JPS62136573A - Plasma treatment device - Google Patents
Plasma treatment deviceInfo
- Publication number
- JPS62136573A JPS62136573A JP27675885A JP27675885A JPS62136573A JP S62136573 A JPS62136573 A JP S62136573A JP 27675885 A JP27675885 A JP 27675885A JP 27675885 A JP27675885 A JP 27675885A JP S62136573 A JPS62136573 A JP S62136573A
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- Prior art keywords
- reaction chamber
- gas
- excited species
- plasma
- metastable excited
- Prior art date
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- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は半導体プロセスなどに利用されるプラズマ被膜
形成やプラズマエツチングを行うプラズマ処理装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a plasma processing apparatus that performs plasma film formation and plasma etching used in semiconductor processes and the like.
半導体装置等の製造工程がドライ化の方向に進みプラズ
マを利用した被膜形成やエツチング方法が多用されてい
る。このようなプラズマ処理装置における処理効率を高
める手段として2つのプラズマ発生室を設ける方法が考
案され、公開特許公報昭59−145530号、同町5
9−148326号、同町59−191324号公報等
で公知化されている。このような公知例に於ては、反応
ガスはまず第1の放電室(予備室)で予備分解を受け、
しかる後に第2の放電室である反応室に導かれている。BACKGROUND ART As the manufacturing process of semiconductor devices and the like has progressed towards a dry process, film formation and etching methods using plasma are increasingly being used. As a means of increasing the processing efficiency in such a plasma processing apparatus, a method of providing two plasma generation chambers was devised, and was disclosed in Japanese Patent Publication No. 59-145530,
It is publicly known in No. 9-148326, Town No. 59-191324, etc. In such known examples, the reaction gas first undergoes preliminary decomposition in a first discharge chamber (preliminary chamber),
Thereafter, it is led to a reaction chamber, which is a second discharge chamber.
その結果、反応室(第2の放電室)内のプラズマ密度は
従来法に較べて遥かに高くなり、膜形成やエツチングの
処理速度が向上するとされている。As a result, the plasma density in the reaction chamber (second discharge chamber) becomes much higher than in the conventional method, and it is said that the processing speed of film formation and etching is improved.
このように第1の放電室(予備室)で反応ガスを予備分
解する方法は、反応室(第2の放電室)内での活性種を
増大させる手段として効果的ではあるが、一方第1の放
電室で生成した多くのラジカルや分解生成物は反応室(
第2の放電室)に入る前に再結合などによって不活化す
るという問題点があった。また、第1の放電室と反応室
(第2の放電室)とを連結する管の内壁に反応生成物の
被膜が多量付着するなどの問題点もあった。Although the method of preliminarily decomposing the reaction gas in the first discharge chamber (preliminary chamber) is effective as a means of increasing the number of active species in the reaction chamber (second discharge chamber), on the other hand, Many radicals and decomposition products generated in the discharge chamber are transferred to the reaction chamber (
There was a problem in that the cells were inactivated by recombination before entering the second discharge chamber (second discharge chamber). Further, there were also problems such as a large amount of reaction product film adhering to the inner wall of the tube connecting the first discharge chamber and the reaction chamber (second discharge chamber).
本発明の目的は上記の問題点を解決し、反応室(第2の
放電室)内での反応性ガスの活性化効率を高めるプラズ
マ処理装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma processing apparatus that solves the above-mentioned problems and improves activation efficiency of reactive gas within a reaction chamber (second discharge chamber).
本発明の他の目的は、第1の放電室と反応室(第2の放
電室)とを連結する管の内壁に反応生成物による被膜が
ほとんど付着しないプラズマ処理装置を提供することに
ある。Another object of the present invention is to provide a plasma processing apparatus in which a film of reaction products hardly adheres to the inner wall of a tube connecting a first discharge chamber and a reaction chamber (second discharge chamber).
