JPS62180859A - Film stripping apparatus with film end detector - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (1) Purpose of the Invention [Field of Industrial Application] The present invention relates to a thin film peeling technique, and in particular:
The present invention relates to a technique that is effective when applied to a technique for peeling off a protective film (thin film) attached to protect the surface of a substrate.

[Prior Art] Printed wiring boards used in electronic devices such as computers have a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by the following wJ manufacturing process. First, a laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) for protecting it is laminated by thermocompression on a conductive layer provided on an insulating substrate.

Thereafter, a wiring pattern film is placed on top of the other, and the photosensitive resin layer is exposed for a predetermined period of time through this wiring pattern film and the translucent resin film. After peeling off the transparent resin film, the exposed photosensitive resin layer is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is further removed to form a printed wiring board having a predetermined wiring pattern.

[The problem that the invention aims to solve] In the manufacturing process of the aforementioned printed wiring board.

When developing the photosensitive resin layer after exposure, a step of peeling off the light-transmitting resin film is required. Peeling off this translucent resin film relies on manual labor, and since the film is thin, it requires finger dexterity and great skill to prevent damage or destruction due to uneven peeling stress. .

For this reason, the peeling time of the light-transmitting resin film increases, resulting in a problem that the working time in the printed wiring board manufacturing process becomes longer.

Therefore, an automatic thin film peeling apparatus has been developed that automatically performs the thin film peeling process using a machine.

This automatic thin film peeling device uses a roller, brush, needle, etc. to lift the edge of a thin film that has not been pasted onto a substrate, then lifts up the floating part and peels it off, automatically releasing the thin film to the outside. Make sure to drain it properly.

However, in the automatic thin film peeling apparatus described above.

Since the edge of the thin film is often attached at an uneven distance from the edge of the substrate, a roller,
There is a problem in that it is difficult to lift only a predetermined uniform width at the edge of the thin film by applying force with a brush, needle, etc.

Additionally, since the thin substrate is warped or curved, there is a problem in that it is difficult to align the means for floating the thin film on the substrate.

The above-mentioned and other problems and novel features to be solved by the present invention will become clear from the description of this specification and the accompanying drawings.

(2) Structure of the Invention [Means for Solving Problems] A brief overview of one typical invention disclosed in this application is as follows.

That is, a thin film peeling device that peels off and discharges a thin film attached to a substrate, comprising a thin film edge detection means for detecting an edge of the thin film while moving the substrate; The present invention is characterized in that a thin film floating means is provided which applies energy to a portion within a predetermined distance from the thin film end detected by the portion detection means to float a part of the thin film end.

Further, as the thin film end detecting means, a thin film end detecting means for detecting a change in the substrate capacitance or electric resistance value while moving the substrate is provided.

Further, a substrate moving means is provided for reciprocating the substrate and passing the set position of the thin film edge detecting means twice, or, while moving the substrate, the thin film edge marked by OJ is detected during the second pass. A thin film end detecting means is provided.

[Function] The present invention detects the edge of '4rl:j' with the thin film edge detection means while transporting (moving) the substrate, and detects the edge of the substrate within a predetermined distance from the detected thin film edge. Apply energy to lift part of the thin film edge.

The edge of the thin film on the substrate is reliably detected by discharging it with a thin film peeling conveyance means while peeling from the floating part, and the position of the detected edge of the thin film and the means for floating the edge. Matching can be done accurately and easily.

[Example] Hereinafter, an example in which the present invention is applied to a protective film removing apparatus for a printed wiring board will be described with reference to the drawings.

It should be noted that in all the examples, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 1 is a side view showing a schematic structure of a protective film and an In device for a printed wiring board according to an embodiment of the present invention, and FIG. 2 is an enlarged side view showing the essential parts of FIG.

As shown in FIGS. 1 and 2, the transport mechanism for the printed wiring board in the protective film reproducing apparatus of this embodiment is mainly composed of a transport drive roller 2 that transports the printed wiring J↓ board 1klJI2. ing.

The transport path A-A in this transport mechanism includes a protrusion pressing mechanism 3, a fluid spraying mechanism 4. Peeling heel angle setting plate (peeling auxiliary plate)
5 and a thin film transport mechanism 6 are provided.

As shown in FIG. 2, the printed wiring board 1 has a conductive layer IB made of copper or the like formed on both surfaces (or one surface) of an insulating substrate IA. On the conductive layer ID of this printed wiring board 1, a laminate consisting of a photosensitive resin layer IC and a translucent resin film (preservative S film) ID is placed on a thermocompression bonded laminate 1.
~ has been.

