JPS62157145U - - Google Patents
Info
- Publication number
- JPS62157145U JPS62157145U JP4661786U JP4661786U JPS62157145U JP S62157145 U JPS62157145 U JP S62157145U JP 4661786 U JP4661786 U JP 4661786U JP 4661786 U JP4661786 U JP 4661786U JP S62157145 U JPS62157145 U JP S62157145U
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- circuit
- frequency measurement
- measurement circuit
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図はその要部断面図、第３図は従来装置の断面
図である。
図中、３は半導体ウエハ、４はプローブボード
、４ａはプローブ針、６はテスタ、６ａは主テス
ト回路、７はケーブル、２０は回路基板、２０ａ
はソケツト部、２１は高周波測定回路、２２は高
周波マツチングケーブルである。なお、各図中同
一符号は同一又は相当部分を示す。
FIG. 1 is a cross-sectional view showing an embodiment of this invention, FIG. 2 is a cross-sectional view of a main part thereof, and FIG. 3 is a cross-sectional view of a conventional device. In the figure, 3 is a semiconductor wafer, 4 is a probe board, 4a is a probe needle, 6 is a tester, 6a is a main test circuit, 7 is a cable, 20 is a circuit board, 20a
21 is a socket portion, 21 is a high frequency measurement circuit, and 22 is a high frequency matching cable. Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
触するプローブ針を有するプローブボード、この
プローブボードにソケツト部を介して接続される
と共に本体に対し着脱自在に略水平配置された回
路基板、この回路基板に配置された高周波測定回
路、この高周波測定回路と上記ソケツト部とを接
続する高周波マツチングケーブル、及び上記高周
波測定回路にケーブルを介して接続される主テス
ト回路を有するテスタを備えた半導体ウエハプロ
ービング装置。 A probe board having a probe needle that contacts an electrode on the upper surface of an IC wafer arranged approximately horizontally, a circuit board connected to this probe board via a socket portion and arranged approximately horizontally so as to be detachable from the main body, and this circuit. A semiconductor wafer comprising a tester having a high frequency measurement circuit arranged on a substrate, a high frequency matching cable connecting the high frequency measurement circuit and the socket part, and a main test circuit connected to the high frequency measurement circuit via a cable. Probing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4661786U JPS62157145U (en) | 1986-03-26 | 1986-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4661786U JPS62157145U (en) | 1986-03-26 | 1986-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62157145U true JPS62157145U (en) | 1987-10-06 |
Family
ID=30866445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4661786U Pending JPS62157145U (en) | 1986-03-26 | 1986-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62157145U (en) |
-
1986
- 1986-03-26 JP JP4661786U patent/JPS62157145U/ja active Pending
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