JPS62150606A - Electric contact - Google Patents

Electric contact

Info

Publication number
JPS62150606A
JPS62150606A JP29125585A JP29125585A JPS62150606A JP S62150606 A JPS62150606 A JP S62150606A JP 29125585 A JP29125585 A JP 29125585A JP 29125585 A JP29125585 A JP 29125585A JP S62150606 A JPS62150606 A JP S62150606A
Authority
JP
Japan
Prior art keywords
layer
electrical contact
contact
metal
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29125585A
Other languages
Japanese (ja)
Inventor
俊一 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP29125585A priority Critical patent/JPS62150606A/en
Publication of JPS62150606A publication Critical patent/JPS62150606A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔技術分野〕 この発明は、リレー、スイッチ、コネクターなどに用い
られる電気接点の分野に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field] This invention relates to the field of electrical contacts used in relays, switches, connectors, and the like.

〔背景技術〕[Background technology]

リレー、スイッチ、コネクターなどに用いられるテープ
接点あるいは鋲接点としては、Ag層またはAg層にC
u、Ni、CdOなどの金属あるいは化合物を含む材料
に、Auめっきが施されたものが一般的であった。
Tape contacts or rivet contacts used in relays, switches, connectors, etc. are made of Ag layer or C
Generally, materials containing metals or compounds such as u, Ni, and CdO were plated with Au.

しかし、このような構成の接点では、Ag層が雰囲気中
に存在する微量の硫黄分の影響を受けてAgzSとなり
、このAgzSがAu表面にまわり込み(クリーピング
現象)、皮膜を形成する。
However, in a contact having such a configuration, the Ag layer becomes AgzS under the influence of a trace amount of sulfur present in the atmosphere, and this AgzS wraps around the Au surface (creeping phenomenon) to form a film.

そのため、接点の性能劣化を来たしていた。とくに、バ
ネ材に溶接するため、Ag層の基台にCu−Ni合金を
用い、Ag層の表面にAuめっきを施した長尺のテープ
接点から小片を切り出して使用するような場合に起こり
やすかった。表面全体にAuめっきを施す鋲接点のよう
な場合においても、表面のAuめっき層に生じている微
小なピンホールを通して、同様なことが起こり、接点と
しての信頼性に問題があった。
As a result, the performance of the contacts deteriorated. This is particularly likely to occur when a small piece is cut out from a long tape contact point that is welded to a spring material using a Cu-Ni alloy as the base of the Ag layer and the surface of the Ag layer is plated with Au. Ta. Even in the case of a stud contact in which the entire surface is plated with Au, a similar problem occurs through minute pinholes formed in the Au plating layer on the surface, resulting in a problem with the reliability of the contact.

他方において、貴金属とくに白金族の金属の値上がりが
著しいため、安価な電気接点の要求は依然として高いも
のがあった。したがって、貴金属めっきの厚みを極力う
ずくすることが好ましtl。
On the other hand, since the prices of precious metals, particularly platinum group metals, have increased significantly, there remains a high demand for inexpensive electrical contacts. Therefore, it is preferable to reduce the thickness of the precious metal plating as much as possible.

〔発明の目的〕[Purpose of the invention]

以上の点に鑑み、この発明は硫化雰囲気による影響に強
く、耐環境性にすぐれ、かつ安価な電気接点を提供する
ことを目的とする。
In view of the above points, it is an object of the present invention to provide an electrical contact that is resistant to the effects of a sulfiding atmosphere, has excellent environmental resistance, and is inexpensive.

〔発明の開示〕[Disclosure of the invention]

上記目的を達成するため、この発明は、Ag層の表面を
熱電気的性質にすぐれた金属で覆う電気接点において、
前記Ag層が5〜30%のPdを含むことを特徴とする
電気接点を要旨とする。
In order to achieve the above object, the present invention provides an electrical contact in which the surface of an Ag layer is covered with a metal having excellent thermoelectric properties.
The gist of the present invention is an electrical contact characterized in that the Ag layer contains 5 to 30% Pd.

以下にこれを詳しく説明する。This will be explained in detail below.

