JPS62142845U - - Google Patents
Info
- Publication number
- JPS62142845U JPS62142845U JP1986029400U JP2940086U JPS62142845U JP S62142845 U JPS62142845 U JP S62142845U JP 1986029400 U JP1986029400 U JP 1986029400U JP 2940086 U JP2940086 U JP 2940086U JP S62142845 U JPS62142845 U JP S62142845U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- fingers
- suction cup
- movable
- gripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Specific Conveyance Elements (AREA)
- Die Bonding (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986029400U JPS62142845U (US20100223739A1-20100909-C00005.png) | 1986-02-28 | 1986-02-28 | |
| US07/019,027 US4753004A (en) | 1986-02-28 | 1987-02-26 | Chip mounter |
| CA000530781A CA1298694C (en) | 1986-02-28 | 1987-02-27 | Chip mounter |
| EP87400440A EP0235047B1 (en) | 1986-02-28 | 1987-02-27 | Chip mounter |
| DE8787400440T DE3786273D1 (de) | 1986-02-28 | 1987-02-27 | Vorrichtung zur bestueckung mit chips. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986029400U JPS62142845U (US20100223739A1-20100909-C00005.png) | 1986-02-28 | 1986-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62142845U true JPS62142845U (US20100223739A1-20100909-C00005.png) | 1987-09-09 |
Family
ID=12275089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986029400U Pending JPS62142845U (US20100223739A1-20100909-C00005.png) | 1986-02-28 | 1986-02-28 |
Country Status (5)
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4844324A (en) * | 1987-09-29 | 1989-07-04 | Todd Thomas W | Solder system and method of using same |
| US5497983A (en) * | 1987-10-16 | 1996-03-12 | Tenryu Technics Co., Ltd. | Work positioner of chip mounter for monitoring a chip-shaped electronic part onto a substrate |
| US4883300A (en) * | 1988-10-13 | 1989-11-28 | Intelmatec Corporation | End effector for IC chip handling |
| US4950011A (en) * | 1988-10-24 | 1990-08-21 | Nicky Borcea | Tool for precisely positioning a workpiece |
| DE3904587A1 (de) * | 1989-02-16 | 1990-08-23 | Arnold & Richter Kg | Montagekopf fuer handhabungsgeraete |
| DE8904031U1 (de) * | 1989-04-01 | 1989-05-18 | SES Electronics GmbH, 8860 Nördlingen | Bestückkopf |
| US5106138A (en) * | 1989-06-05 | 1992-04-21 | Hewlett-Packard Company | Linear tweezers |
| US4987676A (en) * | 1989-08-23 | 1991-01-29 | Quad Systems Corporation | End effector for a robotic system |
| EP0500246B1 (en) * | 1991-02-20 | 1996-05-08 | Matsumoto Giken Co., Ltd. | Chuck for positioning chip electronic elements |
| US5160181A (en) * | 1991-09-09 | 1992-11-03 | Intelmatec Corporation | Pick-up head assembly |
| US5315189A (en) * | 1991-09-25 | 1994-05-24 | Systems, Machines, Automation Corporation | Actuator with translational and rotational control |
| US5284413A (en) * | 1992-08-05 | 1994-02-08 | Intelmatec Corporation | Apparatus for loading and unloading thin integrated circuits into and from carriers |
| JPH06224595A (ja) * | 1993-01-19 | 1994-08-12 | Juki Corp | 部品吸着搭載ヘッド装置 |
| DE4430381C2 (de) * | 1993-08-31 | 1997-02-27 | Smc Kk | Saugpipette |
| DE19500416A1 (de) * | 1995-01-10 | 1996-07-11 | Atg Test Systems Gmbh | Haltevorrichtung für flächenförmige Prüflinge |
| US5697658A (en) * | 1995-05-05 | 1997-12-16 | Samsung Electronics Co., Ltd. | Centering apparatus for component mounting device |
| US6139078A (en) * | 1998-11-13 | 2000-10-31 | International Business Machines Corporation | Self-aligning end effector for small components |
| FR2859197B1 (fr) * | 2003-09-02 | 2006-10-13 | Commissariat Energie Atomique | Dispositif de manutention de fut |
| US9258936B2 (en) * | 2011-12-27 | 2016-02-09 | Hanwha Techwin Co., Ltd. | Adsorption head for surface mounting device |
| CN102632638A (zh) * | 2012-03-16 | 2012-08-15 | 安徽德力日用玻璃股份有限公司 | 压机自动吸取杯机构 |
| ITFI20120233A1 (it) * | 2012-10-29 | 2014-04-30 | Esanastri S R L | Dispositivo di micro-sfridatura di film plastici o in carta a uno o più strati autoadesivi, biadesivizzati o elettrostatici accoppiati con un liner di supporto antiaderente |
| CN108275466A (zh) * | 2018-03-30 | 2018-07-13 | 青岛元启智能机器人科技有限公司 | 一种液晶屏抓取装置 |
| CN108674968B (zh) * | 2018-05-29 | 2020-05-12 | 江西绣丽织带有限公司 | 一种用于织机的纱管自动上下料设备 |
| CN110729217A (zh) * | 2019-10-22 | 2020-01-24 | 江苏佳晟精密设备科技有限公司 | 一种安装半导体芯片的装置 |
| CN113644019B (zh) * | 2021-08-09 | 2024-03-19 | 恩纳基智能科技无锡有限公司 | 一种半导体贴片机的复合上料装置 |
| CN115092683A (zh) * | 2021-10-22 | 2022-09-23 | 苏州联讯仪器有限公司 | 用于芯片测试的自动运料模组 |
| CN115372243B (zh) * | 2022-10-21 | 2023-02-03 | 东营华亚国联航空燃料有限公司 | 一种航空燃料测试用铜片腐蚀试验设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4438559A (en) * | 1980-06-27 | 1984-03-27 | Fuji Machine Mfg. Co. Ltd. | Apparatus for automatically mounting non-lead electronic components on printed-circuit |
| JPS59224279A (ja) * | 1983-06-01 | 1984-12-17 | 富士機械製造株式会社 | 電子部品の位置決め保持方法および装置 |
| JPS61501116A (ja) * | 1984-01-23 | 1986-05-29 | ダイナパ−ト プレシマ リミテツド | 電子部品を取扱うためのピックアップヘッド |
| DE3411125A1 (de) * | 1984-03-26 | 1985-10-03 | Alfred 8000 München Lemmer | Vorrichtung zum greifen von elektronischen bauelementen, insbesondere ic's |
-
1986
- 1986-02-28 JP JP1986029400U patent/JPS62142845U/ja active Pending
-
1987
- 1987-02-26 US US07/019,027 patent/US4753004A/en not_active Expired - Fee Related
- 1987-02-27 CA CA000530781A patent/CA1298694C/en not_active Expired - Lifetime
- 1987-02-27 EP EP87400440A patent/EP0235047B1/en not_active Expired - Lifetime
- 1987-02-27 DE DE8787400440T patent/DE3786273D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CA1298694C (en) | 1992-04-14 |
| EP0235047B1 (en) | 1993-06-23 |
| US4753004A (en) | 1988-06-28 |
| DE3786273D1 (de) | 1993-07-29 |
| EP0235047A3 (en) | 1989-09-06 |
| EP0235047A2 (en) | 1987-09-02 |
