JPH04230914A - Contact element for electrical switching and contact - Google Patents
Contact element for electrical switching and contactInfo
- Publication number
- JPH04230914A JPH04230914A JP9035391A JP9035391A JPH04230914A JP H04230914 A JPH04230914 A JP H04230914A JP 9035391 A JP9035391 A JP 9035391A JP 9035391 A JP9035391 A JP 9035391A JP H04230914 A JPH04230914 A JP H04230914A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- contact
- weight
- palladium
- contact element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 13
- 229910052737 gold Inorganic materials 0.000 claims abstract description 12
- 239000010931 gold Substances 0.000 claims abstract description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 7
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910001020 Au alloy Inorganic materials 0.000 claims abstract description 3
- 239000010953 base metal Substances 0.000 claims abstract description 3
- 239000003353 gold alloy Substances 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 229910017052 cobalt Inorganic materials 0.000 claims description 11
- 239000010941 cobalt Substances 0.000 claims description 11
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 9
- 239000011733 molybdenum Substances 0.000 claims description 9
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 9
- 239000010937 tungsten Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 2
- 229910000531 Co alloy Inorganic materials 0.000 claims 1
- 229910002056 binary alloy Inorganic materials 0.000 claims 1
- 239000012535 impurity Substances 0.000 abstract description 2
- 229910000510 noble metal Inorganic materials 0.000 abstract 1
- 239000010970 precious metal Substances 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 3
- 229910001080 W alloy Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Contacts (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は卑金属からなる支持体に
パラジウムを含有する、メッキまたは陰極スパッタリン
グにより造られる接触支持層が施され、該層は全厚３〜
６μｍを有しかつその少なくとも外側の接触層は層厚少
なくとも０．１μｍを有するパラジウム−銀またはパラ
ジウム−金合金から構成されている電気開閉接触のため
の、特に電磁継電器での使用のための接触素子に関する
。FIELD OF INDUSTRIAL APPLICATION The present invention relates to a support made of a base metal, which is provided with a contact support layer containing palladium, produced by plating or cathodic sputtering, the total thickness of which is 3 to 3.
6 μm and whose at least outer contact layer consists of a palladium-silver or palladium-gold alloy with a layer thickness of at least 0.1 μm, in particular for use in electromagnetic relays. Regarding elements.
【０００２】0002
【従来の技術】開閉接触のためのパラジウムの使用は公
知である（Ｅｌｅｃｔｒｏｎｉｋ １５／１９８１，頁
５３〜６１）。その際メッキの、１〜２μｍのパラジウ
ム層は特に耐摩耗性であると記述されている。そのほか
に、パラジウム層がたいていうすい金層で被覆されるこ
とが指摘されている。しかしパラジウムおよび金のよう
な純貴金属からのこの種の層は非常に高価である。それ
に加えて例えば接触用パラジウムの合金は例えばその材
料厚さのためにすべての場合に適用できるものでない接
触用成形物の形でのみ ＰｄＣｕ または ＡｇＰｄ３
Ｏ が公知である。そのほか多い貴金属成分を有するこ
のような接触成形物は同様に高価である。BACKGROUND OF THE INVENTION The use of palladium for switching contacts is known (Electronik 15/1981, pages 53-61). The 1-2 μm palladium layer of the plating is described as particularly wear-resistant. Additionally, it has been pointed out that the palladium layer is often coated with a thin gold layer. However, such layers from pure precious metals such as palladium and gold are very expensive. In addition, alloys of palladium, for example for contacts, are not applicable in all cases, e.g. due to their material thickness, only in the form of contact moldings such as PdCu or AgPd3.
O is known. In addition, such contact moldings with a high precious metal content are likewise expensive.