The photosensitive resin layer 1C is in a state after a predetermined wiring pattern film is overlaid and exposed.

The printed wiring board 1 is configured to be transported by a transport drive roller 2 in the direction of arrow A shown in FIG.

The protrusion pressing mechanism 3 is configured as shown in FIG. 3 (configuration diagram), FIG. 4 (diffusion exploded diagram), and FIG. 5 (partial sectional view).

In this protrusion suppressing mechanism 3, a plurality of protrusion suppressing members 3A are provided on both sides of the printed wiring board 1 in a direction intersecting the transport direction (width direction of the printed wiring board 1). As shown in FIG. 5, the protrusion suppressing member 3A has a needle-like shape, and its tip is configured to suppress the end of the laminate of the photosensitive resin layer IC and the transparent resin film ID. ing. The protrusion suppressing member 3A prevents the protrusion suppressing member 3A from digging into the interface between the conductive layer IB and the photosensitive resin layer IC when the end of the laminate is pressed, and prevents the light-transmitting resin film tn from digging into the interface between the conductive layer IB and the photosensitive resin layer IC. For example, 6 to float from the IC.
Constructed with a tip angle of 0[degree] culm. The respective protrusion suppressing members 3A provided at opposing positions are supported by separate protrusion pressing member support rotation shafts 3C via holders 3B. Although the holder 3B is not numbered, it is attached so that it can slide along the through hole of the protrusion suppressing member support rotating shaft 3C.

Elastic members 3D and 3E having the same or different elasticity are provided between the protrusion suppressing member 3A and the holder 3B and between the holder 3B and the protrusion suppressing member support rotation shaft 3C, respectively. Elastic members 3D and 3E.

It is attached so as to act in the direction of arrow B, that is, in the direction approaching the printed wiring board 1. Therefore, the position of the tip of the protrusion suppressing member 3A is configured to be changeable with respect to the protrusion suppressing member support rotation axis 3C by a predetermined pressure in the direction of arrow B.

One end (or both ends) of the protrusion suppressing member support rotating shaft 3C is
As shown in FIGS. 3 and 4, it is rotatably connected to one end of the movable arm member 3G through a guide elongated hole 3f of the guide member 3F. Although not shown, the guide member 3F is fixed to the main body of the apparatus by means of attachment means such as screws. The elongated guide hole 3f is connected to the printed wiring base Fj, 1
In the direction of approaching to or from the front corner (direction of arrow C),
It is configured to guide the protrusion suppressing member support rotation ll1I113C, that is, the protrusion suppressing member 3A.

The other end of each of the movable arm members 3G is connected to a rotating shaft 3h.
The rotary arm member 3H is rotatably attached to opposite ends of the rotary arm member 3H, which is rotatable in the direction indicated by the arrow. Rotating arm member 3)
[ is configured to move the respective movable arm 11 members 3G in different arrow C directions.

A guide member 3F, a moving arm member 3G, and a rotating arm member 3) that guide the protrusion suppressing member support rotating shaft 3C.
-1 is a protrusion suppressing mechanism 3 that moves the respective protrusion suppressing members 3A provided on both sides of the printed wiring board l toward or away from each other by the operation of the shirt l-3J, which is a double-sided driving source, in the direction of arrow E. It constitutes a link mechanism. The shaft 3J is connected to one end of the rotating arm member 3H via a connecting arm member 3I. Each member constituting the link mechanism is made of a material that is difficult to deform under specific external force, such as iron, aluminum alloy, or hard resin.

As a driving source for both sides, pneumatic cylinder, , +t! Pressure cylinder, 'I'If magnetic solenoid. Further, the shaft 3J is not limited to one end of the rotating arm member 311, but may be connected to one end of one of the movable arm members 3G via the connecting arm member 3I.

By connecting the protrusion suppressing member 3A and the double-sided drive source using such a link mechanism, the surface of the printed wiring board 1 of each protrusion suppressing member 3A provided on both sides of the printed wiring board l is The action of bringing the material into contact with or bringing it to the front corner (movement in the direction of arrow C) can be performed using a double-sided drive source.

Also, a guide member 3F that constitutes a link mechanism.

The movable arm member 3G and the rotating arm member 314 are substantially rigid bodies, and their respective operating ranges are limited to the guide elongated hole 3f and the rotating shaft 3.
h, it is possible to precisely control the operating amount and operating time of each protrusion suppressing portion F13A on both surfaces of the printed wiring board l.

