JPS62157403A - Manufacture of both-side metal clad dielectric base for plane antenna - Google Patents

Abstract

PURPOSE:To attain excellent high frequency characteristic, heat resistance, smoothness and weatherobility by using a silane denatuard crosslinked polyethylene. CONSTITUTION:In the titled manufacture, the entire rear face of a dielectric base is used as a ground conductor and the surface is provided with a circularly polarized wave radiation microstrip element in the both-side metal clad dielectric base for a plane antenna, a silane denatuard crosslinked polyethylene is used as part of the dielectric, which is formed into the silane denatuard crosslinked polyethylene by heat forming. Thus, the polyethylene with a small gel forming ratio (in fact not cross-linked) before press forming is bonded to a copper foil while being crosslinked by heat/press forming, they are incorporated strongly to obtain a plane antenna base with excellent heat resistance and dielectric characteristic. As required, glass cloth, epoxy resin impregnated glass cloth prepreg, fluorine group resin sheet or film, or a fluororesin impregnated glass cloth prepreg and a silane denatuard crosslinked polyethylene sheet or film are made composite to improve various characteristic such as heat resistance and weatherobility.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a double-sided metal-clad dielectric substrate for a planar antenna with extremely low dielectric loss.0 [Prior Art] Regarding the technical content of a planar antenna, etc. [Planar antenna J (N), which is being developed for future satellite broadcast reception.
IKKEI ELECTRONIC51984,7,1
6) is explained in detail. Planar antennas are being developed for satellite broadcast reception, and are characterized by being less affected by snowfall and wind pressure than standard laboratory antennas, but at present they have slightly lower gain. , a cross-linked polyethylene substrate is used. Such dielectric substrates are expensive, have large dielectric loss, cannot obtain high gain, have problems with workability during the manufacturing process of planar antennas, have problems with the adhesion of microstrip elements, and have problems with flat surfaces. There are problems with smoothness (no cracks), heat resistance, dimensional stability, weather resistance, etc. as an antenna, and improvements are needed.

[Purpose of the invention]

The present invention uses silane-modified crosslinkable polyethylene in order to obtain excellent high-frequency characteristics, heat resistance, smoothness, weather resistance, etc. that could not be obtained with conventional dielectric substrates for planar antennas. The present invention was completed based on the knowledge that the above characteristics can be improved.

[Structure of the invention]

The present invention provides a method for manufacturing a double-sided metal-clad dielectric substrate for a planar antenna, in which the entire back surface of the dielectric substrate is used as a ground conductor, and a circularly polarized wave radiation microscopy (IJ) fluoride element is provided on the surface.
Silane-modified crosslinkable yt as at least part of the dielectric
This is a method of manufacturing a heating body substrate using IJ ethylene.

The silane-modified crosslinkable se17ethylene eζ used in the present invention is described in detail in Japanese Patent Publication No. 60-49422. A copper foil is laminated on one side of the silane-modified crosslinkable ethylene layer having a thickness of 0.03 to 3-0 m+, and a copper foil or an aluminum plate is laminated on the other side, and the platen temperature is 180°C and pressed. By heating and pressing at a pressure of 20 kf/J and integrally molding, a double-sided metal-clad dielectric substrate for a planar antenna can be provided.

In this case, the gel fraction of the silane-modified crosslinkable polyethylene is preferably 20% or less in terms of adhesion to copper foil, moldability, etc., and particularly preferably 5% or less. If it is more than 20%, the adhesion to the copper foil is insufficient.

The gel fraction of the silane-modified crosslinked polyethylene after hot-pressure molding is usually 70% or more, preferably 50% or more, and 80% or more.

In the present invention, before hot-pressing molding, SerieTile® with a small gel fraction (virtually non-crosslinked) is cross-linked by hot-pressing molding, and then it is bonded to the tug-of-war foil and firmly integrated. Excellent heat resistance,
A substrate for a planar antenna with excellent electromagnetic characteristics can be obtained. The dielectric substrate has a frequency of 12 GHz (
12x 10'Hz), dielectric constant 2,2 at 25°C
, and the dielectric loss tangent is 25×10−′. Furthermore, the heat deformation temperature is 120° C. or higher, and it has relatively excellent properties in terms of weather resistance, dimensional stability, warping, etc.

