JPS63126120A - Substrate for planar antenna - Google Patents
Substrate for planar antennaInfo
- Publication number
- JPS63126120A JPS63126120A JP27197486A JP27197486A JPS63126120A JP S63126120 A JPS63126120 A JP S63126120A JP 27197486 A JP27197486 A JP 27197486A JP 27197486 A JP27197486 A JP 27197486A JP S63126120 A JPS63126120 A JP S63126120A
- Authority
- JP
- Japan
- Prior art keywords
- planar antenna
- substrate
- oxygen
- foil
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims description 18
- 239000011888 foil Substances 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920003020 cross-linked polyethylene Polymers 0.000 description 2
- 239000004703 cross-linked polyethylene Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- WCVOGSZTONGSQY-UHFFFAOYSA-N 2,4,6-trichloroanisole Chemical class COC1=C(Cl)C=C(Cl)C=C1Cl WCVOGSZTONGSQY-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Insulated Conductors (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は誘電体損が小さく、安定した高利得が得られる
平面アンテナ用基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate for a planar antenna that has low dielectric loss and provides stable high gain.
平面アンテナは、衛星放送受信用に開発が進められてお
り、ノぞラボラアンテナと比較して、積雪、風圧の影響
が少ないことを特長としている。Planar antennas are being developed for satellite broadcast reception, and are characterized by being less affected by snow accumulation and wind pressure than Nozo Labo antennas.
ただし、現時点では利得が若干低いという問題点があり
、その改良が望まれている。However, at present, there is a problem that the gain is slightly low, and an improvement is desired.
従来平面アンテナ用誘電体基板には、フッ素樹脂・ガラ
スファイバー、架橋ぎりエチレンが誘電体として使用さ
れている。このような訪電体制料は、誘電体損が未だ大
きく、平面アンテナ実用化のためにその改良を必要とし
ている。Conventionally, fluororesin, glass fiber, and cross-linked ethylene have been used as dielectric materials in dielectric substrates for planar antennas. Such power visiting system materials still have a large dielectric loss, and need to be improved in order to put them into practical use as planar antennas.
一方、金属箔についても、主として使用されている電解
鋼箔は利得及び@tvj性の点で十分とはいえないもの
である。On the other hand, regarding metal foils, the electrolytic steel foils that are mainly used are not sufficient in terms of gain and @tvj properties.
本発明は、従来の平面アンテナ用基板では得られなかっ
た優れた高周波特性を得ることを目的として種々検討を
進めて完成されたものである。The present invention was completed through various studies aimed at obtaining excellent high frequency characteristics that could not be obtained with conventional planar antenna substrates.
本発明において、誘電体基板としてはフッ素系樹脂、架
橋ポリオレフィンあるいは高融点ポリオレフィン等を使
用することができる。具体的には、47フ化工チレン重
合体、4フッ化エチレン−6フツ化プロピレン共重合体
(FEP)、4フッ化工チレン・ノぞ−フルオロアルキ
ルビニルエーテル共重合体(PFA ) 、エチレン・
47ツ化工チレン共重合体(EFE ’)等のフッ素系
樹脂、放射線架橋、電子線架橋又は化学架橋したプリエ
チレン、分子−150万以上の超高分子1に4+)エチ
レン、タリメチルにンテン等の炭素数4以上のオレフィ
ンを重合したプリオレフィン等を挙げることができ、こ
れらを単独又は混合又は層状に組合せて使用することが
できる。In the present invention, a fluororesin, a crosslinked polyolefin, a high melting point polyolefin, or the like can be used as the dielectric substrate. Specifically, 47-fluorinated tyrene polymer, tetrafluoroethylene-hexafluorinated propylene copolymer (FEP), 4-fluorinated ethylene-fluoroalkyl vinyl ether copolymer (PFA), ethylene.
Fluorine-based resins such as 47-chemically engineered tyrene copolymers (EFE'), radiation crosslinked, electron beam crosslinked or chemically crosslinked polyethylene, ultrahigh polymers with molecules of -1.5 million or more (1 to 4+) ethylene, talimethyl nitene, etc. Examples include preolefins obtained by polymerizing olefins having 4 or more carbon atoms, and these may be used alone, in a mixture, or in a layered combination.
