JPS6217152U - - Google Patents
Info
- Publication number
- JPS6217152U JPS6217152U JP10998985U JP10998985U JPS6217152U JP S6217152 U JPS6217152 U JP S6217152U JP 10998985 U JP10998985 U JP 10998985U JP 10998985 U JP10998985 U JP 10998985U JP S6217152 U JPS6217152 U JP S6217152U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- bending area
- lead
- thinner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10998985U JPS6217152U (ko) | 1985-07-17 | 1985-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10998985U JPS6217152U (ko) | 1985-07-17 | 1985-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217152U true JPS6217152U (ko) | 1987-02-02 |
Family
ID=30988603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10998985U Pending JPS6217152U (ko) | 1985-07-17 | 1985-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217152U (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192258A (ja) * | 1987-02-03 | 1988-08-09 | Mitsubishi Electric Corp | 半導体装置 |
| JP2006303086A (ja) * | 2005-04-19 | 2006-11-02 | Toyota Industries Corp | 半導体装置 |
| JP2011018933A (ja) * | 2010-09-16 | 2011-01-27 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58215061A (ja) * | 1982-06-09 | 1983-12-14 | Hitachi Ltd | 半導体装置およびその製造方法 |
-
1985
- 1985-07-17 JP JP10998985U patent/JPS6217152U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58215061A (ja) * | 1982-06-09 | 1983-12-14 | Hitachi Ltd | 半導体装置およびその製造方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192258A (ja) * | 1987-02-03 | 1988-08-09 | Mitsubishi Electric Corp | 半導体装置 |
| JP2006303086A (ja) * | 2005-04-19 | 2006-11-02 | Toyota Industries Corp | 半導体装置 |
| JP4622646B2 (ja) * | 2005-04-19 | 2011-02-02 | 株式会社豊田自動織機 | 半導体装置 |
| JP2011018933A (ja) * | 2010-09-16 | 2011-01-27 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |