JPS62140744U - - Google Patents
Info
- Publication number
- JPS62140744U JPS62140744U JP2833486U JP2833486U JPS62140744U JP S62140744 U JPS62140744 U JP S62140744U JP 2833486 U JP2833486 U JP 2833486U JP 2833486 U JP2833486 U JP 2833486U JP S62140744 U JPS62140744 U JP S62140744U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat dissipation
- metal plate
- semiconductor device
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028334U JPH0412677Y2 (US06521211-20030218-C00004.png) | 1986-02-28 | 1986-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028334U JPH0412677Y2 (US06521211-20030218-C00004.png) | 1986-02-28 | 1986-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62140744U true JPS62140744U (US06521211-20030218-C00004.png) | 1987-09-05 |
| JPH0412677Y2 JPH0412677Y2 (US06521211-20030218-C00004.png) | 1992-03-26 |
Family
ID=30831194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986028334U Expired JPH0412677Y2 (US06521211-20030218-C00004.png) | 1986-02-28 | 1986-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412677Y2 (US06521211-20030218-C00004.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2018128005A1 (ja) * | 2017-01-06 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | コンデンサ、コンデンサユニット、コンデンサの製造方法およびコンデンサユニットの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158460A (en) * | 1980-05-12 | 1981-12-07 | Mitsubishi Electric Corp | Resin sealed type semiconductor device |
-
1986
- 1986-02-28 JP JP1986028334U patent/JPH0412677Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158460A (en) * | 1980-05-12 | 1981-12-07 | Mitsubishi Electric Corp | Resin sealed type semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2018128005A1 (ja) * | 2017-01-06 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | コンデンサ、コンデンサユニット、コンデンサの製造方法およびコンデンサユニットの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412677Y2 (US06521211-20030218-C00004.png) | 1992-03-26 |