In addition, the link mechanism is composed of a rack and pinion mechanism or a gear mechanism, and has fewer parts than a connecting mechanism, and each member has a simple shape. The configuration of the connecting mechanism connecting these can be mQl-.

In front of each with the movable arm member 3G interposed therebetween.

At one end (or both ends) of the protrusion suppressing member support rotating shaft 3C, a protrusion suppressing member rotating arm member 3K is provided, one end of each of which is fixed. An elongated hole 3k is provided at the other end of each of the protrusion suppressing member rotary arm members 3.

A shaft portion 3m of a connecting arm member 3M that connects to the shaft 3L of the double-sided drive source is passed through. [Snao] The protrusion suppressing member rotary arm member 3 is connected via the connecting arm member 3M to a shirt with a double-sided drive source! -3L. As the double-sided driving source, a link mechanism similar to the above-mentioned link mechanism may be used.

The protrusion suppressing member rotation arm member 3K and the connecting arm member 3M are moved by the movement of the shaft 3L in the direction of arrow F.
The protrusion suppressing member rotating arm member 3K is rotated in the direction of arrow G, and the protrusion suppressing member support rotating shaft 3C is rotated in the direction of the arrow, thereby configuring the protrusion pressing member suppressing mechanism of the protrusion pressing mechanism 3 that presses the end of the laminate. It is supposed to be done.

The protrusion suppressing member suppressing mechanism and mechanism configured in this manner is as follows.

Similar to the link mechanism for moving the protrusion suppressing members 3A close to each other or at the front corners, the protrusion pressing members 3A on both sides of the printer 1 to the wiring board 1 can be operated by a dual-purpose driving source. ,, and the number ←, the amount of operation and operation time can be accurately controlled. .

Furthermore, the structure of the protrusion pressing member suppressing mechanism and the mechanism connecting the protrusion suppressing member 3A and the double-sided drive source can be simplified.

In this way, the protrusion pressing mechanism 3 mainly uses the protrusion suppressing member 3A.
, a link machine groove that brings the protrusion suppressing member 3Δ close to or apart from the print 1 and the wiring board 1, and a protrusion suppressing member suppressing mechanism that suppresses the end of the laminate with the protrusion suppressing member 3Δ. or.

Next, regarding the operation of the protrusion suppression mechanism 3, FIGS.
This will be briefly explained using the drawings and FIGS. 6 and 7 (cross-sectional views of main parts of the printed wiring board).

First, as will be described in detail later, the tip of the thin film stuck on the print 1 - wiring board 1 is detected by a thin film edge detection device.

In this way, the photosensitive resin F! of the printed wiring board 1! J
By suppressing the end of the laminate consisting of the IC and the translucent resin film 7c with the thin film flotation device 3A for thin film peeling of the protrusion suppressing mechanism 3, one part of the translucent resin film ID is removed from the photosensitive resin 5ic. It is possible to make the parts float and create a gap at the interface between them. In this gap, the photosensitive resin layer IC is made of a softer material than the transparent resin film ID.

Thin film thickness for thin film peeling 1 - The photosensitive resin layer IC is plastically deformed in response to the oppression of the device 1ff3A, but the contact force with the photosensitive resin layer 1C of the transparent resin film ID decreases before the transparent resin film ID is plastically deformed. arise because of

Furthermore, the end portion of the light-transmitting resin film ID can be floated by a thin film floating device 3A for thin film peeling, which has a simple needle-like configuration.

Further, since the ff film peeling device 3A is provided on the conveyance path of the printed wiring board 1, the end portion of the translucent resin film ID can be automatically lifted.

Note that the floating light-transmitting resin film ID will not be bonded to the photosensitive resin layer IC again unless heat is applied to loosen it.

In addition, in consideration of the fact that the laminate is laminated by thermocompression bonding with distortion on the printed wiring board 1, a plurality of thin films for thin film peeling' Although 3A and 3A are provided, the present invention is not limited to this. That is, if one end of the photosensitive resin layer IC and the transparent resin film ID are pressed and the latter can definitely float, one thin film floating device for thin film peeling is provided on each of both sides of the printed wiring board 1. 3A may be provided to constitute the protrusion suppression mechanism 3.

Further, although the protrusion suppressing member 3A is provided in the direction (width direction) intersecting the conveyance direction of the printed wiring board 1, in the present invention, the projection suppressing member 3A is laminated in the same direction as the conveyance direction of the printed wiring board 1. The protrusion suppressing member 3A can also be provided near the end of the body or near the corner. In this case, the nozzle 4A of the fluid spray mechanism 4 is provided near the protrusion pressing member 3A.

