JPS62138452U - - Google Patents
Info
- Publication number
- JPS62138452U JPS62138452U JP1986025933U JP2593386U JPS62138452U JP S62138452 U JPS62138452 U JP S62138452U JP 1986025933 U JP1986025933 U JP 1986025933U JP 2593386 U JP2593386 U JP 2593386U JP S62138452 U JPS62138452 U JP S62138452U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- lead frame
- package
- chip mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986025933U JPS62138452U (enExample) | 1986-02-25 | 1986-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986025933U JPS62138452U (enExample) | 1986-02-25 | 1986-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62138452U true JPS62138452U (enExample) | 1987-09-01 |
Family
ID=30826543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986025933U Pending JPS62138452U (enExample) | 1986-02-25 | 1986-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62138452U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0497352U (enExample) * | 1990-07-26 | 1992-08-24 |
-
1986
- 1986-02-25 JP JP1986025933U patent/JPS62138452U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0497352U (enExample) * | 1990-07-26 | 1992-08-24 |