本発明においては、マイクロストリップ素子を形成する
ための金用箔として無酸素銅箔を用いることを特徴とし
ている。The present invention is characterized in that oxygen-free copper foil is used as the gold foil for forming the microstrip element.
無酸素銅箔は、一般的には次のようにして製造される。Oxygen-free copper foil is generally manufactured as follows.
(1)を気録を窒素−−m化炭素混合ガスのような還元
性ガス中で還元し、酸素を除く方法。(1) A method of reducing oxygen in a reducing gas such as a nitrogen-meritized carbon mixed gas to remove oxygen.
(1))電気銅を真空中で融解し、酸素を除く方法。(1)) A method of melting electrolytic copper in a vacuum to remove oxygen.
従って、従来多用されている電解鋼箔と異なシ、酸素含
有量が極めて少なく(3〜10ppm、電解銅箔では3
50 ppm程度)、電気的に有害なCu2Oの形成が
少ないため、電気伝導度がすぐれており、特に高周波信
号伝送に適しているので、平面アンテナのマイクロスト
リップ素子材料として用いた場合、高利得で、すぐれた
誘電特性を有する平面アンテナを製造することができる
。ここで、一般的な平面アンテナ用基板の製造方法の一
例について簡単に説明する。Therefore, unlike the electrolytic steel foil that has been widely used in the past, the oxygen content is extremely low (3 to 10 ppm, while the electrolytic copper foil has an extremely low oxygen content of 3 to 10 ppm.
50 ppm), with little formation of electrically harmful Cu2O, it has excellent electrical conductivity and is particularly suitable for high frequency signal transmission, so when used as a microstrip element material for a planar antenna, it can be used with high gain. , a planar antenna with excellent dielectric properties can be manufactured. Here, an example of a method for manufacturing a general planar antenna substrate will be briefly described.
厚さ1.0〜2. Ovsのアルミニウム板からなる地
導体と厚さ10〜40μmの銅箔等の金属箔との間に誘
電体基板を挿入し、熱器温度250〜350℃、圧力3
0〜50 k7 / cmの条件で加熱加圧して一体化
成形する。Thickness 1.0~2. A dielectric substrate is inserted between a ground conductor made of an Ovs aluminum plate and a metal foil such as copper foil with a thickness of 10 to 40 μm, and the temperature of the heater is 250 to 350°C and the pressure is 3.
It is integrally molded by heating and pressing under conditions of 0 to 50 k7/cm.
誘電体基板は500〜1000μm程度の厚さであり、
750〜850μmが好ましい。The dielectric substrate has a thickness of about 500 to 1000 μm,
750 to 850 μm is preferable.
誘電体基板を構成するシート状物は相互の、あるいは金
属との接着性を向上させるために、予めコロナ放電処理
をしておくことが好ましい。It is preferable that the sheet-like materials constituting the dielectric substrate be subjected to corona discharge treatment in advance in order to improve their adhesion to each other or to metal.
なお、本発明において、無酸素鋼箔と誘電体基板、ある
いは地導体(アルミニウム板)と誘電体基板との間にP
FAやEFE等のフッ素樹脂系シーIを挿入して接着一
体化を容易セすることができる。In addition, in the present invention, P is present between the oxygen-free steel foil and the dielectric substrate, or between the ground conductor (aluminum plate) and the dielectric substrate.
By inserting a fluororesin sheet I such as FA or EFE, it is possible to easily integrate the adhesive.
本発明に従うと、高周波特性、特に誘電特性及び利得の
点で、優れた平面アンテナ用両面金属張り誘電体基板を
得ることができる。According to the present invention, it is possible to obtain a double-sided metal-clad dielectric substrate for a planar antenna that is excellent in terms of high frequency properties, particularly dielectric properties and gain.
従って、今後の衛星放送の受信システムの一環として、
その普及の上で大きな貢献を果すものである。Therefore, as part of the future satellite broadcasting reception system,
This will make a major contribution to its spread.
本発明による平面アンテナ用基板について、以下に実施
例及び比較例により説明する。The planar antenna substrate according to the present invention will be described below using Examples and Comparative Examples.