The floating film edge detection means 1 is, for example, an electrical thin film edge detection device that detects the edge of the thin film by detecting the capacitance or electrical resistance of the substrate 1.

FIG. 8 is a perspective view showing the structure of one embodiment of the capacitive thin film edge detection device.

In FIG. 8, 20 is a capacitive thin film edge detection device (
This cover 20 is a cover for a thin film end detection sensor (hereinafter simply referred to as a thin film end detection sensor), and this cover 20 is attached to a support member 21 for adjusting the position of the thin film end detection sensor. The support member 21 for adjusting the position of the thin film end detection sensor is the thin film end detection sensor device π.
A thin film end detection sensor position adjustment screw 24 is attached to the support member 23 attached to the main body 22 and a thin film edge detection sensor position adjustment nut 2 is attached to the support member 23.
It is attached via 5. I'I? A thin film end detection sensor position fixing nut 26 is fitted into the thin film end detection sensor position adjustment screw retainer 24 (I). A T-shaped support member 29 made of an insulating material is rotatably provided on the cover 20 and supports the touch sensor 28 through one rotation #27.

The touch sensor 28 and the lead wire 30 are attached to this T-shaped support member 29 by a screw mechanism 31 so as to be electrically connected. The lead wire 30 is electrically connected to a capacitive thin film edge detector (not shown). Further, the T-shaped support member 29 is configured such that one end thereof is pressed by the electromagnetic suppression device 32A and rotates about the rotation shaft 27. A touch sensor return spring 29Δ for returning the touch sensor 28 attached to the r-shaped support member 29 to its original position is fixed to the cover 20 by a screw member.

Further, the T-shaped support member 29 is provided with a stopper 29B for limiting its inclination. Return springs 32B are provided at both ends of the movable member 32Δ of the electromagnetic pressing device 32. 3C is the protrusion suppression part cuticle holding rotation axis; 4B
is the supporting rotating shaft of the fluid spraying device. Next, the operation of the thin film edge detection sensor of this embodiment will be explained.

First, the electromagnetic suppression device 32 is deenergized (off) to release the movable member 32A from pressing against the T-shaped support member 29, and the touch sensor 28 is separated from the surface of the substrate.

Next, the substrate is moved in the transport direction until the tip of the protective film on the substrate passes the position of the touch sensor 1, and the movement is temporarily stopped at that position. In this state, the electromagnetic suppression device 32 is energized (turned on) and the movable member 32
Press the T-shaped support member 29 at A to bring the tip of the touch sensor 28 into contact with the surface of the protective film of the substrate l. In this state, the substrate 1 is moved in the backward direction (opposite to the transport direction), the leading edge of the protective film is detected, and the information is sent to a capacitive thin film edge detector.

At the same time as the tip of the protective film is detected, the conveyor's retreating operation is stopped and the pinch rows are pressed to fix the substrate l. In this state, at the same time as the substrate 1 is fixed, the entire tip of the touch sensor 28 is pressed by the electromagnetic pressing device I3.
2 is de-energized, the movable member 32A is released from being pressed against the T-shaped support member 29, and is buried from the surface of the protective film of L (band 1). The substrate 1 is pressed.

Note that a pneumatic cylinder, a hydraulic cylinder, or the like may be used instead of the electromagnetic suppression device 32.

Also, instead of the thin film edge detection sensor provided on the substrate l, the amount of reflected light and the reflected value of light can be used.

A means for optically detecting the color of the reflected object may also be used.

When using this optical detection means, in the present invention,
The end of the thin film on the substrate 1 passes through the set position of the optical sensor twice, and this is to accurately detect the end of the thin film in a stable state.

In other words, the edge of the thin film can be detected in the first time, but
If it is thin, the edge of the thin film becomes unstable and may not be detected. For this reason, the second time, that is, the thin film edge is detected again with the thin film edge stabilized,
Confirm that the first detection is correct.

, In this way, in the present invention, on the substrate 1 being transported,
The end of the thin film is detected by the thin film end detection means while moving, and energy is applied by the thin film flotation means to a portion from the detected thin film end to a predetermined distance on the inner side to remove a part of the thin film end. Since it is made to float, it is possible to reliably detect the edge of the thin film on the substrate 1 and accurately align the detected edge of the thin film with the thin film floating means. As a result, only the predetermined uniform width of the edge of the thin film on the substrate 1 can be
E It can be made to stand out clearly. Further, it is possible to prevent damage to the pattern formed of the photosensitive resin provided on the substrate 11.

