JPS62160538U - - Google Patents

Info

Publication number
JPS62160538U
JPS62160538U JP1986048842U JP4884286U JPS62160538U JP S62160538 U JPS62160538 U JP S62160538U JP 1986048842 U JP1986048842 U JP 1986048842U JP 4884286 U JP4884286 U JP 4884286U JP S62160538 U JPS62160538 U JP S62160538U
Authority
JP
Japan
Prior art keywords
electrode plate
plate
metal
semiconductor device
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986048842U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986048842U priority Critical patent/JPS62160538U/ja
Publication of JPS62160538U publication Critical patent/JPS62160538U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
JP1986048842U 1986-03-31 1986-03-31 Pending JPS62160538U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986048842U JPS62160538U (enExample) 1986-03-31 1986-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986048842U JPS62160538U (enExample) 1986-03-31 1986-03-31

Publications (1)

Publication Number Publication Date
JPS62160538U true JPS62160538U (enExample) 1987-10-13

Family

ID=30870751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986048842U Pending JPS62160538U (enExample) 1986-03-31 1986-03-31

Country Status (1)

Country Link
JP (1) JPS62160538U (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135465A (en) * 1975-05-20 1976-11-24 Mitsubishi Electric Corp Semi-conductor unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135465A (en) * 1975-05-20 1976-11-24 Mitsubishi Electric Corp Semi-conductor unit

Similar Documents

Publication Publication Date Title
JPS62160538U (enExample)
JPS60195163U (ja) 板状半田
JPH0258393U (enExample)
JPH0730656Y2 (ja) オゾン発生用放電体
JPS5810374Y2 (ja) 混成集積回路基板
JPS6395271U (enExample)
JPS6316423U (enExample)
JPS61207038U (enExample)
JPS61149354U (enExample)
JPH02148569U (enExample)
JPH0289819U (enExample)
JPS6379628U (enExample)
JPS62107483U (enExample)
JPH02146868U (enExample)
JPS6016568U (ja) 光起電力装置
JPS6322073U (enExample)
JPS5929027U (ja) 電子部品
JPS5811243U (ja) パワトランジスタの取付構造
JPS631303U (enExample)
JPS5839050U (ja) 積層形半導体冷却体
JPS59146960U (ja) 混成集積回路
JPS6325418U (enExample)
JPS6292644U (enExample)
JPS62199970U (enExample)
JPS6181162U (enExample)