JPS62184737U - - Google Patents
Info
- Publication number
- JPS62184737U JPS62184737U JP1986073739U JP7373986U JPS62184737U JP S62184737 U JPS62184737 U JP S62184737U JP 1986073739 U JP1986073739 U JP 1986073739U JP 7373986 U JP7373986 U JP 7373986U JP S62184737 U JPS62184737 U JP S62184737U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor material
- etching
- etching solution
- cup
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986073739U JPH0451474Y2 (US20090163788A1-20090625-C00002.png) | 1986-05-15 | 1986-05-15 | |
| US06/921,395 US4759817A (en) | 1986-05-15 | 1986-10-22 | Apparatus for etching semiconductor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986073739U JPH0451474Y2 (US20090163788A1-20090625-C00002.png) | 1986-05-15 | 1986-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62184737U true JPS62184737U (US20090163788A1-20090625-C00002.png) | 1987-11-24 |
| JPH0451474Y2 JPH0451474Y2 (US20090163788A1-20090625-C00002.png) | 1992-12-03 |
Family
ID=13526909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986073739U Expired JPH0451474Y2 (US20090163788A1-20090625-C00002.png) | 1986-05-15 | 1986-05-15 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4759817A (US20090163788A1-20090625-C00002.png) |
| JP (1) | JPH0451474Y2 (US20090163788A1-20090625-C00002.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120708A (ja) * | 2004-10-19 | 2006-05-11 | Tokyo Electron Ltd | 処理方法および処理装置 |
| JP2010153887A (ja) * | 2010-02-05 | 2010-07-08 | Tokyo Electron Ltd | 処理装置 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3402644B2 (ja) * | 1993-01-29 | 2003-05-06 | キヤノン株式会社 | 半導体装置の製造方法 |
| DE19509313A1 (de) * | 1995-03-15 | 1996-09-19 | Schmid Gmbh & Co Geb | Verfahren und Vorrichtung zum Behandeln von plattenförmigen Gegenständen, insbesondere Leiterplatten |
| TW512131B (en) * | 2000-06-08 | 2002-12-01 | Mosel Vitelic Inc | Apparatus and method for controlling boiling conditions of hot phosphoric acid solution with pressure adjustment |
| JP2004277238A (ja) * | 2003-03-17 | 2004-10-07 | Seiko Epson Corp | 連続処理装置および連続処理方法 |
| US10501854B2 (en) | 2015-07-06 | 2019-12-10 | James Weifu Lee | Localized excess protons and methods of making and using same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433673A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Automatic etching unit for semiconductor composite |
| JPS6331390U (US20090163788A1-20090625-C00002.png) * | 1986-08-16 | 1988-02-29 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3953265A (en) * | 1975-04-28 | 1976-04-27 | International Business Machines Corporation | Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers |
| JPS5336473A (en) * | 1976-09-17 | 1978-04-04 | Hitachi Ltd | Deciding device for selective etching completion |
| JPS5562169A (en) * | 1978-11-01 | 1980-05-10 | Toshiba Corp | Ion-etching method |
| US4338157A (en) * | 1979-10-12 | 1982-07-06 | Sigma Corporation | Method for forming electrical connecting lines by monitoring the etch rate during wet etching |
| US4358338A (en) * | 1980-05-16 | 1982-11-09 | Varian Associates, Inc. | End point detection method for physical etching process |
| US4339297A (en) * | 1981-04-14 | 1982-07-13 | Seiichiro Aigo | Apparatus for etching of oxide film on semiconductor wafer |
| JPS60114579A (ja) * | 1983-11-25 | 1985-06-21 | Hitachi Ltd | エッチング液の制御方法 |
-
1986
- 1986-05-15 JP JP1986073739U patent/JPH0451474Y2/ja not_active Expired
- 1986-10-22 US US06/921,395 patent/US4759817A/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433673A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Automatic etching unit for semiconductor composite |
| JPS6331390U (US20090163788A1-20090625-C00002.png) * | 1986-08-16 | 1988-02-29 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120708A (ja) * | 2004-10-19 | 2006-05-11 | Tokyo Electron Ltd | 処理方法および処理装置 |
| JP2010153887A (ja) * | 2010-02-05 | 2010-07-08 | Tokyo Electron Ltd | 処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451474Y2 (US20090163788A1-20090625-C00002.png) | 1992-12-03 |
| US4759817A (en) | 1988-07-26 |