□As shown in FIGS. 1 and 2, the fluid blowing mechanism 4 blows a fluid 1, for example, gas such as air, gas, or gas, or liquid such as water, to which pressure is applied from 1/4A. Let it come out 1
．． This fluid sprayer groove 4 is configured to spray fluid directly into the gap between the photosensitive resin layer IC of the printed wiring board 1 and the translucent resin film 1F]. Then, the fluid spraying mechanism 4 is configured to immediately spray the fluid into the gap portion.
The protrusion suppressing mechanism 3 is located close to the protrusion suppressing mechanism 3. The nozzle 4A of this fluid spraying mechanism 4 is configured so that its set angle can be varied in the direction of arrow J. That is, the fluid spraying mechanism 4 is configured such that the nozzle 4A is sometimes brought as close to the gap as possible during the fluid spraying, and the nozzle 4A is later retracted to a position where the printed wiring boards Fj, l do not come in contact with the fluid spraying. has been done.

In this way, the fluid is sprayed by the fluid spraying mechanism 4 into the gap between the photosensitive resin layer IC and the translucent resin film lzID created by the suppression of the protrusion suppressing member 3A. Fluid is blown between the resin layer LC and the translucent resin film ID, causing the photosensitive resin yf! It is possible to instantly and reliably attach the translucent resin film ID from the jIC to an angle of just 1°.

With the fluid spray mechanism 4! (The translucent resin film Ax 1 d on the front end side in the conveyance direction, which is J+1, is shown in Fig. 2 and 9.
As shown in the figure (perspective view of main part), it is attached to the peeling angle setting plate 5 by fluid pressure, and its peeling position and peeling angle O
is set. The translucent resin film 1d is indicated by a chain line in FIGS. 2 and 9. The profit angle of 0 is
This is the angle formed by the transparent resin film ID attached to the printed wiring board l and the transparent resin film 1d raised from that state, and is configured to be approximately a right angle.

The tip of the peeling angle setting plate 5 on the side of peeling chicks (separated position 11) is.

Avoid damaging or destroying the photosensitive resin layer 1C.

They are provided at such intervals that they do not rub against the transparent resin film ID attached to the printed wiring board l. The peeling angle setting plate 5 is configured to be movable so that its tip may come into close contact with the transparent resin film ID when the fluid is being sprayed, thereby preventing deterioration of the peeling effect due to the blow-through of the fluid.

Further, the tip of the peeling angle setting F1i5 has a circular arc shape with a small radius of curvature. For example, the radius of curvature is 3 m or less.

Furthermore, the peeling angle setting plate 5 has its tip portion closer to the printed wiring J & board 1 side than the thin film delivery mechanism 6, and the peeling angle setting plate 5 is peeled off over almost the entire length of the conveying path width of the printed wiring board l or the fluid spraying width. It is configured to have a predetermined length in the direction. That is, as shown by the arrow in FIG. 9 indicating the outflow direction of the fluid, the barb angle setting plate 5 prevents the fluid from blowing through to the back side as much as possible to enhance the peeling effect, and to prevent the peeled transparent The adhesion of the peeling angle setting plate 51\ of the photoresin film 1d can be improved.

Although not shown, the peeling angle setting plate 5 is attached to a predetermined position in the direction of fluid spraying from the nozzle 4A of the apparatus main body.

The peeling angle setting plate 5 configured in this manner can stabilize the peeling position and apply a uniform peeling force to the transparent resin film ID.

Therefore, the peeling angle setting plate 5 can prevent variations in the peeling position when peeling the translucent resin film ID, prevent bias in the reproducing force, and prevent damage or destruction of the photosensitive resin layer 10.

It should be noted that the harvesting angle 0 of the peeling angle setting plate 5 is configured to be variable within the range of an obtuse angle or a right angle depending on changes in conditions such as the material of the transparent resin film ID and the fluid pressure of the fluid spraying mechanism 4. It's okay. Also.

The peeling angle setting plate 5 may be configured to be movable so as to be compatible with printed wiring boards 1 of different sizes, photosensitive resin layer ICs and translucent resin films 10 of different thicknesses. good. This movement can be performed, for example, with a pneumatic cylinder, a hydraulic cylinder, or the like.

The transparent resin film 1d attached to the peeling angle setting plate 5 by the fluid spraying mechanism 4 is transferred to the cW film transporting mechanism (thin film transporting mechanism) as shown in FIGS. It is carried out while being peeled off by mechanism) 6.

゛ The thin film transport mechanism 6 mainly carries out
It consists of a two-part conveyor belt mechanism and a lower conveyor belt mechanism, which are provided on both sides of the conveyor belt.