この発明では、従来のAg層と異なりAg−5〜30%
Pd合金を用いる。ここに、%とは重量%を言う。Pd
の量が5%未満であると所定の効果を発揮し得ない。P
dO量が40%を越えると、Agの耐硫化には効果があ
るが、コストの上昇は避けられず、安価な電気接点を得
ることは難しい。しかも、コストの上昇の割には、Ag
zSの耐クリーピング性は向上しない。
In this invention, unlike the conventional Ag layer, Ag-5 to 30%
Pd alloy is used. Here, % means weight %. Pd
If the amount is less than 5%, the desired effect cannot be achieved. P
When the amount of dO exceeds 40%, it is effective in preventing Ag from sulfidation, but an increase in cost is unavoidable, making it difficult to obtain inexpensive electrical contacts. Moreover, considering the increase in cost, Ag
The creeping resistance of zS does not improve.

Ag−5〜30%Pd合金の作成は、通常のAg−Pd
合金の場合と何ら異なるところがなく、とくに困難な問
題はない。
The creation of Ag-5~30%Pd alloy is done by using ordinary Ag-Pd
There is no difference from the case of alloys, and there are no particularly difficult problems.

Ag層の表面を被覆する金属は、接点材料の使用目的に
応じて選択される熱電気的性質にすぐれたものであれば
よい。すなわち、耐アーク性、耐溶着性を重視する接点
には、pt、Re、Qs。
The metal that covers the surface of the Ag layer may be any metal that has excellent thermoelectric properties and is selected depending on the intended use of the contact material. That is, for contacts where arc resistance and welding resistance are important, pt, Re, and Qs are used.

Ir、Rhまたはこれらの合金が好ましい。他方、耐食
性、電気伝導性を重視する接点には、AuまたはAu−
Co、Au−Ni、 Au−In、 Au−Ag、Au
−Pdといった合金が好ましい。
Ir, Rh or alloys thereof are preferred. On the other hand, for contacts where corrosion resistance and electrical conductivity are important, Au or Au-
Co, Au-Ni, Au-In, Au-Ag, Au
-Pd alloys are preferred.

そして、被覆する金属の厚みは、コスト面および性能面
からみて、上記のような金属であれば0.1〜5. O
ttmの範囲の厚みで十分である。
In terms of cost and performance, the thickness of the metal to be coated is 0.1 to 5. O
A thickness in the range of ttm is sufficient.

Ag層の表面に上記金属を被覆する方法とじては、一般
によく用いられる方法、たとえば、めっき法あるいは合
わせ圧延法などがある。この発明を実施するに当たり、
いずれの方法を用いても、とくに困難な問題が生ずると
言うようなことはない。
As a method for coating the surface of the Ag layer with the above-mentioned metal, there are commonly used methods such as a plating method or a rolling method. In carrying out this invention,
No particular problem arises no matter which method is used.

(実施例1) 長尺の三層構造を有するテープ接点を作成し、ついで、
第1図に示すような形状の接点1に切り出した。この接
点1は、基台2にCu−Ni合金を、その上層3にAg
−7,10,25%Pd合金を用い、さらに、その表面
4に厚みが0.2−となるようAuめっきを施したもの
である。Auめっきは通常の方法で行った。
(Example 1) A long tape contact having a three-layer structure was created, and then,
A contact 1 having a shape as shown in FIG. 1 was cut out. This contact 1 has a base 2 made of Cu-Ni alloy and an upper layer 3 made of Ag.
-7, 10, 25% Pd alloy is used, and the surface 4 is further plated with Au to a thickness of 0.2-. Au plating was performed using a conventional method.

比較例として、基台2にはCu−Ni合金を、その上層
3にはPdを含まないAgおよびPdを3%含むAgを
用い、その表面4には厚みが0.2μmとなるようAu
めっきを施したものを用意した。これらの電気接点を、
H2S雰囲気3±1 ppm、温度40°C1相対湿度
95%の条件下に長時間露し、Agz Sの表面へのク
リーピングの有無を経時的に調査した。
As a comparative example, the base 2 is made of a Cu-Ni alloy, the upper layer 3 is made of Ag that does not contain Pd and Ag that contains 3% Pd, and the surface 4 is made of Au with a thickness of 0.2 μm.
A plated plate was prepared. These electrical contacts
The Agz S surface was exposed for a long time under conditions of 3±1 ppm H2S atmosphere, 40° C., and 95% relative humidity, and the presence or absence of creeping on the surface of Agz S was investigated over time.

