JPS62154680U - - Google Patents
Info
- Publication number
- JPS62154680U JPS62154680U JP4246886U JP4246886U JPS62154680U JP S62154680 U JPS62154680 U JP S62154680U JP 4246886 U JP4246886 U JP 4246886U JP 4246886 U JP4246886 U JP 4246886U JP S62154680 U JPS62154680 U JP S62154680U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal case
- filled
- sealing
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 2
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は、この考案の一実施例を示す樹脂封止
型電子機器の製作工程を説明するための断面図、
第２図は上記樹脂封止型電子機器に用いる金属ケ
ースを製作するための長尺金属素材の外観図、第
３図Ａ，Ｂ，Ｃは上記長尺金属素材から形成した
金属ケースの加工、および使用態様を説明するた
めの外観図、および断面図、第４図Ａ，Ｂは従来
の樹脂封止型電子機器に用いられる金属ケースの
外観図、およびその使用態様を説明するための断
面図である。
１０……金属ケース、１１……断面コ字形の長
尺金属素材、１２……樹脂層、１３……電子部品
、１４……外部リード、１５……回路基板、１６
……樹脂封止層。
FIG. 1 is a sectional view for explaining the manufacturing process of a resin-sealed electronic device showing an embodiment of the invention;
Fig. 2 is an external view of a long metal material for manufacturing a metal case used for the resin-sealed electronic device, and Fig. 3 A, B, and C show processing of the metal case formed from the elongated metal material. FIGS. 4A and 4B are external views and cross-sectional views of metal cases used in conventional resin-sealed electronic devices, and cross-sectional views to explain how they are used. It is. DESCRIPTION OF SYMBOLS 10... Metal case, 11... Long metal material with U-shaped cross section, 12... Resin layer, 13... Electronic component, 14... External lead, 15... Circuit board, 16
...Resin sealing layer.
Claims (1)
に切り出され、両端面が開口した金属ケースと、
この金属ケースの内面に形成され、当該金属ケー
スおよび内部に充填される封止樹脂との接着性の
良好な薄い樹脂層と、前記金属ケース内に充填さ
れ、電子部品を樹脂封止する樹脂封止層とを備え
たことを特徴とする樹脂封止型電子機器。 A metal case cut out to a predetermined length from a long metal material with a roughly U-shaped cross section and open on both ends;
A thin resin layer is formed on the inner surface of the metal case and has good adhesion to the metal case and the sealing resin filled inside, and a resin seal is filled in the metal case and resin-seals the electronic components. A resin-sealed electronic device characterized by comprising a sealing layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4246886U JPS62154680U (en) | 1986-03-25 | 1986-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4246886U JPS62154680U (en) | 1986-03-25 | 1986-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62154680U true JPS62154680U (en) | 1987-10-01 |
Family
ID=30858405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4246886U Pending JPS62154680U (en) | 1986-03-25 | 1986-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154680U (en) |
-
1986
- 1986-03-25 JP JP4246886U patent/JPS62154680U/ja active Pending
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