【０００３】すでにヨーロッパ特許公開第０２４７５４
１号明細書から冒頭に挙げた種類の接触素子は公知であ
り、そこでは二層接触支持層をメッキにより施されかつ
そこでの両層はパラジウム合金で構成される。該内側層
はパラジウムのほかにニッケル、コバルトおよび／また
は銅の添加成分を有し、一方外側層は銀ないしは金成分
１０〜４０重量％を有するパラジウム−銀またはパラジ
ウム−金から構成されている合金を有する。この公知の
接触支持層は開閉機能の大きな帯域中にわたって使用で
き、その際該接触は非常に小さな電流でもまた非常に大
きい開閉電流および開閉電圧でも使用できる。[0003] Already European Patent Publication No. 024754
A contact element of the type mentioned at the outset from No. 1 is known in which a two-layer contact support layer is applied by plating, both layers being composed of a palladium alloy. The inner layer has additions of nickel, cobalt and/or copper in addition to palladium, while the outer layer is an alloy consisting of palladium-silver or palladium-gold with a silver or gold content of 10 to 40% by weight. has. This known contact support layer can be used over a wide range of switching functions, the contacts being able to be used both with very low currents and with very high switching currents and switching voltages.
【０００４】だが高いパラジウム成分を有するこれらの
公知の層は有機の蒸気に対して抵抗力がない。その結果
不利な環境条件下では過渡抵抗の上昇を心配しなければ
ならない。パラジウムの価格の上昇に伴い接触層におけ
るこの金属の高成分はますますまたコストの上昇におい
ても、とりわけ銀に対し、しかしてまた金に対してもま
すます影響を与える。However, these known layers with a high palladium content are not resistant to organic vapors. As a result, one has to worry about increasing transient resistance under unfavorable environmental conditions. With the increase in the price of palladium, the high content of this metal in the contact layer has an increasing effect on increasing costs, especially for silver, but also for gold.
【０００５】[0005]
【発明が解決しようとする課題】従って本発明の課題は
高価な貴金属のできるだけ僅かの、または有利なコスト
の使用で開閉機能のできるだけ大きい帯域巾にわたって
使用できる、冒頭に挙げた種類の開閉接触を提供するこ
とであった。該接触は信頼できかつ長寿命で非常に小さ
なはたまた非常に大きい開閉電流および電圧でも使用す
ることができるべきで、特にそれはまた有機の蒸気およ
び類似の不純物に対しても殆ど影響を受けてはならない
。SUMMARY OF THE INVENTION It is therefore an object of the invention to create a switching contact of the type mentioned at the outset, which can be used over as wide a bandwidth of switching functions as possible with as little or cost-effective use of expensive precious metals as possible. It was to provide. The contact should be reliable, long-lived and able to be used with very small or very large switching currents and voltages, in particular it should also be largely insensitive to organic vapors and similar impurities. Must not be.
【０００６】[0006]
【課題を解決するための手段】前記課題は本発明により
冒頭に挙げた種類の接触素子で、少なくとも外側層が銀
ないしは金成分が４０〜９０重量％を有することにより
解決される。This object is achieved according to the invention with a contact element of the type mentioned at the outset, in which at least the outer layer has a silver or gold content of 40 to 90% by weight.
【０００７】本発明による接触素子では従って公知の二
層接触支持層に対して外側接触層のパラジウム成分は減
少されてかつ相応して高い銀ないしは金の成分により置
換られる。これによって接触層は果し得る開閉機能の相
変わらず大きい帯域巾で周囲の雰囲気中の有機物質に対
する良好な抵抗を維持する。またこの場合に重要なこと
は、別種の層構造を基礎にしてそこにあらかじめ備えた
比較的僅かの層厚のこのような接触層は例えば圧延によ
り施された接触層よりも堅牢でかつ信頼性があるので接
触支持層はメッキまたは陰極スパッタリングにより施さ
れることである。かくして貴金属の僅かの全使量で良好
な品質および長い寿命を有する接触支持層を製造するこ
とができる。この本発明による接触素子で開閉電流数μ
Ａから約５Ａおよび開閉電圧数μＶ〜約１５０Ｖを申し
分なくかつ開閉動作高回数で開閉することができる。In the contact element according to the invention, the palladium content of the outer contact layer is therefore reduced compared to the known two-layer contact support layer and replaced by a correspondingly high silver or gold content. As a result, the contact layer maintains a good resistance to organic substances in the surrounding atmosphere with a still large bandwidth of possible switching functions. It is also important in this case that such a contact layer, which is based on a different layer structure and has a relatively small layer thickness, is more robust and reliable than a contact layer applied by rolling, for example. Therefore, the contact support layer is applied by plating or cathode sputtering. It is thus possible to produce a contact support layer of good quality and long service life with a small overall amount of precious metal. With the contact element according to the present invention, the switching current is
A to about 5 A and a switching voltage of several μV to about 150 V can be opened and closed satisfactorily and with a high number of switching operations.