(実施例2) 第2図に示すように、全体をAuめっきで被覆した三層
構造を有する鋲接点11を作成した。基台の上層3には
Ag−10%Pd合金を用いた。
(Example 2) As shown in FIG. 2, a stud contact 11 having a three-layer structure entirely covered with Au plating was prepared. An Ag-10% Pd alloy was used for the upper layer 3 of the base.

他は、実施例1と同様である。The rest is the same as in Example 1.

実施例1.2の結果を第1表に示す。The results of Example 1.2 are shown in Table 1.

入:クリーピングあり −:テスト中止 第1表に示した結果から、この発明にかかる電気接点の
方が、比較例に比べ格段にすぐれた性能を有しているこ
とは明らかである。
On: Creeping present -: Test stopped From the results shown in Table 1, it is clear that the electrical contact according to the present invention has much better performance than the comparative example.

〔発明の効果〕〔Effect of the invention〕

この発明にかかる電気接点は、以上のような構成になっ
ているため、比較的安価な貴金属であるAgを主体にし
ている渥もかかわらず、雰囲気中の硫化現象の影響、と
くにクリーピング性に対する抵抗が強く、したがって耐
環境性にすぐれ、結果的に電気接点の長寿命につながり
、信頼性の高い電気接点を得ることができる。さらに、
高価なPdlを極力低くおさえることができるので、安
価で実用性の高い電気接点が実現可能となる。
Since the electrical contact according to the present invention has the above-described structure, it is resistant to the effects of sulfidation in the atmosphere, especially creeping properties, even though the contacts are mainly made of Ag, which is a relatively inexpensive noble metal. It has a strong resistance and therefore has excellent environmental resistance, resulting in a long life of the electrical contact and a highly reliable electrical contact. moreover,
Since the expensive Pdl can be kept as low as possible, it is possible to realize an inexpensive and highly practical electrical contact.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明にかかる電気接点の一実施例をあられ
す斜視図、第2図はこの発明にかかる電気接点の他の実
施例をあられす断面図である。 1.11・・・電気接点 3・・・Ag層 4・・・A
g層の表面 代理人 弁理士  松 本 武 彦 b41図 第2図 手□市正書(自発 昭和61年 5月 1日 2、発明の名称 電気接点 3、補正をする者 事件との関係    特許出願人 住   所     大阪府門真市大字門真1048番
地名 称(583’)松下電工株式会社 代表者  代表耽帝役胚井貞夫 4、代理人 5、補正により増加する発明の数 な    し 6、補正の対象 明細書 7、補正の内容 (1)  明細書第3頁第4行ないし第7行に「他方・
・・好ましい。」とあるを削除する。 (2)明細書第4頁第1行に「40%」とあるを、「3
0%」と訂正する。 (3)明細書第4頁第4行ないし第5行に「しかも、・
・・しない。」とあるを削除する。 (4)明細書第4頁第12行のrRe、Jと「O3」の
間に、rRu、Jを挿入する。 (5)  明細書第4頁第16行ないし第17行の「好
ましい。」と「そして、」の間に、「Ag層の表面には
、上記金属のうち少なくとも1つが1層または多層に被
覆される。」を挿入する。 (6)明細書第6頁第1表を別紙のとおりに訂正する。
FIG. 1 is a perspective view of one embodiment of the electrical contact according to the invention, and FIG. 2 is a sectional view of another embodiment of the electrical contact according to the invention. 1.11... Electrical contact 3... Ag layer 4... A
G-layer surface agent Patent attorney Takehiko Matsumoto B41 Figure 2 Hand □ City official letter (Spontaneous May 1, 1986 2, Title of invention Electrical contact 3, Relationship with the amended person case Patent application Address: 1048 Kadoma, Kadoma-shi, Osaka Name (583') Matsushita Electric Works Co., Ltd. Representative: Sadao Ugai, representative 4, agent 5, number of inventions to be increased due to amendment 6, subject of amendment Description 7, Contents of amendment (1) On page 3, lines 4 to 7 of the description, “On the other hand,
··preferable. ” will be deleted. (2) "40%" in the first line of page 4 of the specification should be replaced with "30%"
0%” is corrected. (3) On page 4, line 4 or line 5 of the specification, it should be stated that ``Moreover,...
··do not. ” will be deleted. (4) Insert rRu, J between rRe, J and "O3" on page 4, line 12 of the specification. (5) Between "preferable" and "and" on page 4, lines 16 to 17 of the specification, there is a statement that says, "The surface of the Ag layer is coated with at least one of the above metals in one or multiple layers. Insert "." (6) Table 1 on page 6 of the specification is corrected as shown in the attached sheet.