Based on the laminated structure of the dielectric, if necessary, glass cloth, ezoxy resin-impregnated glass cloth presoleg, fluororesin (for example, Teflon ■, etc.) sheet or film, fluororesin-impregnated glass cloth clipreg, presulfone may be added. , deriether sulfo/, hyrietherimide, or other engineering plastic sheet or film with excellent high frequency properties and the silane-modified crosslinkable ethylene sheet or film are combined to improve properties such as heat resistance and weather resistance. can also be measured. Furthermore, the dielectric constant can be lowered by dispersing hollow glass microballoons in silane-modified recrosslinkable polyethylene.

Regarding silane-modified cross-linkable pyriethylene,
-49422, it is possible to use Moldex ■ made by Tensei Bakelite ■. Although it is desirable to use a silanol condensation catalyst and heating in combination for crosslinking of Soldex (1), a moderately crosslinked product can be obtained by heating alone at 150° C. for 60 minutes or more.

When using a silanol condensation catalyst, it may be applied to the surface of a silane-modified crosslinkable pyriethylene sheet or film and heated, or when using the epoxy resin-impregnated glass cloth prepreg, it may be applied to the surface of a silane-modified crosslinkable pyriethylene sheet or film. It may be added in advance. The silanol condensation catalyst is described in detail in JP-A-59-221324.

The gel fraction can be determined in percentage by dividing the weight of the silane-modified crosslinked 41J ethylene after dissolving in a 120'C xylene solution for 24 hours by the weight before dissolution.

[Effects of the Invention] According to the present invention, a double-sided metal-clad dielectric substrate for a planar antenna that is excellent in high frequency characteristics, heat resistance, dimensional stability, and weather resistance can be manufactured.

Therefore, as part of the future satellite broadcasting reception system,
This will make a major contribution to its spread.

〔Example〕

Examples and comparative examples of the double-sided metal-clad dielectric substrate for a flat antenna according to the present invention will be described below.

Example-1 35 μm thick electrolytic copper electrolytic steel foil 0 μm thick Moldex ■ film / 2. Ortan thick aluminum plates were laminated in this order and integrally molded by heating and pressing at a temperature of 180° C. and a pressure of 20 kF/u.

Example-2 35 μm thick oxygen-free steel foil/800 μm thick Moldenox film/2. Oym thick aluminum plates were laminated in this order and integrally molded by heating and pressing at a temperature of 180'C and a pressure of 20°C.

Example-3 35 μm thick oxygen-free steel foil 150 μm thick Teflon film / 80011 m thick Moldex film / 2.0
A Sonatsu aluminum plate is laminated on this layer, and the temperature is kept at 350℃.
It was integrally molded by heating and pressing at a temperature of 20 ky/cm.

Example-4 35μm thick electrolytic copper electrolysis 5oI! m thickness Teflon ■ film / 200μm thickness Teflon glass prepreg / 600
Irm thick Moldex ■ film / 2.0mm thick fulminium plate was laminated on this item, and the temperature was 350℃ and the pressure was 4.
It was heated and pressurized at 0 kf/- to be integrally molded.

Example-5 35 #1 thick oxygen-free steel foil / 200 μm thick Moldenox ■ film / 100 μm Jl car y scross 1500 μm thick Moldenox ■ film / 2. Owm thick aluminum plates were laminated in this order, and the temperature was 180'C1 and the pressure was 20°C.
It was integrally molded by heating and pressing at kp/cJt.

Example-6 35 μm thick R-free raw steel copper foil / 200 μm thick Moldex ■ film / 100 μm thick glass cloth 15ooIRn
Thick Moldex■ film/35 μm thick R11 bare copper foil 150 μm thick epixy resin adhesive film/2. .

A simple aluminum plate was laminated to this condyle, and the temperature was silently lowered to 18
It was integrally molded by heating and pressing at 0°C and a pressure of 20 ky/J.

Example-7 35 μm thick electrolytic copper foil containing 80% sparoon.