【０００８】[0008]
【実施例】接触支持層が二層を含むときは、外側接触層
は好ましくは銀ないしは金成分６０〜８０％、有利には
約７０％を有する。内側層は好ましくはパラジウム−ニ
ッケル合金としてニッケル成分１０〜５０％、有利には
２０〜３０％で構成される。ほかの有利な適用態様では
内側層はパラジウム−コバルト層としてコバルト成分１
０〜４０％、有利には約２５％で構成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS When the contact support layer comprises two layers, the outer contact layer preferably has a silver or gold content of 60 to 80%, advantageously about 70%. The inner layer preferably consists of a nickel content of 10 to 50%, preferably 20 to 30%, as a palladium-nickel alloy. In another advantageous application embodiment, the inner layer has a cobalt component of 1 as a palladium-cobalt layer.
It is comprised between 0 and 40%, preferably about 25%.
【０００９】別の実施態様は銅成分１０〜４０重量％、
有利には近似の２０％重量％を有するパラジウム−銅層
からなる内側層を含む。Another embodiment has a copper content of 10 to 40% by weight;
It advantageously comprises an inner layer consisting of a palladium-copper layer having a weight percentage of approximately 20%.
【００１０】そのほかに内側接触層に対してまた三成分
合金も考えられる。例えばニッケル−銅１０〜４０重量
％、有利にはニッケル２０重量％および銅５重量％を有
するパラジウム−ニッケル−銅である。これらの三成分
合金はさきに挙げた金属のほかにまた付加的にタングス
テンまたはモリブデンも含有することができる。こうし
て内側接触層に対してニッケルおよびタングステン１０
〜４０重量％、有利にはニッケル約１５％およびタング
ステン１０％を有するパラジウム−ニッケル−タングス
テン合金またはニッケル＋モリブデン１０〜４０重量％
、有利にはニッケル約１５％およびモリブデン約１０％
を有するパラジウム＋ニッケル＋モリブデン合金を使用
することができる。またこれと類似の合金組成もコバル
トで計画することもできる。すなわち、コバルト＋タン
グステン１０〜４０重量％、有利にはコバルト約１５重
量％およびタングステン約１０重量％を有するパラジウ
ム−コバルト−タングステン合金ないしは銅＋モリブデ
ン１０〜４０重量％、有利にはコバルト約１５重量％お
よびモリブデン約１０重量％を有するパラジウム−コバ
ルト−モリブデン合金である。In addition, ternary alloys are also conceivable for the inner contact layer. For example, palladium-nickel-copper with 10 to 40% by weight of nickel-copper, preferably 20% by weight of nickel and 5% by weight of copper. In addition to the metals mentioned above, these ternary alloys can also additionally contain tungsten or molybdenum. Thus for the inner contact layer nickel and tungsten 10
-40% by weight, advantageously palladium-nickel-tungsten alloy with about 15% nickel and 10% tungsten or nickel + molybdenum 10-40% by weight
, advantageously about 15% nickel and about 10% molybdenum
A palladium + nickel + molybdenum alloy can be used. A similar alloy composition can also be planned with cobalt. That is, a palladium-cobalt-tungsten alloy with 10 to 40% by weight of cobalt plus tungsten, preferably about 15% by weight of cobalt and about 10% by weight of tungsten or 10 to 40% by weight of copper plus molybdenum, advantageously about 15% by weight of cobalt. % and about 10% molybdenum by weight.
