JP4749947B2 - Scrap removal method and scrap removal apparatus during laser cutting - Google Patents

Scrap removal method and scrap removal apparatus during laser cutting Download PDF

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JP4749947B2
JP4749947B2 JP2006169896A JP2006169896A JP4749947B2 JP 4749947 B2 JP4749947 B2 JP 4749947B2 JP 2006169896 A JP2006169896 A JP 2006169896A JP 2006169896 A JP2006169896 A JP 2006169896A JP 4749947 B2 JP4749947 B2 JP 4749947B2
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JP2008000757A (en
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陽一 山本
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Honda Motor Co Ltd
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この発明は、ワークの袋状部に対するレーザー切断加工時のスクラップ除去方法及びスクラップ除去装置に関する。   The present invention relates to a scrap removing method and a scrap removing device at the time of laser cutting for a bag-like portion of a workpiece.

特許文献1には、箱型構造部品をレーザーにより孔開け加工する際に、発生したスクラップ片が箱型構造部品内に落下することを防止する技術が開示されている。これは、ワイヤ切断装置及び自動溶接装置を用いて一定寸法に切断したワイヤを切断箇所に予め溶着し、孔開け加工の途中で切断を一時停止して前記ワイヤをクランプ装置でクランプすることで、切断完了時にスクラップ片が箱型構造部品内に落下することを防止する。
特許文献2には、被加工物をレーザーにより孔開け加工する際に、発生したスクラップ片を被加工物内から磁力又はエア吸引力により取り除く技術が開示されている。
特許文献3には、レーザーロボットにより切断加工する際に、発生したスクラップ片を外部に排出する技術が開示されている。これは、レーザー加工ヘッドにスクラップ片を吸引、捕捉するための負圧搬送手段及び電磁石磁極棒を配設し、切断終了直前に電磁石を励磁すると共に切断終了と同時に磁極棒でスクラップ片を磁着し、次いで負圧搬送手段を作動させると共に電磁石磁極棒を消磁することで、負圧搬送手段によりスクラップ片を外部に排出する。
特開平4−143089号公報 実公平4−42078号公報 特開平6−344173号公報
Patent Document 1 discloses a technique for preventing generated scrap pieces from falling into a box-shaped structural component when the box-shaped structural component is drilled by a laser. This is by pre-welding a wire cut to a certain size using a wire cutting device and an automatic welding device to the cutting location in advance, pausing the cutting in the middle of drilling and clamping the wire with a clamping device, Prevents scrap pieces from falling into box-type structural parts when cutting is complete.
Patent Document 2 discloses a technique for removing generated scrap pieces from a workpiece by a magnetic force or an air suction force when the workpiece is drilled by a laser.
Patent Document 3 discloses a technique for discharging generated scrap pieces to the outside when cutting with a laser robot. This is because the laser processing head is equipped with a negative pressure conveying means for attracting and capturing scrap pieces and an electromagnet pole bar. The electromagnet is excited just before the end of cutting and the scrap pieces are magnetized with the pole bar at the same time as the end of cutting. Then, by operating the negative pressure conveying means and demagnetizing the electromagnet pole bar, the scrap pieces are discharged to the outside by the negative pressure conveying means.
Japanese Patent Laid-Open No. 4-143089 No. 4-42078 JP-A-6-344173

上記特許文献1の技術は、孔開け加工毎に切断箇所に新規のワイヤを溶着する必要があるため、作業が煩雑でかつワイヤ分のコストが嵩むという問題がある。また、ワイヤ切断装置や自動溶接装置をレーザー加工装置に併設する必要があるため、設備全体が大型化するという問題がある。
上記特許文献2の技術は、被加工物内にスクラップ片が落下した際に該スクラップ片の位置ずれが生じた場合には、スクラップ片の取り出し時に被加工物と干渉して該スクラップ片が取り出し難くなるという問題がある。
上記特許文献3の技術は、レーザー加工ヘッドが大型化し、かつ電磁石磁極棒の励磁装置や負圧搬送手段の負圧発生装置が必要となるため、設備全体が大型化するという問題がある。
そこでこの発明は、レーザー切断加工時のスクラップ除去方法及びスクラップ除去装置において、設備全体の大型化を抑えると共にスクラップ片の排出を容易にし、かつコストを抑えることを目的とする。
The technique of the above-mentioned patent document 1 has a problem that the work is complicated and the cost of the wire is increased because it is necessary to weld a new wire to the cut portion for every drilling process. Moreover, since it is necessary to add a wire cutting device and an automatic welding device to the laser processing device, there is a problem that the entire facility is enlarged.
When the scrap piece is displaced when the scrap piece falls into the work piece, the technique of the above-mentioned Patent Document 2 interferes with the work piece when the scrap piece is taken out, and the scrap piece is taken out. There is a problem that it becomes difficult.
The technique of the above-mentioned Patent Document 3 has a problem that the laser processing head is enlarged and an electromagnet pole bar exciting device and a negative pressure generating device for negative pressure conveying means are required, so that the entire facility is enlarged.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to reduce the size of the entire equipment, facilitate the discharge of scrap pieces, and reduce the cost in the scrap removal method and scrap removal apparatus during laser cutting.

上記課題の解決手段として、請求項1に記載した発明は、ワーク(例えば実施例のワークW)の袋状部にレーザー切断加工装置(例えば実施例のレーザー切断加工装置1)によるレーザー切断加工をする際、該加工により生じたスクラップ片(例えば実施例のスクラップ片Wc)を前記袋状部の外部に排出する方法であって、前記ワークの切断除去部(例えば実施例の切断除去部Wa)に、前記レーザー切断加工装置のレーザー加工ヘッド(例えば実施例のレーザー加工ヘッド36)により線材挿通孔(例えば実施例の線材挿通孔Wb)を形成し、該線材挿通孔を通じて前記袋状部内へ巻き癖を有する線材(例えば実施例のバネ線材11)を供給し、該線材に前記切断除去部の裏側で発条体(例えば実施例の発条体11a)を形成させると共に、前記切断除去部の周囲に前記レーザー加工ヘッドによりレーザー切断加工を施して該切断除去部を前記スクラップ片とした後には、前記線材により前記スクラップ片を吊り下げて前記袋状部の外部に取り出し、かつ前記線材を回収して前記スクラップ片から抜き取ることで、該スクラップ片を前記袋状部の外部に排出することを特徴とする。   As a means for solving the above-mentioned problems, the invention described in claim 1 is directed to subjecting a bag-like portion of a workpiece (for example, the workpiece W of the embodiment) to laser cutting by a laser cutting processing device (for example, the laser cutting processing device 1 of the embodiment). In this case, the scrap piece (for example, the scrap piece Wc of the embodiment) generated by the processing is discharged to the outside of the bag-shaped portion, and the workpiece is cut and removed (for example, the cut and removed portion Wa of the embodiment). In addition, a wire rod insertion hole (for example, the wire rod insertion hole Wb of the embodiment) is formed by a laser processing head (for example, the laser processing head 36 of the embodiment) of the laser cutting processing apparatus, and wound into the bag-shaped portion through the wire rod insertion hole. When a wire having a ridge (for example, the spring wire 11 of the embodiment) is supplied and a strip (for example, the strip 11a of the embodiment) is formed on the back side of the cut and removed portion, the wire is formed. After the laser processing head performs laser cutting around the cutting and removing portion to make the cutting and removing portion the scrap piece, the scrap piece is suspended by the wire and taken out of the bag-like portion. And the said scrap is discharged | emitted outside the said bag-shaped part by collect | recovering and extracting the said wire from the said scrap piece.

