JPS62181494A - Manufacture of thick film integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a thick film integrated circuit, and more particularly to a method for manufacturing a thick film integrated circuit using a thick film screen for solder printing.

(Prior art) Figures 3 (,) to (C) are process cross-sectional views showing a conventional thick film integrated circuit manufacturing method, and Figure 4 is a perspective plan view of the mask shown in Figure 3 (,). It is.

In FIGS. 3(a) and 4, 20 is a mask for solder screen printing, which has a large window 21 and a small window 22 corresponding to the size of the electrode 9.
7. The position of 22 is the thick film substrate 23 shown in FIG. 3(b).
The electrode formation planned site 21a.

22a. Next, as shown in FIG. 3(b), the solder screen printing mask 2θ and the thick film substrate 23 are overlapped by a positioning means (not shown), and a solder <-st is printed by a known screen printing method.
As shown in Figure (c), the solder paste is transferred to a predetermined portion of the thick film substrate 23, forming electrodes 24a+24b.

Control of the amount of solder between the electrode 24a with a large amount of solder and the electrode 24b with a small amount of solder, Mask 2 for solder screen printing
By adjusting the thickness of θ and the dimensions of the windows 21 and 22, an appropriate amount of solder can be supplied to the mounted component electrodes.

(Problem to be solved by the invention) However, with the above manufacturing method, as the number of mounted components increases, there is a large difference in component volume and electrode shape when chip components and other molded components are mounted on the same substrate. However, there was a problem in that it was not possible to control the appropriate amount of solder for both. In particular, it is inappropriate to vary the amount depending on the height of the bang electrode.

The present invention improves the reliability of solder connections by printing and supplying an appropriate amount of solder when mounting components such as chip components and molded components with greatly different component volumes and electrode shapes on the same board. The purpose is to improve.

(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention aims to improve the performance of thick film integrated circuit boards. In electrode formation, when supplying very different amounts of solder onto the same substrate, in the first embodiment, a first solder IJ-printing mask is used to apply a small amount of solder onto the main surface of the substrate for comparison with a bang electrode. A gunzo electrode with a large amount of solder is formed, and a second hang screen printing mask having a large window is stacked on top of the first hang screen printing mask and printed again to form a solder electrode on the bump electrode. Solder is added to form a bang electrode with an even larger amount of solder.

Further, in the second embodiment, a bump electrode with a minute amount of solder is formed on the main surface of the substrate using a first solder screen printing mask, and then a recess is formed to the extent that it does not come into contact with the bump electrode with a minute amount of solder. A bang electrode with a large amount of solder is formed on the other surface portion of the main surface using a third solder screen printing mask having a third solder screen printing mask.

(Function) According to the present invention, as described above, printing is performed in parts using a plurality of screen IJs, and the screen has a half-etched structure depression that prevents etching from entering the first printing part. Since this is used, it is possible to supply an appropriate amount of solder corresponding to the number of parts. Therefore, the above-mentioned problem can be eliminated.

(Example) Hereinafter, the present invention will be described in detail based on an example with reference to the drawings. FIGS. 1(a) to 1(e) are process cross-sectional views of a method for manufacturing a thick film substrate integrated circuit, explaining a first embodiment of the present invention.

First, as shown in FIG. 1(a), 20 is a first solder screen printing mask, which has two large windows and a small bang electrode that supply a large amount of.../da for the large gunzo electrode. It has small windows 22 for supplying a minute amount of solder, and the positions of these windows 21 and 22 are as shown in FIG. 2
This corresponds to the electrode formation sites 21a and 22a of No. 3.

Next, as shown in FIG. 1(b), after the first solder screen printing mask 20 and the thick film substrate 23 are superimposed on each other by positioning means, a bump electrode material such as a solder paste is used by a known screen printing method. print.

Next, as shown in FIG. 1(c), a second solder screen printing mask 25 having a large window 21' for supplying a large amount of solder for a large panda electrode is prepared. this window 2
The size and formation position of mask 1' are the same as those of the first mask 2θ.

Next, as shown in FIG. 1(d), a second solder screen is placed on the first solder screen printing mask so as to cover the small window 22 and to match the position of the large window 21' with the large window 2. After stacking the two solder screen printing masks and printing the solder paste again, solder is added onto the electrodes formed by the first mask as shown in Figure 2(e), supplying a large amount of solder. An electrode 24a for supplying a small amount of solder and an electrode 24b for supplying a small amount of solder are formed.

Next, a second embodiment will be described using process cross-sectional views shown in FIGS. 2(f) to 2(k).

First, as shown in FIG. 2(f), 30 is a first solder screen printing mask (for example, about 50 μm in thickness), which has a small window 22 that supplies at least a minute amount of solder for a small bang electrode. Oh, this window 22 is in the first position.
Electrode formation site 22 of thick film substrate 23 shown in Figure (g)
It corresponds to a.

