JPS62140154A - Data holding system for memory device - Google Patents

Data holding system for memory device

Info

Publication number
JPS62140154A
JPS62140154A JP60280903A JP28090385A JPS62140154A JP S62140154 A JPS62140154 A JP S62140154A JP 60280903 A JP60280903 A JP 60280903A JP 28090385 A JP28090385 A JP 28090385A JP S62140154 A JPS62140154 A JP S62140154A
Authority
JP
Japan
Prior art keywords
semiconductor memory
data
memory
areas
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60280903A
Other languages
Japanese (ja)
Inventor
Masataka Fujinami
藤波 政孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60280903A priority Critical patent/JPS62140154A/en
Publication of JPS62140154A publication Critical patent/JPS62140154A/en
Pending legal-status Critical Current

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  • Techniques For Improving Reliability Of Storages (AREA)

Abstract

PURPOSE:To greatly shorten the saving and recovering time of data by using plural pairs of nonvolatile memory elements and transfer circuits to perform the parallel processing of data on the divided memory areas of a volatile semiconductor memory. CONSTITUTION:The memory area of a volatile semiconductor memory 4 of a semiconductor memory device 2 is divided into two areas A and B. The semiconductor memory/inter-disk transfer circuits 72 corresponding to both areas A and B are controlled by a microprocessor 3. The memory data in the areas A and B are stored in the corresponding compact magnetic disk devices 61 and 62 or taken out of these devices 61 and 62 in parallel with the transfer of those data to the area A and B respectively. As a result of said parallel processing, the saving/recovering time of data is shortened greatly and has no change despite the increase of the memory capacity by increasing the number of transmission lines and compact disk devices.

Description

【発明の詳細な説明】 (発明の利用分野〕 本発明は、記憶装置のデータ保持方式に関し、特にバッ
クアップ装置を具備した半導体記憶装置において、デー
タの退避/回復時間、および装置の信頼性が問題となる
場合に好適な半導体記憶装置のデータ保持方式に関する
ものである。
[Detailed Description of the Invention] (Field of Application of the Invention) The present invention relates to a data retention method of a storage device, and particularly to a semiconductor storage device equipped with a backup device, in which data evacuation/recovery time and device reliability are problems. The present invention relates to a data retention method of a semiconductor memory device suitable for the case where the following is the case.

〔発明の背景〕[Background of the invention]

電子計算機システムの外部記憶装置として半導体メモリ
素子等からなる揮発性の半導体記憶装置を用いた場合、
計算機システムに供給される電源が遮断されると半導体
メモリに格納されたデータが揮発してしまう。そこで、
従来1例えば、特開昭59−82700号公報記載のも
ののように半導体記憶装置内部に単一の不揮発性記憶媒
体を内蔵して′11源の切断/投入を契機に半導体メモ
リのデータの退避/回復が行われている。しかし、この
ような従来の装置では、近時の半導体メモリ素子大容量
化と低価格化に伴う半導体記憶装置の大容量化によって
5これをバラフッアップする不揮発性媒体の容量不足及
び、データの退避/回復時間の増大が問題となった。
When a volatile semiconductor storage device consisting of a semiconductor memory element etc. is used as an external storage device of an electronic computer system,
When the power supplied to the computer system is cut off, the data stored in the semiconductor memory becomes volatile. Therefore,
Conventional 1 For example, as described in Japanese Unexamined Patent Application Publication No. 59-82700, a single non-volatile storage medium is built into a semiconductor memory device, and data in the semiconductor memory is saved/backed up when the '11 power is turned off/on. Recovery is underway. However, in such conventional devices, due to the recent increase in the capacity of semiconductor memory devices and the reduction in prices, the capacity of non-volatile media to increase this capacity is insufficient, and the data Increased evacuation/recovery time became a problem.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、このような従来の問題を改善し、バッ
クアップ装置を具備した半導体記憶において、半導体メ
モリと不揮発性記憶媒体間のデータの退避/回復時間を
短縮し、かつ、装置の信頼性を向」ニさせるに好適な半
導体記憶装置のデータ保持方式を提供することにある。
The purpose of the present invention is to improve such conventional problems, to shorten the time for saving and restoring data between the semiconductor memory and the non-volatile storage medium in semiconductor memory equipped with a backup device, and to improve the reliability of the device. It is an object of the present invention to provide a data retention method for a semiconductor memory device suitable for improving the performance of data.

