JPS62180538U - - Google Patents

Info

Publication number
JPS62180538U
JPS62180538U JP1986068511U JP6851186U JPS62180538U JP S62180538 U JPS62180538 U JP S62180538U JP 1986068511 U JP1986068511 U JP 1986068511U JP 6851186 U JP6851186 U JP 6851186U JP S62180538 U JPS62180538 U JP S62180538U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
substrate
driving element
diode arrays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986068511U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0517249Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986068511U priority Critical patent/JPH0517249Y2/ja
Publication of JPS62180538U publication Critical patent/JPS62180538U/ja
Application granted granted Critical
Publication of JPH0517249Y2 publication Critical patent/JPH0517249Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP1986068511U 1986-05-07 1986-05-07 Expired - Lifetime JPH0517249Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986068511U JPH0517249Y2 (https=) 1986-05-07 1986-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986068511U JPH0517249Y2 (https=) 1986-05-07 1986-05-07

Publications (2)

Publication Number Publication Date
JPS62180538U true JPS62180538U (https=) 1987-11-16
JPH0517249Y2 JPH0517249Y2 (https=) 1993-05-10

Family

ID=30908392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986068511U Expired - Lifetime JPH0517249Y2 (https=) 1986-05-07 1986-05-07

Country Status (1)

Country Link
JP (1) JPH0517249Y2 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59148340U (ja) * 1983-03-25 1984-10-03 沖電気工業株式会社 発光出力補正装置
JPS6118848U (ja) * 1984-07-06 1986-02-03 三洋電機株式会社 光プリントヘツド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59148340U (ja) * 1983-03-25 1984-10-03 沖電気工業株式会社 発光出力補正装置
JPS6118848U (ja) * 1984-07-06 1986-02-03 三洋電機株式会社 光プリントヘツド

Also Published As

Publication number Publication date
JPH0517249Y2 (https=) 1993-05-10

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