JPS62140746U - - Google Patents
Info
- Publication number
- JPS62140746U JPS62140746U JP2771086U JP2771086U JPS62140746U JP S62140746 U JPS62140746 U JP S62140746U JP 2771086 U JP2771086 U JP 2771086U JP 2771086 U JP2771086 U JP 2771086U JP S62140746 U JPS62140746 U JP S62140746U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- portions
- sealing resin
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2771086U JPS62140746U (hu) | 1986-02-26 | 1986-02-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2771086U JPS62140746U (hu) | 1986-02-26 | 1986-02-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62140746U true JPS62140746U (hu) | 1987-09-05 |
Family
ID=30829996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2771086U Pending JPS62140746U (hu) | 1986-02-26 | 1986-02-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62140746U (hu) |
-
1986
- 1986-02-26 JP JP2771086U patent/JPS62140746U/ja active Pending