JP2757349B2 - Hybrid integrated circuit substrate and method of manufacturing hybrid integrated circuit device using the same - Google Patents

Abstract

PURPOSE:To mount an electronic component on a board with high accuracy by a method wherein a hole for position recognition use is made in a part near a part where the electronic component is to be mounted in a ceramic green sheet and, after that, a conductor layer is formed. CONSTITUTION:A part 2 on which an electronic component is to be mounted and on which a bare chip 5 is mounted is formed of a conductor on a green sheet of a board 1 composed of an insulating ceramics or the like; holes 3, 3 for position recognition use are made near it by referring to the reference face of the board 1, e.g. its edge or its cut wire. Then, the green sheet is baked. When the bare chip 5 is mounted, the holes 3, 3 for position recognition use are pattern-recognized. The bare chip 5 is mounted by referring to them and is wire-bonded. Thereby, the electronic component can be mounted on the board with high accuracy.

Description

Description: TECHNICAL FIELD The present invention relates to a substrate for a hybrid integrated circuit configured by mounting an electronic component such as a bare chip on a circuit board, and a hybrid integrated circuit device using the same. And a method for producing the same.

[Prior Art] A conventional ceramic substrate for a hybrid integrated circuit is generally manufactured by the following method. First, for example, by a method called a doctor blade method, a ceramic green sheet (hereinafter, simply referred to as a “green sheet”)
Is formed, and this is punched into a plate having a size of a plurality of circuit boards. At this time, slits are formed in the green sheet so that individual circuit boards having a predetermined size can be separated from the fired green sheet in consideration of shrinkage of the green sheet in a subsequent firing step. The green sheet is fired in this state. The result is a ceramic substrate for a hybrid integrated circuit (hereinafter simply referred to as a “substrate”).

In the hybrid integrated circuit device, first, a conductor pattern is formed on the substrate thus formed. At the same time, as shown in FIG. 3 (a), the markers 4, 4 are formed at predetermined positions on the substrate 1 with the same conductor.

Further, as shown in FIG. 3 (b), after an adhesive is applied to the conductor pattern by pin transfer or the like, a circuit which is not protected by a plastic or ceramic or the like is exposed. An integrated circuit, a so-called bare chip 5, is mounted on the conductor pattern of the substrate 1 by an automatic mounting machine. When the bare chip 5 is mounted, an accurate position of the conductive pattern is determined in order to electrically connect the conductor pattern formed on the substrate 1 and the terminal electrodes of the bare chip 5 to be mounted on the substrate 1. There is a need. Therefore, conventionally, the above-described markers 4, 4 formed of conductors are used.
Is recognized, and the bare chip 5
So that the mounting position of the same bare chip 5 is corrected so that the mounting position is accurately placed on a predetermined conductor pattern on the substrate 1.
The automatic mounting machine mounts the bare chip 5.

[Problems to be Solved by the Invention] Some bare chips mounted on a hybrid integrated circuit perform positioning from a predetermined reference surface of a substrate, such as a magnetic sensor or a rotary encoder incorporated in a floppy disk drive. Without it, some will not work functionally. For example, a rotary encoder detects the number of rotations of a rotating sample such as a turntable, but if the position is not determined with reference to the end surface of the substrate, the mounting position in the apparatus changes, and the relative position with respect to the sample is changed. Due to the difference, the rotation speed cannot be measured accurately.

However, when the mounting position of the bare chip 5 is determined by the markers 4 and 4 printed on the substrate 1 with conductors as in the conventional case, the error of the position of the bare chip 5 on the substrate 1 increases. This is for the following reasons. That is,
The printing of the markers 4 and 4 on the substrate 1 is performed by a screen printing method. In addition to the printing error of the markers 4 and 4 at this time, the error of the absolute position of the bare chip 5 on the substrate 1 is This is because a mounting error when mounting the bare chip 5 on the substrate with reference to the markers 4 and 4 is added. Usually, the printing error and the mounting error are each ± 20.
It is about 0 μm to 300 μm, and the position error of the bare chip 5 from the end face of the substrate 1 is generally ± 600 μm. If such an error in the mounting position occurs, a bare chip such as the rotary encoder described above causes a functional problem.

Therefore, the present invention solves the above problems, and when mounting an electronic component on a substrate, a substrate that can easily and highly accurately position the absolute position of the electronic component on the substrate, and a hybrid integration using the substrate. An object of the present invention is to provide a method for manufacturing a circuit.

Means for Solving the Problems In order to achieve the above object, the gist of the means adopted in the present invention is that a substrate for a hybrid integrated circuit is formed by forming a conductor layer on a ceramic substrate obtained by firing a ceramic green sheet. A hole for position recognition is provided in the circuit forming area of the ceramic green sheet in the vicinity of the electronic component mounting portion, and then fired to form a ceramic substrate, and thereafter a conductive layer is formed. It is a substrate.

Further, a method for manufacturing a hybrid integrated circuit by forming a circuit pattern on a ceramic substrate formed by punching or cutting a ceramic green sheet into a predetermined plate shape and firing the ceramic green sheet, and further mounting electronic components, When the green sheet is punched or cut into a predetermined plate shape, a hole for position recognition is opened near the electronic component mounting portion in the circuit forming area of the ceramic green sheet, and the ceramic green sheet is fired to form a ceramic substrate. When mounting electronic components on a substrate for a hybrid integrated circuit in which a circuit pattern is formed on the ceramic substrate, a method for manufacturing a hybrid integrated circuit device for recognizing the position confirmation holes and correcting the position of the electronic components. is there.

