JPS62178553U - - Google Patents
Info
- Publication number
- JPS62178553U JPS62178553U JP1986065907U JP6590786U JPS62178553U JP S62178553 U JPS62178553 U JP S62178553U JP 1986065907 U JP1986065907 U JP 1986065907U JP 6590786 U JP6590786 U JP 6590786U JP S62178553 U JPS62178553 U JP S62178553U
- Authority
- JP
- Japan
- Prior art keywords
- heat exchange
- electrode
- thermoelectric device
- insertion hole
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986065907U JPS62178553U (enExample) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986065907U JPS62178553U (enExample) | 1986-04-30 | 1986-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62178553U true JPS62178553U (enExample) | 1987-11-12 |
Family
ID=30903414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986065907U Pending JPS62178553U (enExample) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62178553U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814556A (ja) * | 1981-07-17 | 1983-01-27 | Nec Corp | 半導体素子用基板の製造方法 |
| JPS605162B2 (ja) * | 1980-05-30 | 1985-02-08 | 岩谷産業株式会社 | 重合熟成中に於けるウレタンフォ−ムの発火防止法 |
-
1986
- 1986-04-30 JP JP1986065907U patent/JPS62178553U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS605162B2 (ja) * | 1980-05-30 | 1985-02-08 | 岩谷産業株式会社 | 重合熟成中に於けるウレタンフォ−ムの発火防止法 |
| JPS5814556A (ja) * | 1981-07-17 | 1983-01-27 | Nec Corp | 半導体素子用基板の製造方法 |
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