2756786 A JP2756786 A JP 2756786A JP S62185323 A JPS62185323 A JP S62185323A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafers
- stopper
- pusher
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 238000009832 plasma treatment Methods 0.000 title abstract description 4
- 230000007246 mechanism Effects 0.000 claims abstract description 71
- 235000012431 wafers Nutrition 0.000 claims description 159
- 239000011295 pitch Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000004380 ashing Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 241000257465 Echinoidea Species 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 102100027340 Slit homolog 2 protein Human genes 0.000 description 1
- 101710133576 Slit homolog 2 protein Proteins 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2756786A JPS62185323A (ja) | 1986-02-10 | 1986-02-10 | 半導体ウエハ−のプラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2756786A JPS62185323A (ja) | 1986-02-10 | 1986-02-10 | 半導体ウエハ−のプラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62185323A true JPS62185323A (ja) | 1987-08-13 |
| JPH0571136B2 JPH0571136B2 (enrdf_load_stackoverflow) | 1993-10-06 |
Family
ID=12224600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2756786A Granted JPS62185323A (ja) | 1986-02-10 | 1986-02-10 | 半導体ウエハ−のプラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62185323A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315155A (ja) * | 1988-03-11 | 1989-12-20 | Tel Sagami Ltd | ウエハ移送装置 |
-
1986
- 1986-02-10 JP JP2756786A patent/JPS62185323A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01315155A (ja) * | 1988-03-11 | 1989-12-20 | Tel Sagami Ltd | ウエハ移送装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0571136B2 (enrdf_load_stackoverflow) | 1993-10-06 |
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