請求項2に記載した発明は、ワーク(例えば実施例のワークW)の袋状部にレーザー切断加工装置(例えば実施例のレーザー切断加工装置1)によるレーザー切断加工をする際、該加工により生じたスクラップ片(例えば実施例のスクラップ片Wc)を前記袋状部の外部に排出する装置であって、前記レーザー切断加工装置のレーザー加工ヘッド(例えば実施例のレーザー加工ヘッド36)に隣接する線材給排口(例えば実施例の線材給排口6a)より巻き癖を有する線材(例えば実施例のバネ線材11)を給排する線材給排手段(例えば実施例の線材給排装置20)と、前記レーザー加工ヘッドに対して前記線材給排口を移動させる給排口移動手段(例えば実施例の給排口移動装置14)と、前記ワークに対して前記線材給排口を進退させる給排口進退手段(例えば実施例の給排口昇降装置13)とを備え、前記ワークの切断除去部(例えば実施例の切断除去部Wa)に形成した線材挿通孔(例えば実施例の線材挿通孔Wb)に対し、前記給排口進退手段により前記線材給排口を近接させ、前記線材給排手段により前記線材挿通孔を通じて前記袋状部内へ前記線材を供給し、該線材に前記切断除去部の裏側で発条体(例えば実施例の発条体11a)を形成させると共に、前記切断除去部の周囲に前記レーザー加工ヘッドによりレーザー切断加工を施して該切断除去部を前記スクラップ片とした後には、前記線材により前記スクラップ片を吊り下げて前記袋状部の外部に取り出し、かつ前記線材給排手段により前記線材を回収して前記スクラップ片から抜き取ることで、該スクラップ片を前記袋状部の外部に排出することを特徴とする。   The invention described in claim 2 is caused by the laser cutting process performed on the bag-like portion of the workpiece (for example, the workpiece W of the embodiment) by the laser cutting processing apparatus (for example, the laser cutting processing apparatus 1 of the embodiment). An apparatus for discharging the scrap piece (for example, the scrap piece Wc of the embodiment) to the outside of the bag-shaped portion, and adjacent to the laser processing head (for example, the laser processing head 36 of the embodiment) of the laser cutting processing apparatus. Wire supply / discharge means (for example, the wire supply / discharge device 20 of the embodiment) for supplying and discharging the wire (for example, the spring wire 11 of the embodiment) having a winding rod from the supply / discharge port (for example, the wire supply / discharge port 6a of the embodiment); Supply / exhaust port moving means (for example, supply / exhaust port moving device 14 in the embodiment) for moving the wire supply / exhaust port with respect to the laser processing head, and advancing / retreating the wire rod supply / discharge port with respect to the workpiece. A wire rod insertion hole (for example, the wire rod insertion of the embodiment), which is provided with a supply / discharge port advancement / retreat means (for example, the supply / discharge port lifting / lowering device 13 of the embodiment) and is formed in the cutting / removal portion of the workpiece (for example, the cut removal portion Wa of the embodiment). The wire supply / exhaust means is brought close to the hole Wb), the wire supply / discharge means supplies the wire through the wire insertion hole into the bag-like portion, and the wire is cut and removed. After forming the striated body (for example, the striated body 11a of the embodiment) on the back side of the part and performing the laser cutting process by the laser processing head around the cutting and removing part to make the cutting and removing part the scrap piece The scrap piece is suspended by the wire rod and taken out from the bag-shaped portion, and the wire rod is collected by the wire rod feeding / extracting means and extracted from the scrap piece. Characterized by discharging the pieces to the exterior of the bag portion.

請求項1に記載した発明によれば、ワークの切断除去部に形成した線材挿通孔を通じて袋状部内へ線材を供給し、該線材に切断除去部の裏側で発条体を形成させることで、切断除去部がスクラップ片となった後にはこれを線材により吊下可能とし、かつ該スクラップ片を袋状部の外部に取り出すと共に線材を回収してこれをスクラップ片から抜き取ることで、該スクラップ片を袋状部の外部に排出可能となる。
すなわち、線材給排装置を主にスクラップ除去装置を簡素に構成でき、設備全体の大型化を抑えると共にスクラップ片の排出を容易かつ確実に行うことができる。また、所定回数のレーザー切断加工に対して同一の線材を繰り返し用いることができ、加工コストの低減を図ることができる。
According to the invention described in claim 1, the wire material is supplied into the bag-like portion through the wire material insertion hole formed in the cut and removed portion of the workpiece, and the wire material is formed on the back side of the cut and removed portion, thereby cutting. After the removal part becomes a scrap piece, it can be hung by a wire, and the scrap piece is taken out of the bag-like part, and the wire is collected and extracted from the scrap piece. It can be discharged outside the bag-like portion.
That is, it is possible to simply configure the wire feeding / discharging device mainly as a scrap removal device, and to suppress the enlargement of the entire facility and to easily and reliably discharge scrap pieces. In addition, the same wire can be used repeatedly for a predetermined number of laser cutting processes, and the processing cost can be reduced.

請求項2に記載した発明によれば、請求項1と同様の作用効果に加え、ワークに対して線材給排口を進退させることで、線材挿通孔に線材を確実に挿通できると共に、その後に線材給排口をレーザー加工ヘッドと共に比較的自由に移動させることが可能となり、簡素な構成で様々な形状のレーザー切断加工に対応できる。このとき、レーザー加工ヘッドからのレーザー光線が線材を横断しないように線材給排口を移動させつつレーザー切断加工を行うことが可能となり、レーザー加工ヘッドが切断除去部外周を往復動等しなくとも一度の周回のみで全周をカットすることが可能となり、加工コストのさらなる低減を図ることができる。   According to the invention described in claim 2, in addition to the same effects as in claim 1, the wire rod can be reliably inserted through the wire insertion hole by moving the wire supply / exhaust port forward and backward with respect to the workpiece, and thereafter The wire supply / exhaust port can be moved relatively freely together with the laser processing head, and can cope with laser cutting processing of various shapes with a simple configuration. At this time, it becomes possible to perform laser cutting while moving the wire supply / exhaust port so that the laser beam from the laser processing head does not cross the wire, and once the laser processing head does not reciprocate the outer periphery of the cutting / removing part. It becomes possible to cut the entire circumference only by the rounding of the machining, and the processing cost can be further reduced.

