JPS62144873A - はんだ付け方法および装置 - Google Patents
はんだ付け方法および装置Info
- Publication number
- JPS62144873A JPS62144873A JP28311985A JP28311985A JPS62144873A JP S62144873 A JPS62144873 A JP S62144873A JP 28311985 A JP28311985 A JP 28311985A JP 28311985 A JP28311985 A JP 28311985A JP S62144873 A JPS62144873 A JP S62144873A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- circuit board
- molten solder
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 85
- 239000007788 liquid Substances 0.000 claims description 3
- 230000005484 gravity Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28311985A JPS62144873A (ja) | 1985-12-18 | 1985-12-18 | はんだ付け方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28311985A JPS62144873A (ja) | 1985-12-18 | 1985-12-18 | はんだ付け方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62144873A true JPS62144873A (ja) | 1987-06-29 |
| JPH0523872B2 JPH0523872B2 (enrdf_load_stackoverflow) | 1993-04-06 |
Family
ID=17661469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28311985A Granted JPS62144873A (ja) | 1985-12-18 | 1985-12-18 | はんだ付け方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62144873A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002011571A (ja) * | 2000-06-27 | 2002-01-15 | Tamura Seisakusho Co Ltd | 局所はんだ付け装置および局所はんだ付け方法 |
| WO2011105034A1 (ja) * | 2010-02-26 | 2011-09-01 | パナソニック株式会社 | 半田付け装置 |
-
1985
- 1985-12-18 JP JP28311985A patent/JPS62144873A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002011571A (ja) * | 2000-06-27 | 2002-01-15 | Tamura Seisakusho Co Ltd | 局所はんだ付け装置および局所はんだ付け方法 |
| WO2011105034A1 (ja) * | 2010-02-26 | 2011-09-01 | パナソニック株式会社 | 半田付け装置 |
| CN102361720A (zh) * | 2010-02-26 | 2012-02-22 | 松下电器产业株式会社 | 焊接装置 |
| US8590765B2 (en) | 2010-02-26 | 2013-11-26 | Panasonic Corporation | Soldering apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0523872B2 (enrdf_load_stackoverflow) | 1993-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0201158B1 (en) | Vibratory wave soldering | |
| US4401253A (en) | Mass soldering system | |
| US4410126A (en) | Mass soldering system | |
| US4402448A (en) | Mass soldering system | |
| EP0147001A1 (en) | Mass wave soldering system II | |
| GB1602779A (en) | Methods and apparatus for mass soldering of printed circuit boards | |
| JPS62144873A (ja) | はんだ付け方法および装置 | |
| US4932585A (en) | Method and apparatus for solder plating an object | |
| USRE33197E (en) | Vibrator wave soldering | |
| EP0147000A1 (en) | Mass wave soldering system I | |
| JPH01144698A (ja) | 混成集積回路装置の製造方法とその装置 | |
| USRE32982E (en) | Mass soldering system | |
| JPH0523871B2 (enrdf_load_stackoverflow) | ||
| JP3062122B2 (ja) | プリント配線板の半田レベリング装置 | |
| CA1230426A (en) | Vibratory wave soldering of printed wiring boards | |
| JP2004356161A (ja) | 自動はんだ付け装置 | |
| JPH01266792A (ja) | プリント基板のはんだ付け方法および装置 | |
| JPS6343193B2 (enrdf_load_stackoverflow) | ||
| JPH01157763A (ja) | 電子部品リードの予備半田付け装置 | |
| JPH098449A (ja) | 噴流はんだ槽 | |
| JP2767832B2 (ja) | プリント基板の半田付方法 | |
| JPH11340620A (ja) | 半田槽の消波装置 | |
| JPS6138640B2 (enrdf_load_stackoverflow) | ||
| JP2003188520A (ja) | プリント基板のはんだ付け方法およびはんだ付け装置 | |
| JPS614570A (ja) | コ−テイング液の液切り方法 |