〔発明の概要〕[Summary of the invention]

以上の目的を達成するため、本発明は、揮発性半導体メ
モリ素子と該メモリ素子に格納したデータを不渾発化す
るための不揮発性記憶媒体と、前二音間のデータ転送を
行う転送回路と、該データ転送を制御するマイクロプロ
欠ツサとからなる半導体記憶装置において、前記揮発性
半導体メモリの記憶領域をN個に分割し、前記不揮発性
記憶媒体及び転送回路とをN個具備して、前記マイクロ
プロセッサで並列に転送及び復元することに特徴がある
In order to achieve the above objects, the present invention provides a volatile semiconductor memory device, a nonvolatile storage medium for making data stored in the memory device non-volatile, and a transfer circuit for transferring data between the first two tones. and a microprocessor for controlling the data transfer, the storage area of the volatile semiconductor memory is divided into N parts, and the non-volatile storage medium and the transfer circuit are provided in N parts. , is characterized in that it is transferred and restored in parallel by the microprocessor.

〔発明の実施例〕[Embodiments of the invention]

以下1本発明の実施例を図面により詳細に説明する。 Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

第1図は本発明の一実施例を示す半導体体記憶装置の構
成図である。
FIG. 1 is a block diagram of a semiconductor memory device showing one embodiment of the present invention.

同図において、1は半導体記憶装置の上位装置、2は半
導体記憶装置、3は半導体記憶装置2を制御するマイク
ロプロセッサ、4は半導体メモリ、5は上位装置1との
データ転送回路、61.62は半導体メモリ4の容量の
半分の容量の小型磁気ディスク装[,71,72は半導
体メモリ4とディスク装[61,62間のデータ転送回
路である。
In the figure, 1 is a host device of the semiconductor storage device, 2 is a semiconductor storage device, 3 is a microprocessor that controls the semiconductor storage device 2, 4 is a semiconductor memory, 5 is a data transfer circuit with the host device 1, 61.62 71 and 72 are data transfer circuits between the semiconductor memory 4 and the disk drives 61 and 62, respectively.

先ず、半導体記憶装置2の電源が投入されると、プロセ
ッサ3は、データ転送回路71.72に対して、ディス
ク61.62から半導体メモリ4のA、B領域へのデー
タ転送を指示する。この指示を受けたデータ転送回路7
1.72は、各々独立にディスク61.62上のデータ
を半導体メモリ4のA及びB領域に転送する(以下この
動作をロードという)。 このロードが完了すると、デ
ータ転送回路71.72は、ロード完了報告をプロセッ
サ3に対して行う。該ロード完了報告を受けたプロセッ
サ3は、半導体記憶装置2を上位装置1により使用可能
な状態にする。
First, when the semiconductor storage device 2 is powered on, the processor 3 instructs the data transfer circuits 71 and 72 to transfer data from the disks 61 and 62 to areas A and B of the semiconductor memory 4. Data transfer circuit 7 that received this instruction
1.72 independently transfers data on the disks 61 and 62 to areas A and B of the semiconductor memory 4 (hereinafter this operation is referred to as loading). When this loading is completed, the data transfer circuits 71 and 72 report the loading completion to the processor 3. Upon receiving the load completion report, the processor 3 makes the semiconductor storage device 2 usable by the host device 1.

上位装置1による使用が終了し、電源切断の指示が行わ
れるとプロセッサ3は、データ転送回路71.72に半
導体メモリ4のA、B領域のデータをディスク61.6
2に転送するように指示する。該指示を受けたデータ転
送回路71.72は、前記ロード時と同様にデータ転送
を行う(以下この動作をアンロードという)。 このア
ンロードの完了により、プロセッサ3は半導体記憶装置
2の電源を切断する。
When the use by the host device 1 is finished and an instruction is given to turn off the power, the processor 3 transfers the data in areas A and B of the semiconductor memory 4 to the data transfer circuit 71.72 to the disk 61.6.
Instruct to transfer to 2. The data transfer circuits 71 and 72 that have received this instruction perform data transfer in the same manner as at the time of loading (hereinafter, this operation is referred to as unloading). Upon completion of this unloading, the processor 3 turns off the power to the semiconductor storage device 2.

