JPS62162837U - - Google Patents
Info
- Publication number
- JPS62162837U JPS62162837U JP1986051103U JP5110386U JPS62162837U JP S62162837 U JPS62162837 U JP S62162837U JP 1986051103 U JP1986051103 U JP 1986051103U JP 5110386 U JP5110386 U JP 5110386U JP S62162837 U JPS62162837 U JP S62162837U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- mounting part
- outer frame
- plane
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986051103U JPS62162837U (enExample) | 1986-04-04 | 1986-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986051103U JPS62162837U (enExample) | 1986-04-04 | 1986-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62162837U true JPS62162837U (enExample) | 1987-10-16 |
Family
ID=30875067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986051103U Pending JPS62162837U (enExample) | 1986-04-04 | 1986-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62162837U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02305456A (ja) * | 1989-05-19 | 1990-12-19 | Sanyo Electric Co Ltd | リードフレームとその加工方法、および半導体装置の製法 |
| JPH04750A (ja) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | 半導体装置用リードフレーム |
| JP2007234737A (ja) * | 2006-02-28 | 2007-09-13 | Denso Corp | 電子部品の接続構造 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195958A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | リ−ドフレ−ム |
-
1986
- 1986-04-04 JP JP1986051103U patent/JPS62162837U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195958A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | リ−ドフレ−ム |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02305456A (ja) * | 1989-05-19 | 1990-12-19 | Sanyo Electric Co Ltd | リードフレームとその加工方法、および半導体装置の製法 |
| JPH04750A (ja) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | 半導体装置用リードフレーム |
| JP2007234737A (ja) * | 2006-02-28 | 2007-09-13 | Denso Corp | 電子部品の接続構造 |