上記の目的を達成するために、本発明に於ては第1の放
電室で長寿命の準安定励起原子・分子を発生させ、しか
るのちに反応室(第2の放電室)に該準安定励起種を導
くと共に反応ガスを第1の放電室を経由せず直接反応室
(第2の放電室)に導くようにしたことを特徴としてい
る。In order to achieve the above object, in the present invention, long-lived metastable excited atoms/molecules are generated in a first discharge chamber, and then the metastable excited atoms/molecules are transferred to a reaction chamber (second discharge chamber). It is characterized in that it guides the excited species and also guides the reactive gas directly to the reaction chamber (second discharge chamber) without passing through the first discharge chamber.
したがって本発明は、被処理基板を収容する反応室、準
安定励起種を発生する第1のプラズマ発生手段、該準安
定励起種を前記反応室に導く手段、前記反応室に反応性
ガスを導入する手段、該反応室に導入した反応性ガスを
活性化する第2のプラズマ発生手段を有することを特徴
としている。Therefore, the present invention provides a reaction chamber for accommodating a substrate to be processed, a first plasma generating means for generating a metastable excited species, a means for guiding the metastable excited species into the reaction chamber, and a reactive gas introduced into the reaction chamber. and a second plasma generating means for activating the reactive gas introduced into the reaction chamber.
以下、本発明の一実施例を第1図により説明する。図に
於て1は反応室、2は被処理基板であり電極12上に設
置されている63は準安定励起原子・分子発生の為のガ
ス源で、ガス源3から出たガスは弁4を経て第1のプラ
ズマ発生手段により準安定励起種に変換される。図に於
て6はマイクロ波電源、5は準安定励起種発生部である
キャビティーを表わし、5と6が第1のプラズマ発生手
段に相当する。3のガス源に貯蔵されろガスが例えは窒
素ガスの場合、前記第1のプラズマ発生手段によって5
で発生した準安定励起窒素分子N2(A 3Σいは6.
17eVの励起エネルギーをもち長時間励起状態(寿命
は2.1秒)に留まっている。An embodiment of the present invention will be described below with reference to FIG. In the figure, 1 is a reaction chamber, 2 is a substrate to be processed, and 63 installed on the electrode 12 is a gas source for generating metastable excited atoms and molecules. After that, it is converted into a metastable excited species by the first plasma generation means. In the figure, 6 represents a microwave power source, 5 represents a cavity which is a quasi-stable excited species generating section, and 5 and 6 correspond to the first plasma generating means. If the gas stored in the 3 gas source is, for example, nitrogen gas, the 5 gas is generated by the first plasma generating means.
The metastable excited nitrogen molecule N2 (A 3Σ or 6.
It has an excitation energy of 17 eV and remains in an excited state for a long time (lifetime is 2.1 seconds).
そのため、準安定励起発生部5(キャビティー)+
内で発生したNZ(AδΣU)は、該発生部5から離れ
た位置に移動した段階に於ても励起状態に留まっている
。このような長寿命を有する準安定励起種は7を経て反
応室1に導入される。一方、8は反応性ガスの貯蔵部で
あり、該ガス弁9.管10を通して反応室1に導かれる
。反応室1には、RF電源11とつながった電極12が
設置され、11と12からなる第2のプラズマ発生手段
によって前記の如く導入された反応性ガスが分解もしく
は活性化され、前記電極12上に設置された被処理基板
2のエツチングや該基板2上への被膜形成が行われる。Therefore, NZ (AδΣU) generated within the metastable excitation generating section 5 (cavity) + remains in the excited state even at the stage where it moves to a position away from the generating section 5. Such a long-lived metastable excited species is introduced into the reaction chamber 1 through step 7. On the other hand, 8 is a storage section for reactive gas, and the gas valve 9. It is led to the reaction chamber 1 through a tube 10. An electrode 12 connected to an RF power source 11 is installed in the reaction chamber 1, and the reactive gas introduced as described above is decomposed or activated by the second plasma generating means consisting of 11 and 12, and the reactive gas is decomposed or activated on the electrode 12. Etching of the substrate 2 to be processed placed on the substrate 2 and formation of a film on the substrate 2 are performed.
尚、13は排気管である。Note that 13 is an exhaust pipe.