第2図は第1図の半導体メモリ4の容量を2倍とした場
合の構成図である。
FIG. 2 is a configuration diagram when the capacity of the semiconductor memory 4 of FIG. 1 is doubled.

半導体メモリ4の容量を2倍に増設したことに伴い、デ
ータ転送回路73.74とディスク63゜64とが増設
される。
As the capacity of the semiconductor memory 4 is doubled, data transfer circuits 73, 74 and disks 63, 64 are added.

この構成の下でのプロセッサ3は、データ転送回路71
,72,73,74を制御し、また該データ制御回路は
各々独立して並行的に動作する。
Under this configuration, the processor 3 includes a data transfer circuit 71
, 72, 73, and 74, and the data control circuits each operate independently and in parallel.

このため、容量を倍増したにもかがねらず、ロード/ア
ンロードに要する時間は第1図の場合と同一である。
Therefore, even though the capacity has been doubled, the time required for loading/unloading is the same as in the case of FIG.

第3図は、第1図の実施例に予備のデータ転送回路75
と予備のディスク65を付加した半導体記憶装置の構成
図である。
FIG. 3 shows a spare data transfer circuit 75 in the embodiment of FIG.
FIG. 2 is a configuration diagram of a semiconductor storage device to which a spare disk 65 is added.

この実施例はアンロード時の障害発生に対処したもので
ある。すなわち、アンロード時にデータ転送回路72あ
るいはディスク62で障害が発生し、半導体メモリ4の
退避が不可能となった場合。
This embodiment deals with the occurrence of a failure during unloading. That is, when a failure occurs in the data transfer circuit 72 or the disk 62 during unloading, and it becomes impossible to save the semiconductor memory 4.

プロセッサ3は、障害を検出し、予備データ転送回路7
5に対してディスク62に転送すべきエリアBのデータ
を予備ディスク65に転送すべき指示を行う。
The processor 3 detects the failure and transfers the backup data transfer circuit 7.
5 to transfer the data of area B to the disk 62 to the spare disk 65.

データ転送回路75から転送終了の報告を受けると、プ
ロセッサ3は、ディスク65がディスク62の交替ディ
スクとして使用されたことを示す交替情報をディスク6
5の特定領域8に書き込んだ後、半導体記憶装置2の電
源を切断する。
Upon receiving a report of the completion of transfer from the data transfer circuit 75, the processor 3 sends replacement information to the disk 62 indicating that the disk 65 is used as a replacement disk for the disk 62.
After writing to the specific area 8 of No. 5, the power to the semiconductor memory device 2 is turned off.

電源投入時にプロセッサ3は、ディスク65に書込れた
前記交替情報8を参照し、半導体メモリ4のエリアBに
対応するデータをディスク65からロードするように、
データ転送回路回路75に指示する。
When the power is turned on, the processor 3 refers to the replacement information 8 written on the disk 65 and loads data corresponding to area B of the semiconductor memory 4 from the disk 65.
The data transfer circuit 75 is instructed.

このように、アンロード時に障害が発生した場合、プロ
セッサ3の指示により予備系に自動的に切替えてアンロ
ードを実行することができるので、信頼性の高い半導体
記憶装置が実現できる。
In this manner, if a failure occurs during unloading, it is possible to automatically switch to the standby system and execute unloading according to instructions from the processor 3, thereby realizing a highly reliable semiconductor memory device.

〔発明の効果〕〔Effect of the invention〕

以」二述べたように、本発明によれば、半導体メモリと
複数個の不揮発性記憶媒体間のデータ転送を並列処理で
行えるので、データの退避/回復時間が大幅に短縮でき
、半導体メモリの容量が増加してもデータの退避/回復
時間は増加しない。
As described above, according to the present invention, data transfer between a semiconductor memory and a plurality of nonvolatile storage media can be performed in parallel, so data saving/recovery time can be significantly shortened, and semiconductor memory Even if the capacity increases, the data evacuation/recovery time does not increase.