実施例1
35μm厚無酸素鋼箔/800μm厚の架橋ぼりエチレ
ンシー) / 2. Ottrm厚のアルミニウム板を
この順序に積層し、熱器温度300℃、圧力40kf7
cmで加熱加圧して一体化成形した。Example 1 35 μm thick oxygen-free steel foil/800 μm thick cross-linked ethylene sheet) / 2. Ottrm-thick aluminum plates were laminated in this order, and the heater temperature was 300℃ and the pressure was 40kf7.
It was integrally molded by heating and pressurizing it at a pressure of cm.
実施例2
35μm厚無酸素鋼箔150μm厚のPFAシート/7
00μm厚の架橋ビリエチレンシート150μm厚のP
FAシー) / 2.0 m厚のアルミニウム板をこの
順序で積層し、実施例1と同様にして一体化成形した。Example 2 35 μm thick oxygen-free steel foil 150 μm thick PFA sheet/7
00 μm thick cross-linked polyethylene sheet 150 μm thick P
FA Sea) / 2.0 m thick aluminum plates were laminated in this order and integrally molded in the same manner as in Example 1.
比較例1
35Atm厚電解銅箔/800μm厚の架橋セリエチレ
ンシー) / 2.、 Om厚のアルミニウム板をこの
屓序で積層し、実施例1と同様の条件で一体化成形した
。Comparative Example 1 35 Atm thick electrolytic copper foil/800 μm thick crosslinked seriethylene sheet) / 2. , Om thick aluminum plates were laminated in this order and integrally molded under the same conditions as in Example 1.
無酸素銅箔は日立電線■g OFC箔を、電解銅箔は
古河サーキットフォイル■製 電解銅箔を使用した。The oxygen-free copper foil used was Hitachi Cable ■g OFC foil, and the electrolytic copper foil used was Furukawa Circuit Foil ■.
アルミニウム板は接着力向上のため、接着面を陽極酸化
処理した。The adhesive surface of the aluminum plate was anodized to improve adhesive strength.
各側で得られた平面アンテナ用基板について、銹電率、
誘電正接及び利得を測定し、その結果を第1表に示す。For the planar antenna substrate obtained on each side, the galvanic rate,
The dielectric loss tangent and gain were measured and the results are shown in Table 1.
実施例1及び2で得られた基板は、低誘電率、低誘電正
接及び高利得であることがわかる。It can be seen that the substrates obtained in Examples 1 and 2 have a low dielectric constant, a low dielectric loss tangent, and a high gain.
第 1 表 測定方法は次の通9である。Chapter 1 Table The measurement method is as follows.
誘電率、胡電正接:銅箔面をエツチングしてストリップ
ラインを形成し、周波数12 Gl(zで測定した。Dielectric constant, electric dissipation tangent: The copper foil surface was etched to form a strip line, and measured at a frequency of 12 Gl (z).
利 得:角錐ホーン(標準アンテナ)との比較測定によ
シ求めた。Gain: Determined through comparative measurements with a pyramidal horn (standard antenna).
(小口、太田著、「マイクロ波、ミリ波測定」コロナ社
昭和54年12月10日発行、215〜216頁参照
)(Refer to Koguchi and Ota, “Microwave and Millimeter Wave Measurement,” Corona Publishing, December 10, 1978, pp. 215-216)
Claims (1)
波放散マイクロストリップ素子を形成するための金属箔
を設けてなる平面アンテナ用基板において、前記金属箔
が無酸素鋼箔であることを特徴とする平面アンテナ用基
板。(1) A planar antenna substrate in which the entire back surface of a dielectric substrate is used as a ground conductor and a metal foil for forming a circularly polarized wave dissipating microstrip element is provided on the surface, wherein the metal foil is an oxygen-free steel foil. A planar antenna substrate characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27197486A JPS63126120A (en) | 1986-11-17 | 1986-11-17 | Substrate for planar antenna |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27197486A JPS63126120A (en) | 1986-11-17 | 1986-11-17 | Substrate for planar antenna |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63126120A true JPS63126120A (en) | 1988-05-30 |
Family
ID=17507394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27197486A Pending JPS63126120A (en) | 1986-11-17 | 1986-11-17 | Substrate for planar antenna |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63126120A (en) |
-
1986
- 1986-11-17 JP JP27197486A patent/JPS63126120A/en active Pending
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