このようにガス貯蔵部8から出た反応性ガスは主として
第2のプラズマ発生手段によって分M、もしくは活性化
されるが、同時に第1のプラズマ発生手段により生成し
、反応室1に導入されろ準安定励起種からもエネルギー
が伝達されろことがら、反応室1内における反応性ガス
の分解もしくは活性化の反応は促進されることになる。The reactive gas discharged from the gas storage section 8 is mainly activated by the second plasma generating means, but at the same time it is generated by the first plasma generating means and introduced into the reaction chamber 1. Since energy is also transferred from the metastable excited species, the decomposition or activation reaction of the reactive gas in the reaction chamber 1 is promoted.
第1図に於て5および6からなる第1のプラズマ発生手
段を取り除くと、既存の平行平板型のプラズマ処理装置
の構成となる。従来からの平行平板型の処理装置では、
被処理基板を均一にプラズマ処理することができるとい
う長所はあるが、他のプラズマ処理方法と較べて処理能
力が小さいという欠点があった。しかしながら前記の第
1のプラズマ発生手段を具備することにより゛、高周波
電源11の出力を高めることなく、したがって被処理基
板2の損傷を増大させることなく処理能力の欠点をカバ
ーできるようになっている。If the first plasma generating means consisting of 5 and 6 in FIG. 1 is removed, the configuration becomes the existing parallel plate type plasma processing apparatus. In conventional parallel plate type processing equipment,
Although it has the advantage that the substrate to be processed can be uniformly plasma-processed, it has the disadvantage that the processing capacity is low compared to other plasma processing methods. However, by providing the above-mentioned first plasma generation means, it is possible to overcome the shortcomings in processing capacity without increasing the output of the high frequency power source 11 and therefore without increasing damage to the substrate 2 to be processed. .
上にのべたように、長寿命の準安定励起種を生成する特
定のガスのみをガス貯蔵部3に貯蔵し該ガス貯蔵部から
のガスを選択的に第1のプラズマ発生手段で活性化し、
他の反応性ガスは直接反応室1に導入する形態をとるこ
とから、第1のプラズマ発生手段により発生した準安定
励起種が反応室1に入る前に他の反応ガスと衝突して不
活化する確率は低減される。したがって準安定励起種発
生部5と反応室1を連結する管の内壁に反応生成物が付
着するという不都合も改善される。第1図の実施例によ
り窒化膜を形成する際の具体例を次に示す。図のガス貯
蔵部3に窒素を貯蔵し、第1のプラズマ発生手段によっ
て窒素の準安定励起種+
子N2(AδΣU)を発生させて反応室1に導くと共に
反応性ガスの貯蔵部8にモノシランガスを貯蔵して、該
反応性ガスをリークしてt11極12間で高周波放電を
行わせると、被処理基板2上に5iaNa膜が効率よく
生成する。As mentioned above, only a specific gas that generates long-lived metastable excited species is stored in the gas storage section 3, and the gas from the gas storage section is selectively activated by the first plasma generation means,
Since other reactive gases are directly introduced into the reaction chamber 1, the metastable excited species generated by the first plasma generation means collide with other reactive gases and become inactivated before entering the reaction chamber 1. The probability of this happening is reduced. Therefore, the inconvenience of reaction products adhering to the inner wall of the tube connecting the metastable excited species generating section 5 and the reaction chamber 1 is also alleviated. A specific example of forming a nitride film according to the embodiment shown in FIG. 1 will be described below. Nitrogen is stored in the gas storage section 3 shown in the figure, and a metastable excited species of nitrogen N2 (AδΣU) is generated by the first plasma generation means and guided to the reaction chamber 1, and a monosilane gas is stored in the reactive gas storage section 8. When the reactive gas is stored and the reactive gas is leaked to generate a high frequency discharge between the t11 poles 12, a 5iaNa film is efficiently generated on the substrate 2 to be processed.
第2図は本発明の第2の実施例であり、第1図の実施例
の装置構成に加えて1反応室1内に光エネルギーを照射
する機能を付加したものである。FIG. 2 shows a second embodiment of the present invention, in which a function for irradiating light energy into one reaction chamber 1 is added to the apparatus configuration of the embodiment shown in FIG.