また、予備系の不揮発性記憶媒体を備えて、障害発生時
に自動的に切替える方式を採ることにより、装置の信頼
性を向上させることができる。
Furthermore, by providing a spare non-volatile storage medium and adopting a method of automatically switching over when a failure occurs, the reliability of the device can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す半導体記憶装置の構成
図、第2図は第1図の半導体メモリ4の容量を2倍とし
た場合の構成図、第3図は予備の不揮発性記憶媒体を内
蔵した半導体記憶装置の構成図である。 に上位装置、2:半導体記憶装置、3:マイクロプロセ
ッサ、4:半導体メモリ、5:半導体メモリ/上位装置
間データ転送回路、61,62゜63.64:小型磁気
ディスク装置、65=小型磁気デイスク装置、71,7
2,73,74:半導体メモリ/ディスク間データ転送
回路、8:交替情報。 第     1     図 第     2     図 第     3     図
FIG. 1 is a configuration diagram of a semiconductor memory device showing an embodiment of the present invention, FIG. 2 is a configuration diagram when the capacity of the semiconductor memory 4 in FIG. 1 is doubled, and FIG. 1 is a configuration diagram of a semiconductor storage device incorporating a storage medium; FIG. host device, 2: semiconductor storage device, 3: microprocessor, 4: semiconductor memory, 5: data transfer circuit between semiconductor memory/host device, 61, 62° 63.64: small magnetic disk device, 65 = small magnetic disk device, 71,7
2, 73, 74: semiconductor memory/disk data transfer circuit, 8: replacement information. Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] (1)揮発性半導体メモリ素子と該メモリ素子に格納さ
れたデータを不揮発化するための不揮発性記憶媒体と、
前二者間のデータ転送を行う転送回路とを備えた半導体
記憶装置において、前記不揮発性記憶媒体および転送回
路をそれぞれ複数個具備するとともに、前記揮発性半導
体メモリの記憶領域を複数個に分割し、分割された記憶
領域の各情報を前記複数個の転送回路により並列に退避
および回復させることを特徴とする記憶装置のデータ保
持方式。
(1) a volatile semiconductor memory element and a nonvolatile storage medium for making data stored in the memory element nonvolatile;
A semiconductor memory device comprising a transfer circuit that transfers data between the two, wherein the nonvolatile storage medium and the transfer circuit are each provided in a plurality, and the storage area of the volatile semiconductor memory is divided into a plurality of pieces. . A data retention system for a storage device, characterized in that each piece of information in the divided storage area is saved and restored in parallel by the plurality of transfer circuits.
JP60280903A 1985-12-16 1985-12-16 Data holding system for memory device Pending JPS62140154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60280903A JPS62140154A (en) 1985-12-16 1985-12-16 Data holding system for memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60280903A JPS62140154A (en) 1985-12-16 1985-12-16 Data holding system for memory device

Publications (1)

Publication Number Publication Date
JPS62140154A true JPS62140154A (en) 1987-06-23

Family

ID=17631549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60280903A Pending JPS62140154A (en) 1985-12-16 1985-12-16 Data holding system for memory device

Country Status (1)

Country Link
JP (1) JPS62140154A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008175219A (en) * 2007-01-16 2008-07-31 Orusen:Kk Sheet stretching gripping lever and its connector
JP2010128537A (en) * 2008-11-25 2010-06-10 Casio Computer Co Ltd Sales data processor and program
WO2013080299A1 (en) * 2011-11-29 2013-06-06 富士通株式会社 Data management device, data copy method, and program

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008175219A (en) * 2007-01-16 2008-07-31 Orusen:Kk Sheet stretching gripping lever and its connector
JP2010128537A (en) * 2008-11-25 2010-06-10 Casio Computer Co Ltd Sales data processor and program
WO2013080299A1 (en) * 2011-11-29 2013-06-06 富士通株式会社 Data management device, data copy method, and program

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