[Operation] In the case of a collective substrate, the hole for position recognition is formed in the same mold at the same time as the slit for dividing the substrate, and then fired. At this time, the green sheet is about 40μm per 1cm
Shrink at the rate of The effect of this shrinkage on the positional accuracy of the holes is much smaller than the printing error (about ± 200 μm to 300 μm) when a marker is screen-printed with a conductor on a substrate. Therefore, when the hole is recognized and the mounting position of the bare chip is corrected and mounted on the substrate, the absolute position accuracy on the substrate is improved as compared with the conventional method.

A general electronic component is required to have an accurate positional relationship with the conductor layer in order to be electrically connected to the conductor layer. However, in the above-described bare chip, the electrical connection is performed using wire bonding. In this connection method, electrical connection is performed while adjusting the positional relationship between the terminal electrode of the bare chip and the terminal electrode of the bare chip of the conductive layer one by one, so that the error in the positional relationship between the conductive layer and the bare chip is reduced. It is absorbed by this adjustment. Therefore, it is more important to make the position of the bare chip accurate from the end face of the substrate than to make the positional relationship between the conductor layer and the bare chip accurate.

[Example] Hereinafter, an example of the present invention will be described in detail.

FIG. 1 (a) shows a substrate for a hybrid integrated circuit according to the present invention. In this method, an electronic component mounting portion 2 on which a bare chip 5 is to be mounted by a conductor is formed on a substrate 1 made of an insulating ceramic or the like, and a reference surface of the substrate, for example, an end surface or a cutting line, is formed near the portion. The holes 3, 3 for position recognition are opened. As shown in FIGS. 1 (b) and 2, a bare chip 5 is mounted on the mounting portion 2 on the substrate 1, and at this time, the holes 3 and 3 for position recognition are formed. The pattern is recognized, the mounting position of the bare chip 5 is corrected based on the pattern recognition, and the corrected position is mounted on the planned mounting section 2. Then, as shown in FIG. 2, the bare chip 5 is wire-bonded.

Next, a specific example of the present invention will be described.
At the same time as punching a green sheet so as to have a size of 60 mm, a hole of 0.3 mmφ for position recognition is opened in two predetermined places of the green sheet, and then the green sheet is fired to obtain a hole 3 for position recognition. 3 were formed. A conductor pattern was formed on the substrate 1 by a screen printing method. A part of this conductor pattern is formed as a portion 2 for mounting a bare chip. Simultaneously with the formation of the conductor pattern, markers 4 and 4 for position recognition (see FIG. 3) were formed of the same conductive material. This marker was installed at a position different from the holes 3 for position recognition. However, holes 3, 3 for the conductor pattern, the marker and the position recognition
Are formed so that the relative positional relationship with the above is substantially the same.

A plurality of the substrates 1 were prepared, and a bare chip 5 was mounted thereon. In this case, half of the patterns are used to correct the mounting position of the bare chip 5 based on the pattern recognition of the holes 3 for position recognition, and the other half are used for the position recognition formed of conductors. By recognizing the pattern of the mark, the mounting position of the bare chip 5 was corrected based on the position of the marker.

In this case, the error of the absolute position of the bare chip 5 on the reference 1 was measured and compared. As a result, in the latter substrate 1 on which the conductor marker was pattern-recognized and the bare chip 5 was mounted, the bare chip based on the end face of the substrate 1 was used. 5 had a maximum mounting position accuracy of ± 600 μm. On the other hand, in the latter substrate 1 on which the bare chips 5 are mounted by pattern recognition of the holes 3, 3 for position recognition, the bare chips 5 with respect to the end face of the substrate 1
The mounting position accuracy was kept at a maximum of ± 200 μm.

In the present embodiment, round holes are provided as the holes 3 and 3 for position recognition, but any shape such as a square hole, a triangular hole, or a cross hole may be used as long as it can recognize a pattern. Absent.

[Effects of the Invention] As described above, the method for manufacturing a substrate for a hybrid integrated circuit and the method of manufacturing a hybrid integrated circuit device of the present invention has an effect that an electronic component can be mounted on a substrate with high accuracy.

[Brief description of the drawings]

1 (a) and 1 (b) are plan views before and after mounting a bare chip on a substrate for a hybrid integrated circuit according to an embodiment of the present invention, and FIG. 2 is a plan view showing a bare chip on a substrate for a hybrid integrated circuit. FIG. 3 (a) is a perspective view of a state in which
(B) is a plan view before and after mounting a bare chip on a hybrid integrated circuit substrate as a conventional example. DESCRIPTION OF SYMBOLS 1 ... board | substrate, 2 ... electronic component mounting part, 3 ... hole for position recognition, 5 ... bare chip

Claims (2)

(57) [Claims] 1. A substrate for a hybrid integrated circuit comprising a ceramic substrate on which a ceramic green sheet is fired and a conductor layer formed thereon, wherein a hole for confirming a position is formed in a circuit forming region of the ceramic green sheet in the vicinity of an electronic component mounting portion. Wherein a substrate is formed and fired to form a ceramic substrate, and thereafter a conductor layer is formed. 2. A method of manufacturing a hybrid integrated circuit by forming a circuit pattern on a ceramic substrate formed by punching or cutting a ceramic green sheet into a predetermined plate shape and firing the same, and further mounting electronic components. In punching out or cutting out a ceramic green sheet into a predetermined plate shape, a hole for position recognition is made in the vicinity of an electronic component mounting portion of a circuit forming area of the ceramic green sheet,
When the ceramic green sheet is fired to form a ceramic substrate, and the electronic component is mounted on a substrate for a hybrid integrated circuit in which a circuit pattern is formed on the ceramic substrate, the electronic component is recognized by recognizing the position confirmation hole. A method for manufacturing a hybrid integrated circuit device, comprising: correcting a position of a component.