【００１１】この場合に該外側層は厚さ０．１〜１μｍ
を有し、その際有利には厚さ約０．５μｍを使用する。
なお内側層は厚さ３〜５μｍを有する。In this case, the outer layer has a thickness of 0.1 to 1 μm.
, preferably using a thickness of about 0.5 μm. Note that the inner layer has a thickness of 3 to 5 μm.
【００１２】それでもまたほかの有利な実施態様におい
ては、接触支持層が所定の組成を有する、この場合に厚
さ３〜６μｍを有する外側層からのみなることも考えら
れる。However, in another advantageous embodiment it is also conceivable for the contact carrier layer to consist solely of an outer layer having a certain composition, in this case having a thickness of 3 to 6 μm.
【００１３】接触層ないしは接触層等の装備のためには
通常のメッキ法または陰極スパッタリング法も使用され
る。その際該接触層等は公知の方法で的確にそれが必要
である個所のみに施され、その結果こんなふうにして貴
金属の特に節減される使用が可能である。Conventional plating or cathodic sputtering methods can also be used for providing the contact layer or the like. In this case, the contact layer etc. is applied in a known manner precisely and only where it is needed, so that a particularly economical use of precious metals is possible in this way.
Claims (14)
含有する、メッキまたは陰極スパッタリングにより生じ
る接触支持層が施されていて、該層は全厚２〜６μｍを
有しかつその少なくとも外側の接触層は層厚少なくとも
０．１μｍを有するパラジウム−銀またはパラジウム−
金合金から構成されている電気開閉接触のための接触素
子において、少なくとも外側接触層が銀ないしは金成分
４０〜９０重量％を有することを特徴とする電気開閉接
触のための接触素子。1. A support made of a base metal is provided with a palladium-containing contact support layer produced by plating or cathodic sputtering, the layer having a total thickness of 2 to 6 μm and at least the outer contact layer comprising: Palladium-silver or palladium-silver with a layer thickness of at least 0.1 μm
A contact element for electrical switching contacts made of a gold alloy, characterized in that at least the outer contact layer has a silver or gold content of 40 to 90% by weight.
〜８０重量％を含有している請求項１記載の接触素子。2. The outer contact layer comprises a silver or gold component.
2. A contact element according to claim 1, containing up to 80% by weight.
７０重量％を含有している請求項２記載の接触素子。3. A contact element according to claim 2, wherein the outer contact layer contains about 70% by weight of silver or gold.
下部の接触支持層が厚さ３〜５μｍを有する内側層を有
し、該層はパラジウムおよび添加成分からの合金から構
成され、その際該添加成分が分量１０〜５０重量％包含
しかつグループニッケル、コバルトおよび銅からの少な
くとも１元素を含有している請求項１から３までのいず
れか１項記載の接触素子。4. The contact support layer below the outer layer with a thickness of 0.1 to 1 μm has an inner layer with a thickness of 3 to 5 μm, said layer consisting of an alloy of palladium and an additive component, 4. The contact element as claimed in claim 1, wherein the additional component comprises an amount of 10 to 50% by weight and contains at least one element from the group nickel, cobalt and copper.
から構成され、そのニッケル成分が１０〜５０重量％で
ある請求項４記載の接触素子。5. A contact element according to claim 4, wherein the inner layer is composed of a palladium-nickel alloy, the nickel content of which is from 10 to 50% by weight.
から構成され、そのコバルト成分が１０〜４０重量％で
ある請求項４記載の接触素子。6. A contact element according to claim 4, wherein the inner layer is composed of a palladium-cobalt alloy, the cobalt content of which is from 10 to 40% by weight.