μm thick Moldex ■ film / 2. Ovan thick aluminum plates were laminated in this order and integrally molded by heating and pressing at a temperature of 180° C. and a pressure of 20 kp/cJt.

Comparative Example-1 35 μm thick electrolytic copper electrolytic 50 μm thick Teflon film/
200μm thick Teflon ■ 4 pieces of glass cloth prepreg 1
A 50 μm thick Teflon film and a 2.0 m thick aluminum plate were laminated in this order and integrally molded by heating and pressing at a temperature of 350° C. and a press pressure of 4 kg/cr;l.

Comparative Example 2 A 35 μm thick electrolytic copper electrolytic steel foil, a 0 μm thick cross-linked 17 ethylene film, and a low thickness aluminum plate were laminated with this INF and silently heated and pressed at a temperature of 350° C. and a press pressure of 40 mm/d to integrally form.

The materials used in the Examples and Comparative Examples will be explained.

Moldex ■: Silane-modified cross-linkable polyethylene film made by Sumitomo Bakelite ■ (gel fraction 5%) In Example 7, before press molding, a stun BH of trivalent compound synthesis ■ was added to the surface of the sheet as a silanol condensation catalyst. A dilute solution of (10 wt % dilute solution with acetone) was applied.

2.0% thick aluminum plate: The adhesive surface is anodized,
We aimed to improve adhesive strength.

Oxygen-free steel foil: Hitachi Cable ■Cracked OFC foil Teflon ■Film: Mitsui Fluorochemical ■Cracked PFA film Teflon/glass cloth prepreg: Toppan Printing ■Chemfap ■T, C, G, F No 1008 epoxy resin adhesive film: Made by Toshi■ No ISO-# OX-
072F Glass microballoon: Geosphere (average particle size 3 μm > 10 wt% 6fr) from Fuji Gel Sales ■ Solidur cross-linked ethylene sheet: Solidur ■ from Solidur Diamond ■ Double-sided metal cladding obtained in Examples and Comparative Examples In order to evaluate the characteristics of the dielectric substrate, we etched a copper foil to form a strip line and set it at a frequency of 12 GHz ("12 x 1
The dielectric constant (g) and dielectric loss tangent (ten δ) were measured at a temperature of 25° C. (09 Hz). The results are shown in Table-1. By the way, what about dielectric loss in high frequency circuits? ) is t-ten
Since it is proportional to the product of δ, it is desirable that it be small.

As can be seen from Table 1, the double-sided metal-clad dielectric substrates obtained in Examples 1 to 7 are lower in price, have a lower dielectric constant, a lower dielectric loss tangent, and are more compatible with copper foil than the comparative examples. It has high adhesion strength and excellent solder heat resistance, making it an extremely excellent material for planar antennas.

The difference between electrolytic steel foil and oxygen-free copper foil is not clear in Table 1, but as a result of evaluating the gain as an actual planar antenna, the oxygen-free copper foil was 1 dB better. It was revealed.

Moreover, by adopting the configuration of Example-6, Example-5
In comparison, the gain was as high as 0.5 dB due to the fact that radio waves could be radiated from the oxygen-free copper foil surface, which had a relatively smooth surface, rather than from the roughened aluminum plate.

JIS test method for copper foil adhesion strength and soldering heat resistance
According to C6481.

Claims (3)

[Claims] (1) In a method for manufacturing a double-sided metal-clad dielectric substrate for a planar antenna in which the entire back surface of the dielectric substrate is used as a ground conductor and a circularly polarized wave radiation microstrip element is provided on the surface, a silane-modified crosslinker is used as at least a part of the dielectric. 1. A method for manufacturing a double-sided metal-clad dielectric substrate for a planar antenna, comprising using polyethylene and converting it into silane-modified cross-linked polyethylene by heat molding. (2) The method for manufacturing a double-sided metal-clad dielectric substrate according to claim 1, wherein the metal on at least one surface of the dielectric is oxygen-free copper foil. (3) The method for manufacturing a double-sided metal-clad dielectric substrate according to claim 1, wherein the silane-modified crosslinkable polyethylene contains hollow glass microballoons.