The two-part conveyor belt 1-mechanism includes fixed conveyor bells I-GA, 6C, 6D, GE, as shown in detail in FIG.

6F and a movable conveyor belt 6B.

The fixed conveyor belt 6A has a roller 6 supported by a driven shaft I.
It is composed of a roller 6Ab supported by a drive shaft (2), and a belt 6a wound around the rollers 6Aa and 6Ab.

The movable conveyance bell 1-6B is composed of a roller 6Ba supported by a driven shaft (2), a roller 6Bb supported by an Il driving shaft (2), and a belt 6b wound around rollers 6Ba and 6I3b. The movable conveyor belt 6B is configured to rotate in the direction of the arrow as shown in FIG. 2 about the drive shaft IV. That is, the movable conveyor belt 6B is
! It is configured so that the transparent resin film ld subjected to IJ and I can be easily attached to the peeling angle setting plate 5, and can be conveyed while being held between the fixed conveyance belt 6A. In addition, fixed conveyor bell 1-6A
The clamping with the movable conveyance belt 6B is performed through a notch 5Δ provided in the peeling angle setting plate 5 shown in FIG. 1O. This notch 5A has a peeling angle of 2.

The fixed conveyance bell 1-6A and the movable conveyance bell 1-6B are configured to reach the transparent resin film 1.1 whose peeling position and ≠ sliding angle are set by the setting plate 5, and to sandwich it between them. has been done.

That is, the notch 5A is configured so that the transparent resin film 1d can be reliably held between the fixed conveyor belt 6A and the movable conveyor belt 6B.

The fixed conveyor belt 1-6C is composed of a roller 6Ca supported by a drive shaft II, a roller 6Cb supported by a driven shaft II, and a belt 6c wound around the rollers 6Ca and 6Cb.

The fixed conveyor belt 6D has a roller (
3Da, roller 6Db supported by driven shaft ■, driven shaft ■
The roller 6Dc is supported by a driven shaft V, a roller 6Dd is supported by a driven shaft V, a roller 6De is supported by a driven shaft V, and a belt 6d is wound around the rollers 6Da to 6De.

, the fixed conveyor belts 6C and 6D are the fixed conveyor belts 6
A and the movable conveyor belt 6B convey the translucent resin film 1d further in the discharge direction. As shown in FIG. 11 (cross-sectional view of main parts), the roller 6Dc of the fixed conveyance belt 6D conveys the translucent resin film 1 (( The roller 6De is provided so that the conveyance direction changes by a large angle when the conveyance direction changes.
The curvatures r and diameters of the sides that contact the transparent resin film 1d and 6d can be made approximately equal. Therefore, it is possible to prevent the translucent resin film 1d from being wrinkled during transportation, and to prevent troubles such as jamming.

Further, as shown in FIG. 12 (partial sectional view), the translucent resin film 1d is provided at predetermined intervals in the width direction of the translucent resin film 1d, which contacts one surface of the translucent resin film 1d and intersects with the transport direction. A fixed conveyor belt 6D (or 6C) that contacts the other surface of the transparent resin film 1d is provided between the plurality of fixed conveyor belts 6C (or 6D). In other words, the fixed conveyor belts 6C and 6D are
Arranged in a staggered manner in the width direction of the translucent resin film 1d so that the surfaces of c and 6d (contact surfaces with the translucent resin film 1d) are coincident with each other, or are more likely to bite into the other side. has been done.

In this way, by arranging the fixed conveyance belts 6c and 6D in a staggered manner, the translucent resin film 1d that is conveyed is
Since tension in the width direction can be applied to the fixed conveyor belts 6c and 6D, the translucent resin film 1d can be uniformly and reliably sandwiched and conveyed.

Further, the transparent resin film 1d held between the fixed conveyor belts 6C and 6D is conveyed in a shape that wraps around the surface and side surfaces of the respective belts 6c and 6d, so that the rollers 6Ca, 6Cb and the belt 6c, Or roller 6D
It is possible to prevent a to 6De and the belt 6d from shifting in the axial direction of the rollers. Therefore, the clamping force applied to the translucent resin film ld during transportation can be made uniform and wrinkles can be prevented from occurring, thereby preventing troubles such as jamming. In particular, the apparatus of this embodiment is provided with an upper translucent resin film discharge storage container 7A, which will be described later, and the transport path of the upper transport belt mechanism is longer than that of the lower transport belt mechanism. 60 and 6D are effective.

The fixed conveyance belt 6E is composed of a roller 6Ea supported by a driven shaft ■, a roller 6Eb supported by a driven shaft ■, and a belt 6e wound around the rollers 6Ea and 6Eb.

