JPS62178532U - - Google Patents

Info

Publication number
JPS62178532U
JPS62178532U JP6664486U JP6664486U JPS62178532U JP S62178532 U JPS62178532 U JP S62178532U JP 6664486 U JP6664486 U JP 6664486U JP 6664486 U JP6664486 U JP 6664486U JP S62178532 U JPS62178532 U JP S62178532U
Authority
JP
Japan
Prior art keywords
island
semiconductor chip
lead frame
back surface
resin adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6664486U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6664486U priority Critical patent/JPS62178532U/ja
Publication of JPS62178532U publication Critical patent/JPS62178532U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6664486U 1986-04-30 1986-04-30 Pending JPS62178532U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6664486U JPS62178532U (zh) 1986-04-30 1986-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6664486U JPS62178532U (zh) 1986-04-30 1986-04-30

Publications (1)

Publication Number Publication Date
JPS62178532U true JPS62178532U (zh) 1987-11-12

Family

ID=30904842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6664486U Pending JPS62178532U (zh) 1986-04-30 1986-04-30

Country Status (1)

Country Link
JP (1) JPS62178532U (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229561A (ja) * 2012-03-30 2013-11-07 Mitsubishi Materials Corp 接合体の製造方法、パワーモジュールの製造方法、パワーモジュール用基板及びパワーモジュール
JP2014022576A (ja) * 2012-07-18 2014-02-03 Nichia Chem Ind Ltd 半導体素子実装部材及び半導体装置
JP2016184756A (ja) * 2016-06-10 2016-10-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122088A (en) * 1978-03-15 1979-09-21 Mitsubishi Electric Corp Metal substrate for semiconductor-pellet mounting
JPS5852863A (ja) * 1981-09-25 1983-03-29 Toshiba Corp 半導体装置用リ−ドフレ−ム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122088A (en) * 1978-03-15 1979-09-21 Mitsubishi Electric Corp Metal substrate for semiconductor-pellet mounting
JPS5852863A (ja) * 1981-09-25 1983-03-29 Toshiba Corp 半導体装置用リ−ドフレ−ム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229561A (ja) * 2012-03-30 2013-11-07 Mitsubishi Materials Corp 接合体の製造方法、パワーモジュールの製造方法、パワーモジュール用基板及びパワーモジュール
JP2014022576A (ja) * 2012-07-18 2014-02-03 Nichia Chem Ind Ltd 半導体素子実装部材及び半導体装置
JP2016184756A (ja) * 2016-06-10 2016-10-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置

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