以下、この発明の実施例について図面を参照して説明する。
図1に示すレーザー切断加工装置1は、多関節ロボット1aのアーム先端部にレーザー光線照射用のレーザー加工ヘッド36を支持してなるもので、ワークWの袋状部にレーザー切断加工を施した際に該加工により生じたスクラップ片Wcを前記袋状部の外部に排出するためのスクラップ除去装置12を備える。以下、図中矢印FRは前方を、矢印LHは左方を、矢印UPは上方を示すものとする。
Embodiments of the present invention will be described below with reference to the drawings.
The laser cutting processing apparatus 1 shown in FIG. 1 is formed by supporting a laser processing head 36 for laser beam irradiation at the tip of an arm of an articulated robot 1a. A scrap removing device 12 for discharging the scrap piece Wc generated by the processing to the outside of the bag-like portion is provided. In the drawings, the arrow FR indicates the front, the arrow LH indicates the left side, and the arrow UP indicates the upper side.

多関節ロボット1aのアームは、レーザー加工ヘッド36側の第一アーム3a部及び土台側の第二アーム3b部を主としてなる。
図2を併せて参照し、第一アーム3a部の先端には、略L字型に屈曲した板状の支持部材2の立面部2bが取り付けられる。支持部材2の平面部2aには、レーザー加工ヘッド36及びスクラップ除去装置12における後述の給排口昇降装置13等が支持される。
The arm of the articulated robot 1a mainly includes the first arm 3a portion on the laser processing head 36 side and the second arm 3b portion on the base side.
Referring also to FIG. 2, an elevation surface portion 2 b of a plate-like support member 2 bent in a substantially L shape is attached to the tip of the first arm 3 a portion. The flat portion 2 a of the support member 2 supports a laser processing head 36 and a later-described supply / discharge port lifting / lowering device 13 in the scrap removal device 12.

レーザー加工ヘッド36は、支持部材2の平面部2aから下方に延びる円筒状をなし、その上端部が軸線中心で回転自在となるように平面部2aに支持される。レーザー加工ヘッド36の下端はレーザー照射部36aとされ、該レーザー照射部36aから下方に向けて前記軸線上でレーザー光線が照射される。レーザー加工ヘッド36の上端部は平面部2a上に位置し、該上端部には従動ギヤ4が同軸固定される。平面部2a上には、前記従動ギヤ4に不図示の駆動ギヤを噛み合わせるサーボモータ10が支持される。レーザー加工ヘッド36の上端からは、レーザー光線導入用の光ファイバーケーブル5が上方に延出する。   The laser processing head 36 has a cylindrical shape extending downward from the flat surface portion 2a of the support member 2, and is supported by the flat surface portion 2a so that the upper end portion thereof is rotatable about the axis. The lower end of the laser processing head 36 is a laser irradiation unit 36a, and a laser beam is irradiated on the axis line downward from the laser irradiation unit 36a. The upper end portion of the laser processing head 36 is located on the flat portion 2a, and the driven gear 4 is coaxially fixed to the upper end portion. A servo motor 10 that meshes the driven gear 4 with a drive gear (not shown) is supported on the flat surface portion 2a. From the upper end of the laser processing head 36, the optical fiber cable 5 for introducing a laser beam extends upward.

図5,6を併せて参照し、スクラップ除去装置12は、ワークWに形成した線材挿通孔Wbを通じて袋状部内に巻き癖を有するバネ線材11を供給し、該バネ線材11に袋状部内で巻き形状を形成させることで、レーザー切断加工により生じたスクラップ片Wcをバネ線材11により吊下可能とし、該スクラップ片Wcを袋状部外に除去可能とする。バネ線材11は、無負荷の状態かつ常温下で巻き形状を形成するべく巻き癖がつけられたバネ鋼製のものであるが、昇温により前記巻き癖を発生させる形状記憶合金製のものや、前記何れかの特性を有する樹脂製のものであってもよい。   5 and 6, the scrap removing device 12 supplies the spring wire 11 having the curl in the bag-like portion through the wire insertion hole Wb formed in the workpiece W, and the spring wire 11 is supplied to the spring wire 11 in the bag-like portion. By forming the winding shape, the scrap piece Wc generated by the laser cutting process can be suspended by the spring wire 11, and the scrap piece Wc can be removed outside the bag-like portion. The spring wire 11 is made of spring steel with a curl to form a curl shape under no load and at normal temperature, but is made of a shape memory alloy that generates the curl by temperature rise, The resin may have any of the above characteristics.

バネ線材11は、線材給排装置20から繰り出され又は巻き取られる。線材給排装置20は、第一アーム3a部の基端部上に支持される駆動部20aから、バネ線材11を摺動自在に挿通させる可撓性を有するガイドパイプ6を延出してなる。ガイドパイプ6は、レーザー加工ヘッド36の上端部内を通過した後、その先端側が支持部材2の平面部2aの下方においてレーザー加工ヘッド36と隣接して配置される。なお、支持部材2の立面部2bの上端部には、光ファイバーケーブル5及びガイドパイプ6を遊挿させるガイド枠2cが設けられる。   The spring wire 11 is drawn out or wound up from the wire supply / discharge device 20. The wire feeding / discharging device 20 is formed by extending a flexible guide pipe 6 through which a spring wire 11 is slidably inserted from a drive unit 20a supported on a base end portion of a first arm 3a. After passing through the upper end of the laser processing head 36, the guide pipe 6 is disposed adjacent to the laser processing head 36 at the tip side below the flat portion 2 a of the support member 2. Note that a guide frame 2 c into which the optical fiber cable 5 and the guide pipe 6 are loosely inserted is provided at the upper end portion of the elevation surface portion 2 b of the support member 2.

支持部材2の平面部2aの下方には、上下に延びる昇降シリンダ7が光ファイバーケーブル5及びガイドパイプ6と隣接して配置される。昇降シリンダ7は、その上側にシリンダ本体7aを、下側にピストンロッド7bを配置してなり、シリンダ本体7aの上端部がレーザー加工ヘッド36に支持されると共に、ピストンロッド7bの下端部にはこれと略直交する支持板8が取り付けられる。支持板8にはこれを貫通するガイドパイプ6が支持され、該ガイドパイプ6の先端部が支持板8の下方に突出する。ガイドパイプ6の下端開口は、バネ線材11を供給又は回収する線材給排口6aとされる。この線材給排口6aが、昇降シリンダ7及び支持板8を主とする給排口昇降装置13により昇降可能とされる。   Below the flat surface portion 2 a of the support member 2, an elevating cylinder 7 extending vertically is disposed adjacent to the optical fiber cable 5 and the guide pipe 6. The elevating cylinder 7 has a cylinder body 7a on the upper side and a piston rod 7b on the lower side. The upper end of the cylinder body 7a is supported by the laser processing head 36, and the lower end of the piston rod 7b is A support plate 8 substantially perpendicular to this is attached. A guide pipe 6 penetrating the support plate 8 is supported by the support plate 8, and a tip portion of the guide pipe 6 protrudes below the support plate 8. A lower end opening of the guide pipe 6 is a wire supply / exhaust port 6a through which the spring wire 11 is supplied or recovered. The wire supply / discharge port 6 a can be moved up and down by a supply / discharge port lifting / lowering device 13 mainly including the lifting cylinder 7 and the support plate 8.