The fixed conveyor belt 6F has a roller 6 supported by a driven shaft
Fa, roller 6Pb supported by driven shaft ■ and roller 6
It is composed of a belt 6r wound around Fa and 6Fb.

As shown in FIGS. 1 and 2, the fixed conveyor belts 6E and 6F move the transparent resin film ld conveyed by the fixed conveyor belts 6C and 6D from the main body of the apparatus in the direction of arrow M.
1: It is configured to emit. ', 'A' E1 main body l', II+: The ejected translucent resin film 1d is stored in the upper translucent resin film discharge storage container 7A shown in FIG. The upper transparent resin film 1 and the discharge storage container 7A are detachably attached to the upper part of the main body of the apparatus.

1. The mechanism of the lower conveyor bell 1 is as shown in FIG.
It is composed of a fixed conveyor belt 6G and a movable conveyor belt 61.

The fixed conveyance belt 6G includes a roller 6Ga supported by driven shafts (not shown) on each side, a roller 6Gb supported by driven shafts (not shown) 6GC1, and a roller 6.
It consists of bells 1 to 6 g wound around Ga to 6 G c.

The movable conveyance belt 53H includes rollers 6l-1a supported by driven shafts (not shown) on each side, and rollers 61-1b supported by driven shafts 6HC1 (not shown) on each side.
and bells 1-6h wound around rollers 6Ha-6Hc
It consists of

Fixed conveyor belt 1-6G and movable conveyor belt 6 T-1.

Similar to the upper conveyor belt mechanism, the other transparent resin film 1d whose peeling position and stripping angle have been set by the peeling angle setting plate 5 is conveyed while being peeled, and is also conveyed from the main body of the apparatus in the direction of arrow O. It is configured to discharge the transparent resin film 1d. The translucent resin films 1 and 1d discharged from the main body of the apparatus are stored in the lower translucent resin film 11 discharge storage container 7B shown in FIG. This lower transparent resin film discharge storage container 7B is detachably attached to the main body of the apparatus. Further, the two-part translucent resin film 11 discharge storage container 7A is provided on the upper part of the lower translucent resin film discharge storage container 7B, and the main body of the device is configured so that the occupied area can be reduced and made compact. has been done.

Further, as shown in FIGS. 2 and 10, a translucent resin film 1d to be discharged is placed near the respective conveyance paths on the discharge side of the fixed conveyance belts 6E, 6F, 6G and the movable conveyance belt 6H. A fluid ejecting mechanism 8 is provided that blows fluid in the ejecting direction (direction of arrow N).At this time, the angle between the transparent resin film 1d to be ejected and the fluid spraying direction is The acute angle 01 (0≦0
, ≦90°). The fluid ejection mechanism 8 is arranged between the fixed conveyor bells 1 and 6E, between 6F, between 6, and ! The PII conveyor belt 60 is composed of a pipe provided with an ejection port through which fluid is ejected. As a fluid.

Use pressurized air, gases such as inert gases, and liquids such as water.

Although not shown, a static eliminator is provided near the fluid ejection mechanism 8.

By providing the fluid ejecting mechanism 8 on the discharge side of each of the fixed conveyor belts 6E, 5F, 6G and the movable conveyor belt 6H, the ejected transparent resin film 1d can be redirected to the fixed conveyor belts 6E, 6F, 6H. 6G or movable conveyor belt 6H, and can guide the transparent resin film ld in the direction of the arrow M or 0 with the fluid, so the transparent resin film ld can be efficiently moved to the -L section. Alternatively, it can be discharged into the lower translucent resin film discharge storage container 7A or 7B.

In addition, an entrapment prevention member 9 is provided near the conveyance path on the discharge side between the fixed conveyance belts 6E, 6F, 6G and between the movable conveyance belt I-60, and is made of transparent resin. This prevents the film 1d from being caught up in the fixed conveyor belts 1-6E, 6F, 6G or the movable conveyor belt 61-1.

In addition, as shown in FIG. 2, there are
A static eliminator lO and an ion diffusion device ill are provided, respectively. The static eliminator 10 is configured to emit ions and reduce charging of the transparent resin film 1d during peeling and transportation. The ion diffusion device 11 is a static elimination bag mt.

Diffuses the ions released from the transparent resin film l
The structure is such that the charging of d can be efficiently reduced.

The ion diffusion device 11 is configured to diffuse ions using a pressurized fluid such as air.

It should be noted that the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the spirit of the invention.