図に於て14は光源、15はレンズ、16は反応室1に
設けられた光透過窓であり、その他は第1図の構成と同
じである。第2図の実施例では、第1及び第2のプラズ
マ発生手段の他に光idR反応を利用して反応性ガスを
分解もしくは活性化できることから、処理効率を更に高
めることができる。In the figure, 14 is a light source, 15 is a lens, 16 is a light transmitting window provided in the reaction chamber 1, and the rest of the structure is the same as that in FIG. 1. In the embodiment shown in FIG. 2, the reactive gas can be decomposed or activated using the optical idR reaction in addition to the first and second plasma generating means, so that the processing efficiency can be further improved.
光源14には1反応性ガスを分解もしくは活性化するに
適した紫外線光m(エキシマレーザ−など)や炭酸ガス
レーザー等を利用することができる。As the light source 14, ultraviolet light (such as an excimer laser), carbon dioxide laser, or the like suitable for decomposing or activating a reactive gas can be used.
尚上記実施例の説明では、準安定励起種発生用のガスと
して窒素を引用したが、その他酸素、希ガスなどの準安
定励起種を有効利用できる。但しプラズマ処理装置とし
ての効率を高める為には。In the description of the above embodiments, nitrogen was cited as the gas for generating metastable excited species, but other metastable excited species such as oxygen and rare gases can be effectively used. However, in order to increase the efficiency of the plasma processing equipment.
準安定励起状態の寿命が10ms以上ある励起種を利用
することが望ましい。さらに、基板上での反応の均一性
を得るためには、より長い寿命を有する励起種を必要と
じ100 m s以上であることが望ましい。このよう
な長寿命の準安定励起種を生成するガスを選択すると共
に、反応室に導入する準安定励起種を均一に分布させる
ことが重要な課題となってくる。そのような手段として
は、被処理基板を取り囲むごとく環状管を設置すると共
に該環状管を準安定励起種の導入管(第1図及び第2図
の7に相当)と接続し、更に該環状管にほぼ等間隔に前
記準安定励起種の噴出口を設ける方法が有効である。It is desirable to use an excited species whose metastable excited state has a lifetime of 10 ms or more. Furthermore, in order to obtain uniformity of the reaction on the substrate, an excited species with a longer lifetime is required, preferably 100 m s or more. It is important to select a gas that generates such long-lived metastable excited species and to uniformly distribute the metastable excited species introduced into the reaction chamber. As such means, an annular tube is installed to surround the substrate to be processed, and the annular tube is connected to an introduction tube for metastable excited species (corresponding to 7 in FIGS. 1 and 2), and the annular tube is An effective method is to provide jet ports for the metastable excited species at approximately equal intervals in the tube.
反応性ガスとしては、モノシランの例を引用したが、プ
ラズマ処理装置の利用形態に応じて所望のガスを利用す
ることができる。たとえば本発明を被膜形成の手段とし
ては利用する場合は、モノシラン、ジシラン、アルシン
、ホスフィン、ジボランなどの水素化物、トリメチルガ
リウム、トリメチルアルミニウムなどの有機金属化合物
、更には各種金属カルボニルなどを利用することができ
る。また本発明をドライエツチングの手段として使用す
る場合は、CQz、 S Fe、 CF41 CCI2
4などハロゲンガスやハロゲン元素含有ガスを利用する
ことができる。Although monosilane has been cited as an example of the reactive gas, any desired gas can be used depending on the usage pattern of the plasma processing apparatus. For example, when using the present invention as a means for forming a film, hydrides such as monosilane, disilane, arsine, phosphine, and diborane, organometallic compounds such as trimethylgallium and trimethylaluminum, and various metal carbonyls may be used. I can do it. Furthermore, when the present invention is used as a dry etching means, CQz, S Fe, CF41 CCI2
A halogen gas or a halogen element-containing gas such as No. 4 can be used.