ここで、レーザー加工ヘッド36がワークWに対してレーザー切断加工を行う状態において、ガイドパイプ6の下端開口(線材給排口6a)は、昇降シリンダ7の伸長動作によりワークW表面に当接可能であり、かつ昇降シリンダ7の短縮動作によりワークW表面から離間する。すなわち、前記給排口昇降装置13の作動により、線材給排口6aがワークWに対して進退可能である。   Here, in a state in which the laser processing head 36 performs laser cutting processing on the workpiece W, the lower end opening (wire supply / exhaust port 6a) of the guide pipe 6 can be brought into contact with the surface of the workpiece W by the extension operation of the elevating cylinder 7. And is separated from the surface of the workpiece W by the shortening operation of the elevating cylinder 7. That is, the wire supply / exhaust port 6a can be advanced / retracted with respect to the workpiece W by the operation of the supply / exhaust port lifting / lowering device 13.

また、前記サーボモータ10の作動により従動ギヤ4と共にレーザー加工ヘッド36がその軸回りに回転すると、該レーザー加工ヘッド36と共にこれと隣接する昇降シリンダ7及びガイドパイプ6も一体に回転し、もってレーザー加工ヘッド36に対する相対位置を前後左右に変化させる。すなわち、サーボモータ10及び従動ギヤ4を主とする給排口移動装置14により、ガイドパイプ6の線材給排口6aがレーザー加工ヘッド36のレーザー照射部36a周りを回転移動可能である。   Further, when the laser processing head 36 is rotated around its axis together with the driven gear 4 by the operation of the servo motor 10, the lifting cylinder 7 and the guide pipe 6 adjacent to the laser processing head 36 are also rotated integrally with the laser processing head 36. The relative position with respect to the processing head 36 is changed from front to back and left and right. That is, the wire supply / exhaust port 6 a of the guide pipe 6 can be rotated around the laser irradiation part 36 a of the laser processing head 36 by the supply / discharge port moving device 14 mainly including the servo motor 10 and the driven gear 4.

図3,4に示すように、線材給排装置20の駆動部20aは、基板21上に両側壁22a,22c及びこれらに渡る中央壁22bを立設して平面視略コ字型の支持フレーム22を形成し、該支持フレーム22の中央壁22bの外側に駆動モータ23を支持してなる。支持フレーム22の内側には、駆動モータ23の駆動軸23aに取り付けられた駆動ローラ24が配設される。駆動モータ23の駆動軸23aの先端部は、両側壁22a,22cに跨って取り付けられた軸受け板25の軸受け25aに回転自在に支持される。   As shown in FIGS. 3 and 4, the drive unit 20 a of the wire feeding / discharging device 20 is provided with both side walls 22 a and 22 c and a central wall 22 b extending over the substrate 21, and a substantially U-shaped support frame in plan view. 22, and the drive motor 23 is supported outside the central wall 22 b of the support frame 22. Inside the support frame 22, a driving roller 24 attached to a driving shaft 23 a of the driving motor 23 is disposed. The front end portion of the drive shaft 23a of the drive motor 23 is rotatably supported by a bearing 25a of a bearing plate 25 attached across both side walls 22a and 22c.

支持フレーム22における一方の側壁22cの上端部には、従動ローラ26を支持する支持アーム27の一端部が、ブラケット28を介して揺動可能に支持される。また、支持フレーム22における他方の側壁22aの上端部には、前記支持アーム27の他端部に挿通される支持棒29の下端部がブラケット30を介して揺動可能に支持される。支持棒29の上部はネジ部29aとされ、該ネジ部29aにはナット部材31が螺着される。ナット部材31下面の上受け部材32と支持アーム27他端部上面の下受け部材33との間には、所定のコイルスプリング34が縮設される。   One end portion of a support arm 27 that supports the driven roller 26 is swingably supported via a bracket 28 at the upper end portion of the one side wall 22 c of the support frame 22. Further, the lower end portion of the support rod 29 inserted into the other end portion of the support arm 27 is supported by the upper end portion of the other side wall 22 a of the support frame 22 via the bracket 30 so as to be swingable. An upper portion of the support rod 29 is a screw portion 29a, and a nut member 31 is screwed to the screw portion 29a. A predetermined coil spring 34 is contracted between the upper receiving member 32 on the lower surface of the nut member 31 and the lower receiving member 33 on the upper surface of the other end of the support arm 27.

従動ローラ26の外周下端は駆動ローラ24の外周上端の直上に位置し、従動ローラ26にコイルスプリング34の弾性力が作用することで、従動ローラ26下端が駆動ローラ24上端に押圧状態で当接する。駆動ローラ24の外周には、バネ線材11をその断面の半分程度のみ入り込ませるV字溝24aが形成される。支持フレーム22における前記一方の側壁22cには前記ガイドパイプ6の基端部が貫通支持され、前記他側の側壁22aには不図示の線材収納部から延びる上流側ガイドパイプ35の先端部が貫通支持される。   The lower end of the outer periphery of the driven roller 26 is located immediately above the upper end of the outer periphery of the driving roller 24, and the elastic force of the coil spring 34 acts on the driven roller 26, so that the lower end of the driven roller 26 contacts the upper end of the driving roller 24 in a pressed state. . On the outer periphery of the drive roller 24, a V-shaped groove 24a for allowing the spring wire 11 to enter only about half of its cross section is formed. A base end portion of the guide pipe 6 is penetrated and supported by the one side wall 22c of the support frame 22, and a distal end portion of an upstream guide pipe 35 extending from a wire material storage portion (not shown) penetrates the other side wall 22a. Supported.

ガイドパイプ6の基端及び上流側ガイドパイプ35の先端は互いに対向しており、上流側ガイドパイプ35内から延びるバネ線材11は、前記V字溝24aに入り込んだ状態で両ローラ24,26に挟持され、かつその下流側でガイドパイプ6内に挿通される。そして、駆動モータ23の作動により両ローラ24,26が回転駆動してバネ線材11を何れかのガイドパイプ6,35側に送ることで、前記ガイドパイプ6の線材給排口6aからバネ線材11が供給又は回収される。   The proximal end of the guide pipe 6 and the distal end of the upstream guide pipe 35 are opposed to each other, and the spring wire 11 extending from the upstream guide pipe 35 is in contact with the rollers 24 and 26 while entering the V-shaped groove 24a. It is sandwiched and inserted into the guide pipe 6 on the downstream side. Then, the rollers 24 and 26 are driven to rotate by the operation of the drive motor 23 to send the spring wire 11 to any one of the guide pipes 6 and 35, so that the spring wire 11 from the wire supply / discharge port 6 a of the guide pipe 6. Is supplied or recovered.

