JPS62152449U - - Google Patents

Info

Publication number
JPS62152449U
JPS62152449U JP1986039725U JP3972586U JPS62152449U JP S62152449 U JPS62152449 U JP S62152449U JP 1986039725 U JP1986039725 U JP 1986039725U JP 3972586 U JP3972586 U JP 3972586U JP S62152449 U JPS62152449 U JP S62152449U
Authority
JP
Japan
Prior art keywords
cap
substrate
semiconductor
coefficient
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986039725U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986039725U priority Critical patent/JPS62152449U/ja
Publication of JPS62152449U publication Critical patent/JPS62152449U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/877Bump connectors and die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Pressure Sensors (AREA)
JP1986039725U 1986-03-20 1986-03-20 Pending JPS62152449U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986039725U JPS62152449U (enExample) 1986-03-20 1986-03-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986039725U JPS62152449U (enExample) 1986-03-20 1986-03-20

Publications (1)

Publication Number Publication Date
JPS62152449U true JPS62152449U (enExample) 1987-09-28

Family

ID=30853161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986039725U Pending JPS62152449U (enExample) 1986-03-20 1986-03-20

Country Status (1)

Country Link
JP (1) JPS62152449U (enExample)

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