For example, the present invention provides a protrusion suppressing member 3A of the protrusion suppressing mechanism 3.
Instead of the needle shape, the shape may be a wedge shape, a flat plate shape, or the like.

Further, instead of the protrusion suppressing mechanism 3, a vibrator may be used.

Further, the present invention can be applied to a device for propagating a protective film attached to a decorative architectural board.

(3) As described in detail, according to the present invention, the following effects can be obtained.

(A) VC! The edge of the thin film on the substrate being sent is detected by the thin film edge detection means while being moved, and energy is applied by the thin film □ floating means to a portion up to a predetermined distance inside from the detected thin film edge. Since a part of the edge of the thin film is floated, the edge of the thin film on the substrate can be detected reliably, and the detected edge of the thin film can be accurately and easily aligned with the thin film floating means. It can be carried out.

(B) According to the above (A), only a predetermined uniform width of the thin film end portion on the substrate can be raised accurately.

('C) By the above-mentioned (A) and (B), it is possible to prevent the pattern formed on the photoresist film provided on the base FiJ from being set.

[Brief explanation of drawings]

1 [4] is a side view showing a schematic configuration of a protective film stripping opening of a printed wiring board according to an embodiment of the present invention; FIG. 2 is an enlarged side view showing the essential parts of FIG. 1; 3 is a block diagram of the protrusion suppression mechanism shown in FIGS. 1 and 2, and FIG. 4 is an exploded view of the diffusion suppressing mechanism shown in FIG. 3. FIG. 5 is a partial sectional view of the protrusion suppressing member shown in FIG. 4. 6 and 7 are sectional views of essential parts of the printed wiring board shown in FIG. 2. FIG. 8 is a perspective view showing the configuration of the m-embodiment of the capacitive thin film edge detection device. FIG. 9 is a perspective view of essential parts of the peeling angle setting plate shown in FIGS. 1 and 2. FIG. FIG. 10 is an exploded perspective view of the thin film transport mechanism shown in FIGS. 1 and 2. 11 and 12 are sectional views of essential parts of the thin film transport mechanism shown in FIG. In the figure, l... printed wiring board, IA... insulating substrate □ board, IB... conductive layer, 1c... photosensitive resin layer,
ID...□Transparent resin film, 2... Conveyance drive roller. 3-...Protrusion pressing mechanism, 3A...Protrusion suppression member, 4.
... Fluid spraying mechanism, 5... Peeling angle setting plate, 6...
Thin film delivery mechanism, 28...Touch sensor.

Claims (6)

[Claims] (1) A thin film peeling device that peels off and discharges a thin film attached to a substrate, including a thin film edge detection means for detecting an edge of the thin film while moving the substrate, and the thin film edge detection means A thin film peeling device equipped with a thin film edge detecting device, characterized in that a thin film floating means is provided for floating a part of the thin film end by applying energy to a portion up to a predetermined distance inside from the thin film end detected by the method. (2) The thin film peeling apparatus with a thin film edge detecting device according to claim 1, wherein the thin film edge detecting means is an electrical or optical means. (3) A thin film peeling device for peeling off and discharging a thin film stuck to a substrate, comprising a substrate moving means for reciprocating the substrate and passing a set position of a thin film edge detecting means twice; A thin film end detecting means detects the end of the thin film while moving the thin film; and a part of the thin film end is detected by applying energy to a portion within a predetermined distance from the thin film end detected by the thin film end detecting means. 1. A thin film peeling device equipped with a thin film edge detection device, characterized in that a thin film floating means for floating the thin film portion is provided. (4) A thin film peeling device that peels off and discharges a thin film stuck to a substrate, and a thin film edge detection means that detects a change in the substrate capacitance or electric resistance value while moving the substrate; Thin film edge detection characterized in that a thin film floating means is provided which applies energy to a portion up to a predetermined distance inside from the thin film edge detected by the thin film edge detection means to float a part of the thin film edge. Thin film peeling device with device. (5) A thin film peeling device for peeling off and discharging a thin film stuck to a substrate, comprising a substrate moving means for reciprocating the substrate and passing a set position of a thin film edge detecting means twice; a thin film end detection means for detecting the thin film end during the second passage while moving; and applying energy to a portion up to a predetermined distance inside from the thin film end detected by the thin film end detection means; A thin film peeling apparatus equipped with a thin film edge detection device, characterized in that a thin film floating means for floating a part of the thin film edge is provided. (6) A thin film peeling apparatus with a thin film edge detection device according to any one of claims 1 to 5, wherein the energy is pressure, vibration, or the like.