次に、上記レーザー切断加工装置1によりワークWの袋状部にレーザー切断加工を行うと共に、該加工により生じたスクラップ片Wcを前記袋状部の外部に排出する工程について説明する。
まず、図5に示すように、多関節ロボット1aの作動により、ワークWの袋状部の切断除去部(スクラップ形成部)Waの略中央部の上方にレーザー加工ヘッド36先端のレーザー照射部36aを移動させ、該レーザー照射部36aからレーザー光線を照射して前記切断除去部Waの略中央部に線材挿通孔Wbを形成する。このとき、ガイドパイプ6は、その先端の線材給排口6aをワークW表面から離間させている。
Next, a process of performing laser cutting processing on the bag-shaped portion of the workpiece W by the laser cutting processing device 1 and discharging the scrap pieces Wc generated by the processing to the outside of the bag-shaped portion will be described.
First, as shown in FIG. 5, by the operation of the articulated robot 1a, the laser irradiation unit 36a at the tip of the laser processing head 36 is disposed above the substantially central portion of the bag-shaped cut and removal unit (scrap forming unit) Wa of the workpiece W. Is moved, and a laser beam is irradiated from the laser irradiation part 36a to form a wire insertion hole Wb at a substantially central part of the cutting and removing part Wa. At this time, the guide pipe 6 has the wire supply / discharge port 6a at the tip thereof separated from the surface of the workpiece W.

次いで、図6に示すように、多関節ロボット1aの作動により線材挿通孔Wbの上方からレーザー加工ヘッド36を退避させると共に該線材挿通孔Wbの上方にガイドパイプ6先端の線材給排口6aを移動させた後、昇降シリンダ7の伸長作動により前記線材給排口6aをワークW表面に当接させる。この状態で、前記駆動部20aの駆動モータ23を作動させて両ローラ24,26によりバネ線材11をガイドパイプ6内に送り込むことで、ガイドパイプ6先端の線材給排口6aからバネ線材11が繰り出され、該バネ線材11が線材挿通孔Wbを通じて袋状部内に供給される。   Next, as shown in FIG. 6, the laser processing head 36 is retracted from above the wire insertion hole Wb by the operation of the articulated robot 1a, and the wire supply / discharge port 6a at the tip of the guide pipe 6 is provided above the wire insertion hole Wb. After the movement, the wire supply / discharge port 6a is brought into contact with the surface of the workpiece W by the extension operation of the elevating cylinder 7. In this state, the drive motor 23 of the drive unit 20a is operated and the spring wire 11 is fed into the guide pipe 6 by both rollers 24 and 26, whereby the spring wire 11 is released from the wire supply / discharge port 6a at the tip of the guide pipe 6. The spring wire 11 is fed out and supplied into the bag-like portion through the wire insertion hole Wb.

袋状部内に供給されたバネ線材11は、切断除去部Waの裏面側(内面側)で直ちに巻き形状を形成する。このバネ線材11が袋状部内に所定長さだけ供給されると、該バネ線材11が切断除去部Waの裏面側で発条状に巻回して発条体11aを形成し、充分な弾発力をもって切断除去部Waの裏面に当接する。   The spring wire 11 supplied into the bag-like portion immediately forms a winding shape on the back surface side (inner surface side) of the cut and removed portion Wa. When the spring wire 11 is supplied into the bag-like portion for a predetermined length, the spring wire 11 is wound in a ridge shape on the back side of the cut and removed portion Wa to form a striated body 11a with sufficient resilience. Abuts on the back surface of the cut-off portion Wa.

次いで、図7に示すように、昇降シリンダ7の短縮作動によりガイドパイプ6の線材給排口6aをワークW表面から離間させると共に、図8に示すように、多関節ロボット1aの作動によりレーザー加工ヘッド36のレーザー照射部36aを切断除去部Wa外周の切断開始位置の上方に移動させる。このとき、ガイドパイプ6の線材給排口6aとワークWの線材挿通孔Wbとの間に渡るバネ線材11が撓むと共にその一部が袋状部の内外に出入りすることで、線材給排口6aと線材挿通孔Wbとの間の相対位置の変化に対応できる。また、袋状部内へのバネ線材11の供給長さを充分に確保しておくことで、切断除去部Wa裏面への弾発力を低下させることもない。   Next, as shown in FIG. 7, the wire rod supply / exhaust port 6a of the guide pipe 6 is separated from the surface of the workpiece W by the shortening operation of the elevating cylinder 7, and laser processing is performed by the operation of the articulated robot 1a as shown in FIG. The laser irradiation part 36a of the head 36 is moved above the cutting start position on the outer periphery of the cutting removal part Wa. At this time, the spring wire 11 extending between the wire supply / exhaust port 6a of the guide pipe 6 and the wire insertion hole Wb of the workpiece W bends, and part of the spring wire 11 enters / exits the bag-like portion, thereby supplying / discharging the wire. It can respond to the change of the relative position between the opening 6a and the wire insertion hole Wb. Further, by ensuring a sufficient supply length of the spring wire 11 into the bag-like portion, the resilience to the back surface of the cut-off portion Wa is not reduced.

次いで、レーザー照射部36aからレーザー光線を照射しつつ多関節ロボット1aを作動させて切断除去部Wa外周のレーザー切断加工を開始する。このとき、図9に示すように、レーザー加工ヘッド36の切断除去部Wa外周の周回に同期するように、前記給排口移動装置14のサーボモータ10の作動によりレーザー加工ヘッド36と共にガイドパイプ6を回転させ、レーザー照射部36a周りに線材給排口6aを回転移動させることで、レーザー照射部36a、線材給排口6a、及び線材挿通孔Wbの相対位置関係を略一定に保つことが可能であり、レーザー光線がバネ線材11を横断し切断することを防止できる。   Next, the articulated robot 1a is operated while irradiating a laser beam from the laser irradiation unit 36a to start laser cutting processing on the outer periphery of the cutting / removing unit Wa. At this time, as shown in FIG. 9, the guide pipe 6 together with the laser processing head 36 is operated by the operation of the servo motor 10 of the supply / exhaust port moving device 14 so as to synchronize with the circumference of the outer periphery of the cutting / removal portion Wa of the laser processing head 36. , And the wire material supply / exhaust port 6a is rotated around the laser irradiation unit 36a, so that the relative positional relationship between the laser irradiation unit 36a, the wire material supply / exhaust port 6a, and the wire material insertion hole Wb can be kept substantially constant. Thus, it is possible to prevent the laser beam from crossing and cutting the spring wire 11.