構成され、その銅成分が１０〜４０重量％である請求項
４記載の接触素子。7. Contact element according to claim 4, wherein the inner layer is constructed as a palladium-copper alloy, the copper content of which is from 10 to 40% by weight.
合金によって構成され、該合金においてはニッケルおよ
び銅成分合わせて１０〜４０重量％でかつその際特にニ
ッケル成分は約２０重量％で銅成分は約５重量％である
請求項４記載の接触素子。8. The inner layer is constituted by a palladium-nickel-copper alloy, in which the nickel and copper components combined are between 10 and 40% by weight, with the nickel component being approximately 20% by weight and the copper component being approximately 20% by weight. 5. A contact element according to claim 4, wherein the contact element is about 5% by weight.
その際パラジウムのほかに該添加成分がニッケルおよび
タングステンまたはニッケルおよびモリブデンから全成
分１０〜４０重量％で構成されている請求項４記載の接
触素子。9. The inner layer is comprised of a binary alloy,
5. A contact element as claimed in claim 4, wherein, in addition to palladium, the additional components consist of nickel and tungsten or nickel and molybdenum in a total amount of 10 to 40% by weight.
％およびタングステンまたはモリブデン約１０％を含有
する請求項９記載の接触素子。10. The inner layer alloy has a composition of about 15% nickel.
10. A contact element according to claim 9, containing about 10% of tungsten or molybdenum.
にタングステンまたはモリブデンを合金の全成分１０〜
４０重量％で含有する請求項４記載の接触素子。11. The additive component comprises cobalt and additionally tungsten or molybdenum in a total amount of 10 to 10% of the total composition of the alloy.
5. A contact element according to claim 4, containing 40% by weight.
％およびタングステンまたはモリブデン約１０％を含有
している請求項１１記載の接触素子。12. The inner layer alloy contains about 15% cobalt.
12. A contact element according to claim 11, containing about 10% of tungsten or molybdenum.
る請求項４から１２までのいずれか１項記載の接触素子
。13. Contact element according to claim 4, wherein the inner layer has a thickness of approximately 4 μm.
する外側層からのみなる接触素子。14. A contact element in which the contact support layer consists solely of an outer layer having a thickness of 3 to 6 μm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19904013627 DE4013627A1 (en) | 1990-04-27 | 1990-04-27 | Electric switch contact element - with contact layer surface of silver- or gold- contg. palladium alloy |
| DE4013627.2 | 1990-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04230914A true JPH04230914A (en) | 1992-08-19 |
Family
ID=6405304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9035391A Withdrawn JPH04230914A (en) | 1990-04-27 | 1991-04-22 | Contact element for electrical switching and contact |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH04230914A (en) |
| DE (1) | DE4013627A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06223664A (en) * | 1992-12-22 | 1994-08-12 | W C Heraeus Gmbh | Electric contact element |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0674970A (en) * | 1992-08-25 | 1994-03-18 | Takata Kk | Acceleration sensor |
| DE19617488C2 (en) * | 1996-05-02 | 2002-03-07 | Gustav Krueger | Contact element for detachable electrical connections |
| DE10138204B4 (en) | 2001-08-03 | 2004-04-22 | Ami Doduco Gmbh | Electric contact |
| US8637165B2 (en) | 2011-09-30 | 2014-01-28 | Apple Inc. | Connector with multi-layer Ni underplated contacts |
| US9004960B2 (en) * | 2012-08-10 | 2015-04-14 | Apple Inc. | Connector with gold-palladium plated contacts |
-
1990
- 1990-04-27 DE DE19904013627 patent/DE4013627A1/en not_active Withdrawn
-
1991
- 1991-04-22 JP JP9035391A patent/JPH04230914A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06223664A (en) * | 1992-12-22 | 1994-08-12 | W C Heraeus Gmbh | Electric contact element |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4013627A1 (en) | 1991-10-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980711 |