第1図の実施例の説明の所で窒化膜を形成する際の具体
例をのべた。この事例の場合は、第1のプラズマ発生手
段により生成した準安定励起種+
(Nz;A”ΣU)が窒化膜形成反応を誘起させると共
に該窒化膜を構成する元素ともなっている。このように
準安定励起種が膜の構成元素になることもあるが、単に
ガス源8から流出する反応ガスを分解もしくは活性化す
ることのみに利用されることもある。その場合、第1の
プラズマ発生手段により生成した準安定励起種は単なる
エネルギー伝達を司るエネルギーキャリヤーの役目を果
す。例えば希ガスの準安定励起種を利用するプラズマ処
理方法はそのような例といえる。In the description of the embodiment shown in FIG. 1, a specific example of forming a nitride film was described. In this case, the metastable excited species + (Nz; A"ΣU) generated by the first plasma generation means not only induces the nitride film formation reaction but also serves as an element constituting the nitride film. In this way, The metastable excited species may become a constituent element of the film, but it may also be used simply to decompose or activate the reactive gas flowing out from the gas source 8. In that case, the first plasma generating means The metastable excited species generated by this process simply serves as an energy carrier that controls energy transfer.For example, a plasma processing method that uses metastable excited species of rare gases is an example of such a method.
尚窒素などの準安定励起種は高いエネルギーを有する為
、前記の公知例でのべられているような実施形態つまり
反応性ガスをすべて第1のプラズマ発生部を通したのち
第2のプラズマ発生部(反応処理室)に導く方式では効
率よく準安定励起種を形成することは難しい。Note that metastable excited species such as nitrogen have high energy, so the embodiment described in the above-mentioned known example, that is, the second plasma generation is performed after all the reactive gas passes through the first plasma generation section. It is difficult to efficiently form metastable excited species using a method that introduces metastable species into a reaction chamber.
本発明では、長寿命の準安定励起種を形成するガスのみ
を選別して第1のプラズマ発生手段を経由させる為、効
率よく準安定励起種を形成でき、かつ該励起種をプラズ
マ処理に有効利用できるという長所がある。In the present invention, since only the gas that forms long-lived metastable excited species is selected and passed through the first plasma generation means, metastable excited species can be efficiently formed and the excited species can be effectively used in plasma processing. It has the advantage of being available.
本発明によれば、第1の放電室(予備室)で生成したラ
ジカルや分解生成物が反応室に入る前に再結合などによ
って不活化するという問題点や第1の放電室と反応室と
を連結する管の内壁に反応生成物の被膜が付着するなど
の問題点を改善できるという効果がある。According to the present invention, there are problems that radicals and decomposition products generated in the first discharge chamber (preliminary chamber) are inactivated by recombination before entering the reaction chamber, and that the first discharge chamber and the reaction chamber are This has the effect of improving problems such as the formation of a film of reaction products on the inner walls of the pipes connecting the two.
第1図は本発明の第1の実施例を示す装置の概略構成図
、第2図は本発明の第2実施例を示す装置の概略構成図
である。
1・・・反応室、2・・・被処理基板、3,8・・・ガ
ス貯蔵部、5・・・準安定励起種発生部、6.11・・
・flt源、12・・・電極、13・・・排気管、14
・・・光源、16・・・光透過窓。FIG. 1 is a schematic diagram of an apparatus according to a first embodiment of the present invention, and FIG. 2 is a schematic diagram of an apparatus according to a second embodiment of the invention. DESCRIPTION OF SYMBOLS 1... Reaction chamber, 2... Substrate to be processed, 3, 8... Gas storage section, 5... Metastable excited species generation section, 6.11...
・flt source, 12... electrode, 13... exhaust pipe, 14
...Light source, 16...Light transmission window.
