JPS62134272U - - Google Patents
Info
- Publication number
- JPS62134272U JPS62134272U JP2134686U JP2134686U JPS62134272U JP S62134272 U JPS62134272 U JP S62134272U JP 2134686 U JP2134686 U JP 2134686U JP 2134686 U JP2134686 U JP 2134686U JP S62134272 U JPS62134272 U JP S62134272U
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- wiring board
- hybrid integrated
- integrated wiring
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 claims description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Description
第１図はこの考案の一実施例の混成集積配線板
の断面図、第２図は従来の混成集積配線板の断面
図、第３図はこの考案の一実施例のアルミナ繊維
の充填率％と接着強度（Kg／cm）の相関を示す特
性図、第４図ａ、第４図ｂは各々この考案の一実
施例および従来の混成集積配線板の基板の温度分
布を示す特性図である。
図において、１はアルミナ繊維、２は有機質高
分子、３は金属基板、４は導電性金属箔層、６は
絶縁層である。なお、各図中同一符号は同一又は
相当部分を示す。
Fig. 1 is a cross-sectional view of a hybrid integrated wiring board according to an embodiment of this invention, Fig. 2 is a sectional view of a conventional hybrid integrated wiring board, and Fig. 3 is a % filling percentage of alumina fibers according to an embodiment of this invention. 4a and 4b are characteristic diagrams showing the temperature distribution of the substrate of an embodiment of this invention and a conventional hybrid integrated wiring board, respectively. . In the figure, 1 is an alumina fiber, 2 is an organic polymer, 3 is a metal substrate, 4 is a conductive metal foil layer, and 6 is an insulating layer. Note that the same reference numerals in each figure indicate the same or equivalent parts.
補正 昭６１．１２．８
実用新案登録請求の範囲を次のように補正する
。Amendment December 8, 1981 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
(1) 金属基板、その金属基板の少なくとも一主
面に設けられた絶縁層、およびその絶縁層に設け
られた導電性金属箔層を有するものにおいて、上
記絶縁層が、アルミナ繊維を主成分としたものを
抄紙して得られるアルミナシートに、有機高分子
を含浸処理して形成されたものである混成集積配
線板。
(2) アルミナ繊維の繊維径が５０μｍ以下で繊
維長が繊維径の１０倍以上である実用新案登録請
求の範囲第１項記載の混成集積配線板。
(3) アルミナシートは、結合剤としてミクロフ
イブリル化した有機繊維を用いて抄紙されたもの
である実用新案登録請求の範囲第１項又は第２項
記載の混成集積配線板。
(4) 絶縁層は、主成分のアルミナ繊維の混入率
が７０重量％以下である実用新案登録請求の範囲
第１項ないし第３項の何れかに記載の混成集積配
線板。[Claims for Utility Model Registration] (1) A metal substrate, an insulating layer provided on at least one main surface of the metal substrate, and a conductive metal foil layer provided on the insulating layer, wherein the insulating layer However, a hybrid integrated wiring board is formed by impregnating an alumina sheet, which is obtained by making paper with alumina fiber as its main component, with an organic polymer. (2) The hybrid integrated wiring board according to claim 1, wherein the alumina fibers have a fiber diameter of 50 μm or less and a fiber length of 10 times or more the fiber diameter. (3) The hybrid integrated wiring board according to claim 1 or 2, wherein the alumina sheet is paper-made using microfibrillated organic fibers as a binder. (4) The hybrid integrated wiring board according to any one of claims 1 to 3, wherein the insulating layer has a mixture ratio of alumina fiber as a main component of 70% by weight or less.
Claims (1)
面に設けられた絶縁層、およびその絶縁層に設け
られた導電性金属箔層を有するものにおいて、上
記絶縁層が、アルミナ繊維を主成分としたものを
抄紙して得られるアルミナシートに、有機高分子
を含浸処理して形成されたものである混成集積配
線板。 (2) アルミナ繊維の繊維径が５０μｍ以下で繊
維長が繊維径の１０倍以上である実用新案登録請
求の範囲第１項記載の混成集積配線板。 (3) アルミナシートは、結合剤としてミクロフ
イプリル化した有機繊維を用いて抄紙されたもの
である実用新案登録請求の範囲第１項又は第２項
記載の混成集積配線板。 (4) アルミナシートは、主成分のアルミナ繊維
の混入率が７０重量％以下である実用新案登録請
求の範囲第１項ないし第３項の何れかに記載の混
成集積配線板。[Claims for Utility Model Registration] (1) A metal substrate, an insulating layer provided on at least one main surface of the metal substrate, and a conductive metal foil layer provided on the insulating layer, wherein the insulating layer However, a hybrid integrated wiring board is formed by impregnating an alumina sheet, which is obtained by making paper with alumina fiber as its main component, with an organic polymer. (2) The hybrid integrated wiring board according to claim 1, wherein the alumina fibers have a fiber diameter of 50 μm or less and a fiber length of 10 times or more the fiber diameter. (3) The hybrid integrated wiring board according to claim 1 or 2, wherein the alumina sheet is paper-made using microfibrillated organic fibers as a binder. (4) The hybrid integrated wiring board according to any one of claims 1 to 3, wherein the alumina sheet has a content of alumina fiber as a main component of 70% by weight or less.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2134686U JPS62134272U (en) | 1986-02-17 | 1986-02-17 | |
| US07/014,742 US4784893A (en) | 1986-02-17 | 1987-02-13 | Heat conductive circuit board and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2134686U JPS62134272U (en) | 1986-02-17 | 1986-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62134272U true JPS62134272U (en) | 1987-08-24 |
Family
ID=30817707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2134686U Pending JPS62134272U (en) | 1986-02-17 | 1986-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62134272U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004515610A (en) * | 2000-12-12 | 2004-05-27 | シュリ ディクシャ コーポレイション | Lightweight circuit board including conductive constrained core |
-
1986
- 1986-02-17 JP JP2134686U patent/JPS62134272U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004515610A (en) * | 2000-12-12 | 2004-05-27 | シュリ ディクシャ コーポレイション | Lightweight circuit board including conductive constrained core |
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