JPS62137572U - - Google Patents
Info
- Publication number
- JPS62137572U JPS62137572U JP2599986U JP2599986U JPS62137572U JP S62137572 U JPS62137572 U JP S62137572U JP 2599986 U JP2599986 U JP 2599986U JP 2599986 U JP2599986 U JP 2599986U JP S62137572 U JPS62137572 U JP S62137572U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- conductive pattern
- pattern
- bonding member
- coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims 3
- 238000010168 coupling process Methods 0.000 claims 3
- 238000005859 coupling reaction Methods 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図Ａ
，Ｂ，Ｃは回路パターンのＩＣとの接続部分の詳
細図である。
Figure 1 is a perspective view of an embodiment of the present invention, Figure 2A
, B, and C are detailed views of the connection portion of the circuit pattern to the IC.
Claims (1)
液晶表示素子等の回路素子複数個よりなる回路構
成において、上記回路素子複数個を構造的に結合
する結合部材を設け、同結合部材表面に転写導電
パターンよりなる接続回路パターンを形成し、結
合部材に取り付けられる上記プリント回路基板等
の回路素子等と結合部材との間に介在させる弾性
部材に形成した導電パターンにより、結合部材表
面の転写導電パターンと各回路素子の接続端子を
相互に電気的接続することを特徴とした導電パタ
ーンの接続構造。 In a circuit configuration consisting of a plurality of circuit elements such as printed circuit boards, ICs, or liquid crystal display elements to be connected to each other, a coupling member for structurally coupling the plurality of circuit elements is provided, and a conductive material is transferred onto the surface of the coupling member. By forming a connection circuit pattern consisting of a pattern, and forming a conductive pattern on an elastic member interposed between a circuit element such as the above-mentioned printed circuit board attached to the bonding member and the bonding member, the transfer conductive pattern on the surface of the bonding member and the conductive pattern are formed. A conductive pattern connection structure characterized by electrically connecting the connection terminals of each circuit element to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2599986U JPS62137572U (en) | 1986-02-24 | 1986-02-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2599986U JPS62137572U (en) | 1986-02-24 | 1986-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62137572U true JPS62137572U (en) | 1987-08-29 |
Family
ID=30826669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2599986U Pending JPS62137572U (en) | 1986-02-24 | 1986-02-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62137572U (en) |
-
1986
- 1986-02-24 JP JP2599986U patent/JPS62137572U/ja active Pending