なお、図9に示すように、平面視円形状の切断除去部Waであれば、その略中心部に形成した線材挿通孔Wbから外周までの距離が全周に渡ってほとんど変化しないが、図10に示すように、例えば平面視方形状の切断除去部Waであれば、その略中心部に形成した線材挿通孔Wbから外周までの距離が比較的大きく変化する。このような変化に対しても、前述の如くガイドパイプ6の線材給排口6aとワークWの線材挿通孔Wbとの間に渡るバネ線材11が撓むと共に袋状部の内外に出入りすることで対応可能である。   As shown in FIG. 9, if the cut-off portion Wa has a circular shape in plan view, the distance from the wire insertion hole Wb formed at the substantially central portion to the outer periphery hardly changes over the entire circumference. As shown in FIG. 10, for example, in the case of the cut-and-removed portion Wa having a square shape in plan view, the distance from the wire insertion hole Wb formed at the substantially central portion to the outer periphery changes relatively greatly. Even in such a change, as described above, the spring wire 11 extending between the wire supply / exhaust port 6a of the guide pipe 6 and the wire insertion hole Wb of the workpiece W bends and goes in and out of the bag-like portion. It is possible to cope with.

また、切断除去部Waの全周を切断する際には、レーザー加工ヘッド36がその軸回りに略一回転することとなるが、切断加工後にレーザー加工ヘッド36の逆転動作を行うか、あるいは全周切断前に一端レーザー光線の照射を停止してレーザー加工ヘッド36の逆転動作を行うことで、特別な構造を用いることなく光ファイバケーブル5やバネ線材11の捻れを抑えることが可能である。また、レーザー加工ヘッド36の自転を切断除去部Wa外周の周回に完全に同期させず、例えば断続的に自転させる等によっても、レーザー光線がバネ線材11を横断しないようにレーザー加工ヘッド36とガイドパイプ6との位相をコントロール可能である。   Further, when cutting the entire circumference of the cutting / removing portion Wa, the laser processing head 36 is rotated substantially once around its axis. By stopping the laser beam irradiation at one end and performing the reverse operation of the laser processing head 36 before the circumferential cutting, the twisting of the optical fiber cable 5 and the spring wire 11 can be suppressed without using a special structure. Further, the laser processing head 36 and the guide pipe are prevented from crossing the spring wire 11 even if the rotation of the laser processing head 36 is not completely synchronized with the circumference of the outer periphery of the cutting and removing portion Wa, for example, intermittently rotates. 6 and the phase can be controlled.

レーザー加工ヘッド36が前記切断開始位置の上方に戻り、切断除去部Wa全周の切断加工が終了すると、該切断除去部WaがワークWから独立したスクラップ片Wcとなる。このとき、スクラップ片Wcがその裏面側に形成された発条体11aの弾発力により保持されてバネ線材11からの抜けが防止されることで、該スクラップ片Wcをバネ線材11により吊り下げて袋状部内への落下を防止できる。   When the laser processing head 36 returns to above the cutting start position and the cutting processing of the entire cutting removal portion Wa is completed, the cutting removal portion Wa becomes a scrap piece Wc independent of the workpiece W. At this time, the scrap piece Wc is held by the elastic force of the strip 11a formed on the back surface side thereof to prevent the scrap piece Wc from coming off from the spring wire 11, so that the scrap piece Wc is suspended by the spring wire 11. The fall into the bag-like part can be prevented.

そして、多関節ロボット1aの作動によりバネ線材11に吊下されたスクラップ片Wcを不図示の排出トレイ上に移動させた後、線材給排装置20の作動によりバネ線材11を回収してこれをスクラップ片Wcから抜き取ることで、スクラップ片Wc裏面側の発条体11aを消失させてその保持を解除し、該スクラップ片Wcを排出トレイに落下させて排出可能である。
なお、上述の工程を繰り返して複数のワークWに対する切断加工を行った後、バネ線材11の巻き癖が弱まった場合には、該バネ線材11の先端側を所定長さだけカットしてその新規部分を順次繰り出して使用すればよい。
And after moving the scrap piece Wc suspended by the spring wire 11 by the action | operation of the articulated robot 1a on the discharge tray not shown, the spring wire 11 is collect | recovered by the action | operation of the wire supply / discharge device 20, and this is collected. By pulling out from the scrap piece Wc, the strip 11a on the back side of the scrap piece Wc disappears and its holding is released, and the scrap piece Wc can be dropped and discharged onto the discharge tray.
In addition, after the above-mentioned process is repeated and cutting is performed on a plurality of workpieces W, when the curl of the spring wire 11 is weakened, the tip end side of the spring wire 11 is cut by a predetermined length and the new What is necessary is just to draw out a part sequentially and to use it.

以上説明したように、上記実施例におけるスクラップ除去方法は、ワークWの袋状部にレーザー切断加工装置1によるレーザー切断加工をする際、該加工により生じたスクラップ片Wcを前記袋状部の外部に排出する方法であって、前記ワークWの切断除去部Waに、前記レーザー切断加工装置1のレーザー加工ヘッド36により線材挿通孔Wbを形成し、該線材挿通孔Wbを通じて前記袋状部内へ巻き癖を有するバネ線材11を供給し、該バネ線材11に前記切断除去部Waの裏側で発条体11aを形成させると共に、前記切断除去部Waの周囲に前記レーザー加工ヘッド36によりレーザー切断加工を施して該切断除去部Waを前記スクラップ片Wcとした後には、前記バネ線材11により前記スクラップ片Wcを吊り下げて前記袋状部の外部に取り出し、かつ前記バネ線材11を回収して前記スクラップ片Wcから抜き取ることで、該スクラップ片Wcを前記袋状部の外部に排出するものである。   As described above, in the scrap removing method in the above embodiment, when laser cutting is performed on the bag-shaped portion of the workpiece W by the laser cutting processing apparatus 1, the scrap piece Wc generated by the processing is removed from the outside of the bag-shaped portion. A wire rod insertion hole Wb is formed in the cut and removed portion Wa of the workpiece W by the laser processing head 36 of the laser cutting processing apparatus 1 and wound into the bag-shaped portion through the wire rod insertion hole Wb. A spring wire 11 having a ridge is supplied, and a striated body 11a is formed on the back side of the cut and removed portion Wa on the spring wire 11 and laser cutting is performed around the cut and removed portion Wa by the laser processing head 36. After the cut and removed portion Wa is made the scrap piece Wc, the bag-like portion is hung from the scrap piece Wc by the spring wire 11. Outside extraction, and the spring wire 11 is recovered by extracting from the scrap pieces Wc, is intended to discharge the scrap piece Wc outside of the bag portion.

