JPS6217171U - - Google Patents
Info
- Publication number
- JPS6217171U JPS6217171U JP10693985U JP10693985U JPS6217171U JP S6217171 U JPS6217171 U JP S6217171U JP 10693985 U JP10693985 U JP 10693985U JP 10693985 U JP10693985 U JP 10693985U JP S6217171 U JPS6217171 U JP S6217171U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- boards
- hybrid
- soldering
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案に係る厚膜混成ＩＣの構成を示
す第１の実施例の平面図、第２図は第１図の実施
例の完成後の側面図、第３図、第４図は第２の実
施例のそれぞれ展開図、側面図である。
１，１′，１１，１１′，１１″…セラミツク
基板、２，２′，１２，１２′，１２″…配線パ
ターン、３，３′，１３，１３′，１３″…抵抗
体パターン、４，４′，１４，１４′…搭載ＩＣ
、５，１５…搭載コンデンサ、６，１６…端子、
７，１７…フレキシブルプリント板、８，１８…
接着剤。
FIG. 1 is a plan view of a first embodiment showing the structure of a thick film hybrid IC according to the present invention, FIG. 2 is a side view of the completed embodiment of FIG. 1, and FIGS. 3 and 4 are FIG. 7 is a developed view and a side view of the second embodiment, respectively. 1, 1', 11, 11', 11''... Ceramic substrate, 2, 2', 12, 12', 12''... Wiring pattern, 3, 3', 13, 13', 13''... Resistor pattern, 4 , 4', 14, 14'...onboard IC
, 5, 15... mounted capacitor, 6, 16... terminal,
7,17...Flexible printed board, 8,18...
glue.
Claims (1)
焼成して成る厚膜印刷基板上に、ＩＣ、コンデン
サ等の部品をはんだ付けにより搭載して成る厚膜
混成ＩＣ基板を、２枚又はそれ以上の枚数に分け
て製作しておき、該厚膜混成ＩＣ基板の相互間の
配線接続をフレキシブルプリント板を用いてはん
だ接続し、かつ基板間を接着剤等で一体化した構
成を特徴とする厚膜混成ＩＣ。 Two or more thick film hybrid IC boards are made by mounting parts such as ICs and capacitors by soldering on a thick film printed board made by printing and firing wiring conductors, resistors, etc. on a ceramic board. A thick film characterized by a structure in which the thick film hybrid IC boards are manufactured in parts, the wiring connections between the thick film hybrid IC boards are connected by soldering using a flexible printed board, and the boards are integrated with adhesive or the like. Hybrid IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10693985U JPS6217171U (en) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10693985U JPS6217171U (en) | 1985-07-15 | 1985-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217171U true JPS6217171U (en) | 1987-02-02 |
Family
ID=30982761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10693985U Pending JPS6217171U (en) | 1985-07-15 | 1985-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217171U (en) |
-
1985
- 1985-07-15 JP JP10693985U patent/JPS6217171U/ja active Pending
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