Next, as shown in FIG. 2(g), after the first solder screen printing mask 30 and the thick film substrate 23 are overlaid by alignment means, solder paste is printed by a known screen printing method. As shown in FIG. 2(h), the solder paste is transferred to a predetermined portion of the thick film substrate 23, and an electrode 24b with a minute amount of solder is formed.

Next, as shown in FIG. 2 (1), a large window 21 that supplies a large amount of solder for a large bang electrode, and a thick film substrate 2
A third solder screen printing mask 35 (for example, about 150 μm to 200 μm thick) is prepared, which has a recess 26 whose lower surface side is cut to such an extent that it does not contact the electrode 24b formed in the third solder screen printing mask 35 . The respective positions of the large window 2 and the depression 26 correspond to the electrode formation site 21a and the electrode formation site 24b of the thick film substrate 23 shown in FIG. 2(j).

Next, as shown in U), after the third solder screen printing mask 35 and the thick film substrate 23 are overlapped by the alignment means, solder paste is printed, as shown in FIG. 2(k).
As shown in FIG. 2, the solder paste is transferred to a predetermined portion of the thick film substrate 23 to form an electrode 24a with a large amount of solder.

(Effects of the Invention) As explained in detail above, according to the present invention, as chipping progresses, when chip components and other molded components are mounted on the same thick film substrate, the appropriate amount of solder for the electrodes will differ greatly. Also, a plurality of printing masks are used, the second screen mask is stacked on top of the first screen mask, and the printing is performed separately, and the third screen mask is used to remove bumps with a small amount of solder formed by the first screen mask. By using a screen having a half-etched recess that does not come into contact with the printed electrode portion, it is possible to supply an appropriate amount of solder to each individual component.

Therefore, the reliability of solder connection can be improved.

[Brief explanation of drawings]

1(a) to 1(e) are process cross-sectional views of a method for manufacturing a thick film integrated circuit explaining the first embodiment of the present invention, and FIG. 2(f)
-(k) are process cross-sectional views of a method for manufacturing a thick film integrated circuit explaining a second embodiment of the present invention, and FIGS. 3(a) to (c) show a conventional method for manufacturing a thick film integrated circuit. 4 is a plan perspective view of the mask shown in FIG. 3 (,). 20... First solder screen printing mask, 2I.
...Large window, 21'...Large window, 21a...Electrode formation planned site, 22...Small window, 22a...Electrode formation planned site, 23...Thick film substrate, 24a...Large quantity Electrode with a small amount of solder, 24b... Electrode with a small amount of solder, 25
...Mask for second solder screen printing, 26...Indentation, 30...Mask for first solder screen printing, J
, 5...Third solder screen printing mask. Patent applicant: Oki Electric Industry Co., Ltd., grab ＼, t51'/I turn 1° to IR, Ji #60 Baku Figure 1 throat, bu φ also clear false 2152 X Insert step 1.
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Claims (2)

[Claims] (1) A method for manufacturing a thick film integrated circuit in which bump electrodes with different amounts of solder are formed on a thick film integrated circuit board, including: a) having a small window for supplying a small amount of solder and a large window for supplying a large amount of solder; a step of preparing a first solder screen printing mask; b aligning the first solder screen printing mask with a portion of the thick film substrate where bump electrodes are to be formed; c applying the solder paste to the above by screen printing method. a step of transferring to a thick film substrate; d) a second layer having a large window to supply a large amount of bump electrodes;
a step of preparing a solder screen printing mask; e. aligning a large window of the first solder screen printing mask with a large window of the second solder screen printing mask; A method for manufacturing a thick film substrate integrated circuit, comprising the step of transferring paste again to the thick film substrate to form electrodes for supplying a large amount of solder and electrodes for supplying a minute amount of solder. (2) In a method for manufacturing a thick film substrate/integrated circuit in which bump electrodes with different amounts of solder are formed on a thick film integrated circuit board, a first solder screen printing mask having a small window for supplying at least a minute amount of solder is provided. (b) Aligning the first solder screen printing mask with a portion of the thick film substrate where bump electrodes are to be formed; (c) Transferring solder paste to the thick film substrate by a screen printing method to form minute solder. d. A third solder screen printing mask having a large window for supplying a large amount of solder and a recess to the extent that the electrode with a minute amount of solder formed in step (c) is not formed. a step of preparing; e a step of aligning the third solder screen printing mask with a portion of the thick film substrate where bump electrodes are to be formed; f transferring the solder paste to the thick film substrate by a screen printing method; 1. A method of manufacturing a thick film substrate integrated circuit, comprising the step of forming electrodes with a large amount of solder.