Claims (5)

【特許請求の範囲】[Claims] (1)Ag層の表面を熱電気的性質にすぐれた金属で覆
う電気接点において、前記Ag層が5〜30%のPdを
含むことを特徴とする電気接点。
(1) An electrical contact in which the surface of an Ag layer is covered with a metal having excellent thermoelectric properties, wherein the Ag layer contains 5 to 30% Pd.
(2)熱電気的性質にすぐれた金属が、Au、Pt、R
h、Ru、Pdおよびこれらの合金からなる群から選ば
れた少なくとも1つである特許請求の範囲第1項記載の
電気接点。
(2) Metals with excellent thermoelectric properties include Au, Pt, and R.
2. The electrical contact according to claim 1, which is at least one selected from the group consisting of Ru, Ru, Pd, and alloys thereof.
(3)Ag層の表面を覆う金属の厚みが0.1〜5.0
μmである特許請求の範囲第1項または第2項記載の電
気接点。
(3) The thickness of the metal covering the surface of the Ag layer is 0.1 to 5.0
The electrical contact according to claim 1 or 2, which has a diameter of μm.
(4)Ag層の表面を覆う金属が、めっきによって得ら
れたものである特許請求の範囲第1項ないし第3項のい
ずれかに記載の電気接点。
(4) The electrical contact according to any one of claims 1 to 3, wherein the metal covering the surface of the Ag layer is obtained by plating.
(5)Ag層の表面を覆う金属が、合わせ圧延法によっ
て得られたものである特許請求の範囲第1項ないし第3
項のいずれかに記載の電気接点。
(5) Claims 1 to 3, wherein the metal covering the surface of the Ag layer is obtained by a rolling method.
Electrical contacts described in any of paragraphs.
JP29125585A 1985-12-23 1985-12-23 Electric contact Pending JPS62150606A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29125585A JPS62150606A (en) 1985-12-23 1985-12-23 Electric contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29125585A JPS62150606A (en) 1985-12-23 1985-12-23 Electric contact

Publications (1)

Publication Number Publication Date
JPS62150606A true JPS62150606A (en) 1987-07-04

Family

ID=17766491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29125585A Pending JPS62150606A (en) 1985-12-23 1985-12-23 Electric contact

Country Status (1)

Country Link
JP (1) JPS62150606A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004030907A1 (en) * 2002-10-02 2004-04-15 Fcm Co., Ltd. Laminate comprising silver layer and, formed thereon, layer for stabilizing the same
JPWO2007111017A1 (en) * 2006-03-24 2009-08-06 ウチヤ・サーモスタット株式会社 Clad contact material and method for mounting the clad contact

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54145970A (en) * 1978-05-09 1979-11-14 Matsushita Electric Works Ltd Silver*vanadium alloy sputtering contact
JPS56167339A (en) * 1980-05-26 1981-12-23 Takehiko Yasuda Electronic parts equipped with gold conductive layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54145970A (en) * 1978-05-09 1979-11-14 Matsushita Electric Works Ltd Silver*vanadium alloy sputtering contact
JPS56167339A (en) * 1980-05-26 1981-12-23 Takehiko Yasuda Electronic parts equipped with gold conductive layer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004030907A1 (en) * 2002-10-02 2004-04-15 Fcm Co., Ltd. Laminate comprising silver layer and, formed thereon, layer for stabilizing the same
JPWO2007111017A1 (en) * 2006-03-24 2009-08-06 ウチヤ・サーモスタット株式会社 Clad contact material and method for mounting the clad contact
JP4690454B2 (en) * 2006-03-24 2011-06-01 ウチヤ・サーモスタット株式会社 Clad contact material and method for mounting the clad contact
DE112007000674B4 (en) 2006-03-24 2023-06-07 Uchiya Thermostat Co., Ltd. COATED CONTACT POINT MATERIAL, CONTACT POINT OBJECT AND CONTACT POINT OBJECT ATTACHING METHOD

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