JPS62169790U - - Google Patents

Info

Publication number
JPS62169790U
JPS62169790U JP1986056182U JP5618286U JPS62169790U JP S62169790 U JPS62169790 U JP S62169790U JP 1986056182 U JP1986056182 U JP 1986056182U JP 5618286 U JP5618286 U JP 5618286U JP S62169790 U JPS62169790 U JP S62169790U
Authority
JP
Japan
Prior art keywords
laser processing
workpiece
circular hole
processing apparatus
removal mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986056182U
Other languages
Japanese (ja)
Other versions
JPH0442078Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986056182U priority Critical patent/JPH0442078Y2/ja
Publication of JPS62169790U publication Critical patent/JPS62169790U/ja
Application granted granted Critical
Publication of JPH0442078Y2 publication Critical patent/JPH0442078Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第１実施例に係るレーザ加工
装置の加工ヘツド部の縦断面図、第２図は本考案
の第２実施例に係る第１図に示すものの縦断面図
、第３図は従来例に係るレーザ加工装置の概略図
、第４図はレーザの加工した被加工物の一例を示
す縦断面図である。 １……レーザ加工装置、２……加工ヘツド部、
３……レンズホルダ、６……集束レンズ、８……
スクラツプ除去機構、１８……回転中心軸、３０
……レーザビーム、４０……磁石となる鉄芯、７
０……被加工物、７１……円形孔、７２……スク
ラツプ。 1 is a longitudinal sectional view of the processing head of a laser processing apparatus according to a first embodiment of the present invention, FIG. 2 is a longitudinal sectional view of the processing head shown in FIG. 1 according to a second embodiment of the invention, and FIG. The figure is a schematic diagram of a conventional laser processing apparatus, and FIG. 4 is a longitudinal sectional view showing an example of a workpiece processed by the laser. 1... Laser processing device, 2... Processing head section,
3... Lens holder, 6... Focusing lens, 8...
Scrap removal mechanism, 18...Rotation center axis, 30
...Laser beam, 40...Iron core that becomes a magnet, 7
0... Workpiece, 71... Circular hole, 72... Scrap.

Claims (1)

【実用新案登録請求の範囲】 (1) レーザビームを集束する集束レンズを回転
中心軸に対して偏心させて配置したレンズホルダ
を回転させて被加工物に円形孔を切断加工する加
工ヘツド部を設けたレーザ加工装置において、前
記被加工物の円形孔中心に対向する前記加工ヘツ
ド部に、円形孔切断加工時に発生する前記被加工
物のスクラツプを除去するスクラツプ除去機構を
備えたレーザ加工装置。 (2) 前記スクラツプ除去機構が、吸着手段で構
成された実用新案登録請求の範囲第１項記載のレ
ーザ加工装置。 (3) 前記吸着手段が、磁石で構成された実用新
案登録請求の範囲第２項記載のレーザ加工装置。 (4) 前記スクラツプ除去機構が、減圧吸引手段
で構成された実用新案登録請求の範囲第１項記載
のレーザ加工装置。[Claims for Utility Model Registration] (1) A processing head that cuts a circular hole in a workpiece by rotating a lens holder in which a focusing lens for focusing a laser beam is arranged eccentrically with respect to the rotation center axis. The laser processing device is provided with a scrap removal mechanism for removing scrap of the workpiece generated during cutting of the circular hole, the processing head portion facing the center of the circular hole of the workpiece. (2) The laser processing apparatus according to claim 1, wherein the scrap removal mechanism is comprised of suction means. (3) The laser processing apparatus according to claim 2, wherein the attraction means is constituted by a magnet. (4) The laser processing apparatus according to claim 1, wherein the scrap removal mechanism is comprised of a vacuum suction means.
JP1986056182U 1986-04-15 1986-04-15 Expired JPH0442078Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986056182U JPH0442078Y2 (en) 1986-04-15 1986-04-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986056182U JPH0442078Y2 (en) 1986-04-15 1986-04-15

Publications (2)

Publication Number Publication Date
JPS62169790U true JPS62169790U (en) 1987-10-28
JPH0442078Y2 JPH0442078Y2 (en) 1992-10-02

Family

ID=30884767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986056182U Expired JPH0442078Y2 (en) 1986-04-15 1986-04-15

Country Status (1)

Country Link
JP (1) JPH0442078Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0531592A (en) * 1991-07-25 1993-02-09 Tamotsu Fujita Laser beam nozzle head and its control method for laser beam cutting machine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4749947B2 (en) * 2006-06-20 2011-08-17 本田技研工業株式会社 Scrap removal method and scrap removal apparatus during laser cutting

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843884U (en) * 1981-09-11 1983-03-24 株式会社東芝 metal plate cutting equipment
JPS5992187A (en) * 1982-11-16 1984-05-28 Mitsubishi Electric Corp Piercing device by laser

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843884B2 (en) * 1977-03-23 1983-09-29 エプソン株式会社 electromagnet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843884U (en) * 1981-09-11 1983-03-24 株式会社東芝 metal plate cutting equipment
JPS5992187A (en) * 1982-11-16 1984-05-28 Mitsubishi Electric Corp Piercing device by laser

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0531592A (en) * 1991-07-25 1993-02-09 Tamotsu Fujita Laser beam nozzle head and its control method for laser beam cutting machine

Also Published As

Publication number Publication date
JPH0442078Y2 (en) 1992-10-02

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