JPH02235590A - Punch/laser beam combined machine - Google Patents

Abstract

PURPOSE:To improve the roughness and the working accuracy of a cutting plane of a work by layer beam machining by providing a laser oscillator by separating it from a body frame of a punching machine, and forming its optical axis frame by a portal type. CONSTITUTION:A punch/laser beam combined machine 1 is constituted of a punching machine 3 and a laser beam machine 5, and executes punching and laser beam machining of a work W gripped by a clamp 15. IN this case, on a ground base of the side of a portal type frame 7 of the punting machine 3, a laser oscillator 19 is installed by separating it from the portal gate type frame 7. In this laser oscillator 19, an optical axis frame 23 is brought to expanding integrally in the horizontal direction, the other end part thereof is supported by a column 25 provided vertically on the ground, allowed to hold a prescribed clearance against the upper face of the portal type frame 7, and a working head 29 is provided vertically without coming into contact with the portal type frame 7. In such a way, it is prevented that vibration at the time of punching is transferred to the laser beam machine 5, and a position relation of the working head center and the punching center is maintained with high accuracy for a long period.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) This invention relates to an improvement of a banded laser multi-tasking machine.

(Prior Art) Conventionally, in a multi-tasking machine that performs laser machining and punching, a laser machining head and a punching press ram are provided close to each other. In order to reduce the influence of sliding motion during punching, the laser oscillator is placed separately from the frame of the punching machine, and the optical axis frame is extended from the laser oscillator in a cantilevered manner.
A processing head is installed vertically at the tip of the optical axis frame.

(Problems to be Solved by the Invention) By the way, in the above-mentioned conventional punch/laser combined processing machine, the positional relationship between the punching center and the laser processing center is always highly accurate and reproducible. However, since the optical axis frame is cantilevered, it is susceptible to external vibration due to its low rigidity.As a result, it is difficult to maintain the position with high precision, and the vibration can cause surface roughness on the cut surface. There is a problem that the optical axis frame has a lower rigidity and the laser processing precision also lowers.Furthermore, increasing the rigidity of the optical axis frame requires increasing the size of the optical axis frame, which increases the cost of the entire machine.

The purpose of this invention is to improve the above-mentioned problems by improving the rigidity of the optical axis frame, maintaining the positional relationship between the punching center and the laser processing center with high precision for a long period of time, and improving the transmission of external vibration. The object of the present invention is to provide a punch/laser compound processing machine which prevents cutting, improves roughness and processing accuracy.

[Structure of the Invention] (Means for Solving the y! Problem) In order to achieve the above object, the present invention includes a punching machine that performs punching on a workpiece and a rapping neck that performs laser processing. Combined with I1fi,
A frame for a laser oscillator of a laser processing device is provided on the outside of the main body frame of the punching machine, and the laser oscillator provided on the frame for the laser oscillator is integrally extended horizontally so as to be non-contact with the main frame. A processing head was vertically disposed on an optical axis frame provided in contact with the optical axis frame, and the tip of the optical axis frame was supported by an upright column to constitute a punch/laser composite processing machine.

(Function) By adopting the punch/ler core processing machine of the present invention, the punching machine and the laser processing device are installed separately, and the optical axis beam of the laser processing device is supported on both sides, and the main body frame is attached to the punching machine and the laser processing device. Constructed without contact. Therefore, the rigidity of the optical axis beam is improved, and the positions of the punching center and the laser processing center do not shift over a long period of time, and the increased rigidity of the optical axis frame improves the roughness of the cut surface during laser processing. Alternatively, processing accuracy is improved.

(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.

Referring to FIGS. 1 and 2, the punch/laser composite processing machine 1 is provided with a punching machine R3 and a laser machine HH5 adjacent to the punching machine 3.

The punching machine 3 is equipped with a plurality of punch heads provided on the bamboo center 9 via a drive member by an electric motor or the like, although the punching machine 3 is not shown in the drawings because it has a generally known configuration in a gate-shaped frame 7 as a main body frame. A lower turret 1-13 provided with a die is provided opposite the upper turret 11.