Claims (1)
生する第1のプラズマ発生手段と、該準安定励起種を前
記反応室に導く手段と、前記反応室に反応性ガスを導入
する手段と、前記反応室に導入した反応性ガスを活性化
する第2のプラズマ発生手段とを有することを特徴とす
るプラズマ処理装置。 2、前記準安定励起種の寿命が10msより長寿命を有
するものからなることを特徴とする特許請求の範囲第1
項記載のプラズマ処理装置。 3、前記準安定励起種発生用のガスとして希ガス、窒素
又は酸素のうちの少なくとも1種を利用することを特徴
とする特許請求の範囲第1項記載のプラズマ処理装置。 4、前記準安定励起種を反応室に導入する手段ととして
、前記被処理基板を取り囲むごとく設置した環状管に設
けられたガス噴出口より該準安定励起種を導入すること
を特徴とする特許請求の範囲第1項記載のプラズマ処理
装置。 5、前記反応室に導入された反応性ガスの光誘起反応を
進行せしめるための光源を付加したことを特徴とする特
許請求の範囲第1項記載のプラズマ処理装置。 6、前記第2のプラズマが平行平板型放電により形成す
ることを特徴とする特許請求の範囲第1項記載のプラズ
マ処理装置。[Scope of Claims] 1. A reaction chamber that accommodates a substrate to be processed, first plasma generation means for generating metastable excited species, means for guiding the metastable excited species to the reaction chamber, and the reaction chamber. A plasma processing apparatus comprising: means for introducing a reactive gas into the reaction chamber; and second plasma generation means for activating the reactive gas introduced into the reaction chamber. 2. Claim 1, characterized in that the metastable excited species has a lifetime longer than 10 ms.
The plasma processing apparatus described in Section 1. 3. The plasma processing apparatus according to claim 1, wherein at least one of a rare gas, nitrogen, and oxygen is used as the gas for generating the metastable excited species. 4. A patent characterized in that, as a means for introducing the metastable excited species into the reaction chamber, the metastable excited species is introduced from a gas outlet provided in an annular tube installed so as to surround the substrate to be processed. A plasma processing apparatus according to claim 1. 5. The plasma processing apparatus according to claim 1, further comprising a light source for advancing a photo-induced reaction of the reactive gas introduced into the reaction chamber. 6. The plasma processing apparatus according to claim 1, wherein the second plasma is formed by parallel plate discharge.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27675885A JPS62136573A (en) | 1985-12-11 | 1985-12-11 | Plasma treatment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27675885A JPS62136573A (en) | 1985-12-11 | 1985-12-11 | Plasma treatment device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62136573A true JPS62136573A (en) | 1987-06-19 |
Family
ID=17573935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27675885A Pending JPS62136573A (en) | 1985-12-11 | 1985-12-11 | Plasma treatment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62136573A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01152629A (en) * | 1987-07-16 | 1989-06-15 | Texas Instr Inc <Ti> | Apparatus and method for treatment |
JPH01220830A (en) * | 1987-07-16 | 1989-09-04 | Texas Instr Inc <Ti> | Apparatus and method for treatment |
JPH02146744A (en) * | 1987-07-17 | 1990-06-05 | Texas Instr Inc <Ti> | Treating device and method |
JPH02183525A (en) * | 1989-01-10 | 1990-07-18 | Ulvac Corp | Plasma ashing device |
WO2004086451A3 (en) * | 2003-03-21 | 2005-06-02 | Zond Inc | Plasma generation using multi-step ionization |
WO2004102610A3 (en) * | 2003-05-06 | 2005-11-17 | Zond Inc | Generation of uniformly-distributed plasma |
-
1985
- 1985-12-11 JP JP27675885A patent/JPS62136573A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01152629A (en) * | 1987-07-16 | 1989-06-15 | Texas Instr Inc <Ti> | Apparatus and method for treatment |
JPH01220830A (en) * | 1987-07-16 | 1989-09-04 | Texas Instr Inc <Ti> | Apparatus and method for treatment |
JPH02146744A (en) * | 1987-07-17 | 1990-06-05 | Texas Instr Inc <Ti> | Treating device and method |
JPH02183525A (en) * | 1989-01-10 | 1990-07-18 | Ulvac Corp | Plasma ashing device |
WO2004086451A3 (en) * | 2003-03-21 | 2005-06-02 | Zond Inc | Plasma generation using multi-step ionization |
WO2004102610A3 (en) * | 2003-05-06 | 2005-11-17 | Zond Inc | Generation of uniformly-distributed plasma |
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