JPS62144336A - Die bonding device - Google Patents

Abstract

PURPOSE:To make sure the changes of adhesive states to qualitative alternations, such as the quality, viscosity, etc. of adhesives without hands, and to maintain quality by bonding a transparent or translucent chip in the same size as a semiconductor die and monitoring the state of bonding by a device. CONSTITUTION:The range of a chip is binary-coded and picture-processed by a picture processing circuit in a picture photographed by an ITV camera of the adhesive state of adhesives 13 to the bonded chip 2. Since adhesives are flattened in a section where adhesives adhere on the chip 2 in the binary-coded picture G, lighting beams are reflected intensely by metallic components contained in adhesives, and the section on which adhesives adhere is acquired as a white information (a shaded range). The binary-coded picture thus obtained is transmitted over a nondefective or defective decision circuit, and nondefective or defective state is decided by an area ratio of the white information to the whole area of the chip.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor die bonding device using an adhesive.

[Conventional technology]

Conventionally, thermosetting adhesives are usually used for bonding semiconductor pellets with conductive paste, but the bonding condition: checks for die peeling before thermosetting and adhesive strength checks after thermosetting are sampled. This is confirmed by doing this.

[Problem that the invention seeks to solve]

With the conventional confirmation method mentioned above, when peeling and checking,
Because the peeling process relies on manual labor, side-slipping is likely to occur between the IC die and lead frame island during peeling, and it is difficult to maintain the adhesive surface that was actually bonded. Therefore, it is not recommended as a standard for determining pass/fail, and adhesive strength is not recommended. In this case, even if an adhesion defect is discovered, it is impossible to correct it and return it as a good product because the adhesive has already been cured by heat.

The present invention provides a device that solves the above-mentioned problems.

[Means for solving problems]

The present invention provides a semiconductor die bonding apparatus using an adhesive, which includes a transport unit for supplying and positioning a chip made of a transparent or semi-transparent material and having the same size as the die, a bonding mechanism for the chip, and a bonding state of the chip. This die bonding apparatus is characterized by having a recognition system section that takes in the image, processes the image, and makes a quality determination.

〔Example〕

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention. This device consists of an XYθ stage 4 for positioning the die 3 shown in Fig. 2(b) at a desired position where the collet 5 adsorbs it, and an adsorption surface shown in Fig. 2(a) that is transparent and has the same dimensions as the die 3. Alternatively, an XY stage 1 is used to position the chip 2 made of a translucent material at a desired position where the collet 5 will adsorb it, and a lead frame 7 is conveyed along a guide 14 with a feed claw 12 to set the lead frame 7 in a predetermined position. a transport unit 15 that positions the position;
From a coating unit 10 that applies adhesive to the island 8 of the lead frame 7 using a coating nozzle 9, and a recognition system unit 16 that captures the adhesion state of the adhesive on the bonded chip 2 with an ITV camera 11, processes the image, and determines whether it is good or bad. configured.

Figure 3 shows chip 2 bonded by collet 5.
This is an image captured by the ITV camera 11 showing the state of adhesion of the adhesive 13 to the surface. FIG. 1 explains the recognition system section 16 used in this device, and shows the image processing circuit 1.
7, the chip range is subjected to binarized image processing. FIG. 5 shows this binarized image G. In this way, since the adhesive is flat at the part where the adhesive is attached to the chip 2, the illumination light is strongly reflected due to the metal component contained in the adhesive, and the white information (
(shaded area in Fig. 5). The obtained binarized image is sent to the pass/fail judgment circuit 18, and the adhesion condition is judged based on the area ratio of the white information to the total area of the chip.If it is judged to be defective, the control circuit 19 of the die bonding machine immediately shuts down the device. Stop the machine and issue an alarm signal to notify the operator.

By configuring a die bonding equipment control circuit that uses the adhesion quality determination system described above to determine the quality of adhesion at the start of die bonding work, at fixed time intervals after the start of work, or for each fixed number of bondings, the equipment can be It will have a self-diagnosis function.

〔Effect of the invention〕

As explained above, in the present invention, by bonding a transparent or semi-transparent chip having the same size as a normal semiconductor die, the bonding state can be monitored by an apparatus. It is possible to produce products while maintaining quality without relying on humans to check changes in the adhesive state due to homogeneous changes in the amount and viscosity of the adhesive. Furthermore, since the adhesive state can be observed without peeling off the die, it is possible to accurately determine the area where the adhesive has actually adhered to the back surface of the die.

[Brief explanation of drawings]

Figure 1 is a perspective view showing an embodiment of the present invention, Figure 2 (α) is a chip used in the present invention, (b) is a semiconductor die, and Figure 3 is a state in which Figure 2 (α) is bonded. The observed plan view, FIG. 4 is a diagram of a system for determining adhesion quality, and FIG. 5 is a binarized image diagram. 1.XY stage 2..Chip 3..Semiconductor die 4..XYθ stage 5.
・Collet 6... Storage machine 7... Lead frame 8... Island 9... Application nozzle
10・Application part 11...ITV camera 1
2...Feeding claw 13...Adhesive 14...
・Guide 15... Conveyance section 16... Recognition system department Patent applicant NEC Corporation Ni, Yushio 15 'lAX* System Section Figure 1 (α) (b) Figure 2 Figure 4

Claims (1)

[Claims] (1) A semiconductor die bonding device using an adhesive, which includes a transport unit that supplies and positions a chip made of a transparent or translucent material and having the same dimensions as the die, a bonding mechanism for the chip, and a bonding mechanism for the chip. A die bonding apparatus comprising: a recognition system section that captures a state, processes the image, and performs a pass/fail determination.