この構成によれば、ワークWの切断除去部Waに形成した線材挿通孔Wbを通じて袋状部内へバネ線材11を供給し、該バネ線材11に切断除去部Waの裏側で発条体11aを形成させることで、切断除去部Waがスクラップ片Wcとなった後にはこれをバネ線材11により吊下可能とし、かつ該スクラップ片Wcを袋状部の外部に取り出すと共にバネ線材11を回収してこれをスクラップ片Wcから抜き取ることで、該スクラップ片Wcを袋状部の外部に排出可能となる。
すなわち、線材給排装置20を主にスクラップ除去装置12を簡素に構成でき、設備全体の大型化を抑えると共にスクラップ片Wcの排出を容易かつ確実に行うことができる。また、所定回数のレーザー切断加工に対して同一のバネ線材11を繰り返し用いることができ、加工コストの低減を図ることができる。
According to this configuration, the spring wire 11 is supplied into the bag-like portion through the wire insertion hole Wb formed in the cut and removed portion Wa of the workpiece W, and the spring wire 11 is formed on the back side of the cut and removed portion Wa in the spring wire 11. Thus, after the cutting and removing portion Wa becomes the scrap piece Wc, it can be suspended by the spring wire 11, and the scrap piece Wc is taken out of the bag-like portion and the spring wire 11 is collected and removed. By extracting from the scrap piece Wc, the scrap piece Wc can be discharged to the outside of the bag-like portion.
That is, the wire feeding / discharging device 20 can mainly be configured simply with the scrap removing device 12 to suppress the enlargement of the entire facility and to easily and reliably discharge the scrap piece Wc. Further, the same spring wire 11 can be used repeatedly for a predetermined number of laser cutting processes, and the processing cost can be reduced.

また、上記実施例におけるスクラップ除去装置12は、ワークWの袋状部にレーザー切断加工装置1によるレーザー切断加工をする際、該加工により生じたスクラップ片Wcを前記袋状部の外部に排出する装置であって、前記レーザー切断加工装置1のレーザー加工ヘッド36に隣接する線材給排口6aより巻き癖を有するバネ線材11を給排する線材給排装置20と、前記レーザー加工ヘッド36に対して前記線材給排口6aを移動させる給排口移動装置14と、前記ワークWに対して前記線材給排口6aを進退させる給排口昇降装置13とを備え、前記ワークWの切断除去部Waに形成した線材挿通孔Wbに対し、前記給排口昇降装置13により前記線材給排口6aを近接させ、前記線材給排装置20により前記線材挿通孔Wbを通じて前記袋状部内へ前記バネ線材11を供給し、該バネ線材11に前記切断除去部Waの裏側で発条体11aを形成させると共に、前記切断除去部Waの周囲に前記レーザー加工ヘッド36によりレーザー切断加工を施して該切断除去部Waを前記スクラップ片Wcとした後には、前記バネ線材11により前記スクラップ片Wcを吊り下げて前記袋状部の外部に取り出し、かつ前記線材給排装置20により前記バネ線材11を回収して前記スクラップ片Wcから抜き取ることで、該スクラップ片Wcを前記袋状部の外部に排出するものである。   In addition, when the scrap removing device 12 in the above-described embodiment performs laser cutting processing on the bag-shaped portion of the workpiece W by the laser cutting processing device 1, the scrap piece Wc generated by the processing is discharged to the outside of the bag-shaped portion. A wire rod supply / discharge device 20 that feeds and discharges a spring wire 11 having a curl from a wire rod supply / discharge port 6a adjacent to the laser processing head 36 of the laser cutting processing device 1, and the laser processing head 36. A wire supply / discharge port moving device 14 for moving the wire supply / discharge port 6a, and a supply / discharge port lifting / lowering device 13 for moving the wire supply / discharge port 6a forward and backward with respect to the workpiece W. The wire rod supply / exhaust device 13 is brought close to the wire rod insertion hole Wb formed in Wa, and the wire rod supply / discharge device 20 passes through the wire rod insertion hole Wb. The spring wire 11 is supplied into the bag-like portion, and the spring wire 11 is formed with the striated body 11a on the back side of the cut and removed portion Wa, and the laser processing head 36 performs laser cutting around the cut and removed portion Wa. After the cut and removed portion Wa is processed into the scrap piece Wc, the scrap piece Wc is suspended by the spring wire 11 and taken out of the bag-like portion, and the wire feeding / discharging device 20 By collecting the spring wire 11 and extracting it from the scrap piece Wc, the scrap piece Wc is discharged to the outside of the bag-like portion.

この構成によれば、上記スクラップ除去方法と同様の作用効果に加え、ワークWに対して線材給排口6aを進退させることで、線材挿通孔Wbにバネ線材11を確実に挿通できると共に、その後に線材給排口6aをレーザー加工ヘッド36と共に比較的自由に移動させることが可能となり、簡素な構成で様々な形状のレーザー切断加工に対応できる。このとき、レーザー加工ヘッド36からのレーザー光線がバネ線材11を横断しないように線材給排口6aを移動させつつレーザー切断加工を行うことが可能となり、レーザー加工ヘッド36が切断除去部Wa外周を往復動等しなくとも一度の周回のみで全周をカットすることが可能となり、加工コストのさらなる低減を図ることができる。   According to this configuration, in addition to the same effect as the scrap removing method, by moving the wire supply / exhaust port 6a forward and backward with respect to the workpiece W, the spring wire 11 can be reliably inserted into the wire insertion hole Wb, and thereafter In addition, the wire supply / exhaust port 6a can be moved relatively freely together with the laser processing head 36, and various shapes of laser cutting processing can be handled with a simple configuration. At this time, it becomes possible to perform laser cutting while moving the wire supply / exhaust port 6a so that the laser beam from the laser processing head 36 does not cross the spring wire 11, and the laser processing head 36 reciprocates around the outer periphery of the cutting removal portion Wa. Even if it does not move, it becomes possible to cut the entire circumference with only one round, and the processing cost can be further reduced.

なお、この発明は上記実施例に限られるものではなく、例えば上記実施例では、ガイドパイプ6の線材給排口6aをレーザー加工ヘッド36のレーザー照射部36aに対して上下にのみ相対移動可能(昇降可能)とし、前後左右にはガイドパイプ6及びレーザー加工ヘッド36を一体的に水平移動させるようにしたが、これに対し、ガイドパイプ6をレーザー加工ヘッド36に対して相対的に昇降かつ水平移動可能に構成してもよい。この場合、図11に示すように、ガイドパイプ6の線材給排口6aをワークWの線材挿通孔Wbに当接させた状態でレーザー切断加工を行うことができ、切断除去部Wa(スクラップ片Wc)をガイドパイプ6先端と袋状部内の発条体11aとで常時安定して保持した状態で、レーザー切断加工及びスクラップ片Wcの排出作業を行うことができる。   The present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the wire rod supply / exhaust port 6a of the guide pipe 6 can be relatively moved up and down only with respect to the laser irradiation portion 36a of the laser processing head 36 ( The guide pipe 6 and the laser processing head 36 are integrally moved horizontally in the front, rear, left, and right directions. On the other hand, the guide pipe 6 is moved up and down relative to the laser processing head 36 and horizontally. It may be configured to be movable. In this case, as shown in FIG. 11, laser cutting can be performed in a state where the wire supply / exhaust port 6a of the guide pipe 6 is in contact with the wire insertion hole Wb of the workpiece W, and the cutting removal portion Wa (scrap piece) The laser cutting process and the work of discharging the scrap piece Wc can be performed in a state in which Wc) is always stably held by the tip of the guide pipe 6 and the elongated body 11a in the bag-like portion.

