JPS62170626U - - Google Patents
Info
- Publication number
- JPS62170626U JPS62170626U JP5815286U JP5815286U JPS62170626U JP S62170626 U JPS62170626 U JP S62170626U JP 5815286 U JP5815286 U JP 5815286U JP 5815286 U JP5815286 U JP 5815286U JP S62170626 U JPS62170626 U JP S62170626U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- fluorine
- based polymer
- electronic component
- clad electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 2
- 229910052731 fluorine Inorganic materials 0.000 claims 2
- 239000011737 fluorine Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Details Of Resistors (AREA)
Description
第１図は本考案の実施例の正面断面図、第２図
は高温高湿度の雰囲気中に放置後の吸湿量のグラ
フ、第３図は第２図で用いた試料を半田リフロー
した後のクラツク発生数のグラフを示す。
Ａ，Ｂ…本考案実施例、Ｃ…従来例。
Figure 1 is a front sectional view of an embodiment of the present invention, Figure 2 is a graph of moisture absorption after being left in a high temperature and high humidity atmosphere, and Figure 3 is a graph of the sample used in Figure 2 after soldering reflow. A graph of the number of crack occurrences is shown. A, B...Embodiment of the present invention, C... Conventional example.
Claims (1)
脂外装型電子部品において、樹脂外装の表面にフ
ツ素系ポリマーからなる耐湿層が設けられている
ことを特徴とする樹脂外装型電子部品。 (2) フツ素系ポリマーが良好な半田付け性を有
する実用新案登録請求の範囲第１項記載の樹脂外
装型電子部品。[Scope of Claim for Utility Model Registration] (1) A resin-clad electronic component in which an element is provided with a resin sheath and a terminal is drawn out, characterized in that a moisture-resistant layer made of a fluorine-based polymer is provided on the surface of the resin sheath. Resin-clad electronic components. (2) The resin-clad electronic component according to claim 1, in which the fluorine-based polymer has good solderability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5815286U JPS62170626U (en) | 1986-04-17 | 1986-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5815286U JPS62170626U (en) | 1986-04-17 | 1986-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62170626U true JPS62170626U (en) | 1987-10-29 |
Family
ID=30888483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5815286U Pending JPS62170626U (en) | 1986-04-17 | 1986-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62170626U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726840B2 (en) * | 1977-02-09 | 1982-06-07 |
-
1986
- 1986-04-17 JP JP5815286U patent/JPS62170626U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5726840B2 (en) * | 1977-02-09 | 1982-06-07 |
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