JPS6217172U - - Google Patents
Info
- Publication number
- JPS6217172U JPS6217172U JP10834885U JP10834885U JPS6217172U JP S6217172 U JPS6217172 U JP S6217172U JP 10834885 U JP10834885 U JP 10834885U JP 10834885 U JP10834885 U JP 10834885U JP S6217172 U JPS6217172 U JP S6217172U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- hole
- wiring board
- cutout
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10834885U JPS6217172U (ro) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10834885U JPS6217172U (ro) | 1985-07-15 | 1985-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217172U true JPS6217172U (ro) | 1987-02-02 |
Family
ID=30985461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10834885U Pending JPS6217172U (ro) | 1985-07-15 | 1985-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217172U (ro) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253506A (ja) * | 2005-03-11 | 2006-09-21 | Tdk Corp | 複合基板装置及び複合基板装置の製造方法 |
-
1985
- 1985-07-15 JP JP10834885U patent/JPS6217172U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253506A (ja) * | 2005-03-11 | 2006-09-21 | Tdk Corp | 複合基板装置及び複合基板装置の製造方法 |
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