この発明の実施例におけるスクラップ除去装置を装着した多関節ロボットを示す斜視図である。It is a perspective view which shows the articulated robot with which the scrap removal apparatus in the Example of this invention was mounted | worn. 図1のA部拡大図である。It is the A section enlarged view of FIG. 図1のB部拡大正面図である。It is the B section enlarged front view of FIG. 図3のA−A断面図である。It is AA sectional drawing of FIG. 上記スクラップ除去装置によりレーザー切断加工時にスクラップ片を除去する工程の第一作動説明図である。It is 1st operation | movement explanatory drawing of the process of removing a scrap piece at the time of laser cutting by the said scrap removal apparatus. 上記工程の第二作動説明図である。It is 2nd operation | movement explanatory drawing of the said process. 上記工程の第三作動説明図である。It is a 3rd operation explanatory view of the above-mentioned process. 上記工程の第四作動説明図である。It is a 4th operation explanatory view of the above-mentioned process. 上記レーザー切断加工時の流れを(a)〜(d)の順で示す作用説明図である。It is effect | action explanatory drawing which shows the flow at the time of the said laser cutting process in order of (a)-(d). 図9と異なるワークに対するレーザー切断加工時の流れを(a)〜(d)の順で示す作用説明図である。FIG. 10 is an operation explanatory diagram illustrating a flow at the time of laser cutting for a workpiece different from FIG. 9 in the order of (a) to (d). 上記実施例の応用例を示す図8に相当する作動説明図である。It is operation | movement explanatory drawing equivalent to FIG. 8 which shows the application example of the said Example.

符号の説明Explanation of symbols

W ワーク
Wa 切断除去部
Wb 線材挿通孔
Wc スクラップ片
1 レーザー切断加工装置
6a 線材給排口
11 バネ線材(線材)
11a 発条体
13 給排口昇降装置(給排口進退手段)
14 給排口移動装置(給排口移動手段)
20 線材給排装置(線材給排手段)
36 レーザー加工ヘッド


W Work Wa Cutting and removing part Wb Wire material insertion hole Wc Scrap piece 1 Laser cutting device 6a Wire material supply / discharge port 11 Spring wire material (wire material)
11a striated body 13 supply / exhaust port lifting / lowering device
14 Supply / exhaust port moving device (supply / discharge port moving means)
20 Wire rod supply / discharge device (wire rod supply / discharge means)
36 Laser processing head


Claims (2)

ワークの袋状部にレーザー切断加工装置によるレーザー切断加工をする際、該加工により生じたスクラップ片を前記袋状部の外部に排出する方法であって、
前記ワークの切断除去部に、前記レーザー切断加工装置のレーザー加工ヘッドにより線材挿通孔を形成し、該線材挿通孔を通じて前記袋状部内へ巻き癖を有する線材を供給し、該線材に前記切断除去部の裏側で発条体を形成させると共に、前記切断除去部の周囲に前記レーザー加工ヘッドによりレーザー切断加工を施して該切断除去部を前記スクラップ片とした後には、前記線材により前記スクラップ片を吊り下げて前記袋状部の外部に取り出し、かつ前記線材を回収して前記スクラップ片から抜き取ることで、該スクラップ片を前記袋状部の外部に排出することを特徴とするレーザー切断加工時のスクラップ除去方法。
A method of discharging scrap pieces generated by the processing to the outside of the bag-shaped portion when performing laser cutting processing on the bag-shaped portion of the workpiece with a laser cutting processing device,
A wire insertion hole is formed in the cut and removal portion of the workpiece by the laser processing head of the laser cutting apparatus, and a wire rod having a curl is supplied into the bag-like portion through the wire insertion hole, and the cutting and removal is performed on the wire rod. After forming the striated body on the back side of the part and performing laser cutting with the laser processing head around the cutting and removing part to make the cutting and removing part the scrap piece, the scrap piece is suspended by the wire rod Scrap at the time of laser cutting processing, wherein the scrap piece is discharged to the outside of the bag-like part by lowering and taking out the bag-like part and collecting the wire rod and extracting it from the scrap piece Removal method.
ワークの袋状部にレーザー切断加工装置によるレーザー切断加工をする際、該加工により生じたスクラップ片を前記袋状部の外部に排出する装置であって、
前記レーザー切断加工装置のレーザー加工ヘッドに隣接する線材給排口より巻き癖を有する線材を給排する線材給排手段と、前記レーザー加工ヘッドに対して前記線材給排口を移動させる給排口移動手段と、前記ワークに対して前記線材給排口を進退させる給排口進退手段とを備え、
前記ワークの切断除去部に形成した線材挿通孔に対し、前記給排口進退手段により前記線材給排口を近接させ、前記線材給排手段により前記線材挿通孔を通じて前記袋状部内へ前記線材を供給し、該線材に前記切断除去部の裏側で発条体を形成させると共に、前記切断除去部の周囲に前記レーザー加工ヘッドによりレーザー切断加工を施して該切断除去部を前記スクラップ片とした後には、前記線材により前記スクラップ片を吊り下げて前記袋状部の外部に取り出し、かつ前記線材給排手段により前記線材を回収して前記スクラップ片から抜き取ることで、該スクラップ片を前記袋状部の外部に排出することを特徴とするレーザー切断加工時のスクラップ除去装置。

A device for discharging a scrap piece generated by the processing to the outside of the bag-shaped portion when laser cutting is performed on the bag-shaped portion of the workpiece by a laser cutting processing device,
Wire supply / discharge means for supplying / discharging a wire rod having a winding rod from a wire supply / exhaust port adjacent to the laser processing head of the laser cutting processing apparatus, and a supply / discharge port for moving the wire supply / exhaust port relative to the laser processing head Moving means, and supply / exhaust port advancing / retreating means for advancing and retracting the wire supply / exhaust port with respect to the workpiece,
The wire rod supply / exhaust means is brought close to the wire rod insertion hole formed in the cut and removal portion of the workpiece, and the wire rod is fed into the bag-like portion through the wire rod insertion hole by the wire rod supply / discharge means. After supplying the wire and forming a strip on the back side of the cutting and removing portion on the wire, laser cutting is performed by the laser processing head around the cutting and removing portion to make the cutting and removing portion the scrap piece. The scrap piece is suspended by the wire rod and taken out of the bag-shaped portion, and the wire rod is collected by the wire rod supply / discharge means and extracted from the scrap piece. A scrap removal device for laser cutting, which is discharged outside.

JP2006169896A 2006-06-20 2006-06-20 Scrap removal method and scrap removal apparatus during laser cutting Expired - Fee Related JP4749947B2 (en)

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