In the above configuration, the banding process is performed by driving the electric motor to press the punch heads provided on the upper turrets 1 to 11 through the driving member, and in cooperation with the gougs provided on the lower turret 13.

On the other hand, the workpiece W gripped by the clamp 15 is positioned by a positioning device (not shown), inserted between the upper and lower turrets 11 and 13, and punched.

Laser processing! ! [5 is a laser beam 1 attached to the side of the portal frame 7 of the punching machine 3 (on the left side in FIG. 1).
A laser oscillator 19 that oscillates a laser oscillator 7 is installed on the ground at a distance of m from the gate-shaped frame 7 via a base 21 serving as a frame for a laser oscillator installation device. The end of the optical axis frame 23 through which the laser beam 17 generated by the laser oscillator 19 passes is integrally engaged with the laser oscillator 19, and {I! ! The pane is integrally provided on a ram 25 which is erected from the ground at a distance to the side of the gate-shaped frame 7 (on the right side in FIG. 1).

Thus, the optical axis frame 23 is supported on both sides and is provided on the upper surface of the bolt-shaped frame 7 with a predetermined gap maintained therebetween. Note that the optical axis frame 23 may not be engaged with the laser oscillator 19, but may be provided independently on the base 21 via a support.

On the optical axis frame 23, a processing head 29 having a reflecting mirror 27 on the upper part is vertically installed between the members of the gate-shaped frame 7 without contacting the gate-shaped frame 7, as shown in FIG. has been done.

With the above configuration, the laser beam 17 emitted by the laser oscillator 19 passes through the optical axis frame 23,
The laser beam 17 and assist gas are ejected from the processing head 29 at 7, and the workpiece W gripped and positioned by the clamp 15 is processed.

As mentioned above, the laser processing device 5 is provided separately outside the punching machine 3, and the optical axis frame 23 of the laser processing device 5 is of a dual support type to improve rigidity.
Vibrations generated during punching are not transmitted to the laser processing device 5. Furthermore, the punch center 9 and the laser beam 1
The positional relationship between the centers of the processing head 29 through which the laser beam 7 passes is maintained at high precision for a long period of time, and in addition, since it is not subjected to external vibration during laser processing, the degree of cross-section and processing accuracy are improved.
Machine cost can be reduced due to simple groove formation.

Note that the present invention is not limited to the embodiments described above, and can be implemented in other embodiments by making appropriate changes.

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, the laser emitter of the laser processing device is provided at a distance from the main body frame of the punching machine, and the laser processing device The optical axis frame is supported on both sides to improve rigidity. As a result, vibrations during punching are not transmitted to the laser processing equipment, and the positional relationship between the center of the processing head, which is perpendicular to the optical axis frame with increased rigidity, and the center of the punch can be maintained with high precision for a long period of time. be able to. Furthermore, since it is not affected by imaging, it is possible to improve the cutting roughness and processing accuracy of the workpiece during laser processing, increase rigidity with a simple configuration, and reduce equipment costs. can.

[Brief explanation of the drawing]

Figures 1 and 2 show the main parts of this invention, Figure 1 is a side view of a punch/laser multi-tasking machine according to an embodiment of the present invention, and Figure 2 is a side view of ■-■ in Figure 1. It is a sectional view along the line. 1... Punch/laser composite processing Iso 3... Punching processing machine 5... Laser processing device 7... Bar-shaped frame (body frame of punching II) 19... Laser emitter 21...・Base (frame for laser oscillator) 23...
Optical axis frame 25...Column 29...Processing head

Claims (1)

[Claims] A multi-purpose processing machine is provided with a punching machine for punching a workpiece and a laser processing device for laser processing, and a frame for a laser oscillator of the laser processing device is provided separately on the outside of a main body frame of the punching machine, A processing head is vertically disposed on an optical axis frame that extends horizontally integrally with the laser oscillator provided on the laser oscillator frame and is provided in a non-contact manner on the main body frame, and the tip of the optical axis frame is erected. A multi-purpose punch/laser processing machine characterized by being supported by a column with a cylindrical shape.