JPS62131552A - Semiconductor device - Google Patents

Abstract

PURPOSE:To implement high density packaging, by bending and taking out base signal terminals and emitter signal terminals from the side surfaces of a semiconductor device in the horizontal direction with respect to the attaching direction or from the horizontal direction of the side surfaces of the semiconductor device in the vertical direction, thereby omitting connecting wirings, and making it possible to perform printed wirings. CONSTITUTION:Base signal terminals 4a-4f and emitter signal terminals 5a-5f are bent and taken out of both side surfaces of a semiconductor device in the horizontal direction. Or the terminals are bent and taken out of the horizontal direction of both side surfaces of the semiconductor device toward the lower surface, i.e., in the vertical direction. The semiconductor device is fixed to a heat sink 6. The connection between the base semiconductor device and a control substrate 7 is performed by inserting the base signal terminals and the emitter signal terminals, which are taken out of the side surfaces of the semiconductor device, into a connector 8, which is fixed on the control substrate 7. The base signal terminals and the emitter signal terminals, which are bent and taken out of the side surfaces toward the lower surface, are directly soldered to the control substrate 7. Since the base signal terminals and the emitter signal terminals do not undergo interconnecting wiring and the like and are connected to the control substrate 7, high density packaging and improvement in workability can be implemented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor device that enables higher-density packaging in order to improve signal terminals of semiconductor devices such as power semiconductor modules.

[Conventional technology]

FIG. 3 is a perspective view showing the external shape of a conventional semiconductor device.
In the following, a six-element power semiconductor module for an inverter will be explained as an example.

In FIG. 3, 1 and 2 are main electrodes, which are positive and negative DC input terminals, 3a to 3c are three-phase AC output terminals, and 41
~4f are pace signal terminals (1; child, 5a~5th emitter signal terminals).

First of all, a power semiconductor device has a signal terminal through which a small current flows and a main electrode through which a large current flows.

The conventional semiconductor device shown in FIG. 3 is no exception, and has base signal terminals 4a to 4 [1 and -T-5 signal terminals 5a to 5] as signal terminals through which small currents flow. It also has positive and negative DC input terminals 1, 2 and three-phase AC output terminals 3a to 3c as main electrodes through which large current flows.

When using this semiconductor device, please contact the base No. 43 terminal 4a.
~4 [and emitter 1 width 1 ryo 5a ~ 5] are electrically connected to the control board, and positive and negative 1α flow input terminals 1,
It is necessary to electrically connect the two- and three-phase AC output terminals 33 to 3c to external equipment so that losses due to resistance, impedance, etc. during wiring are reduced.

[Problem that the invention seeks to solve]

Therefore, in the conventional semiconductor device shown in FIG. It is also a pulse signal that goes up to the hybrid integrated circuit, and is very small compared to the current flowing through the main electrode. From the perspective, positive and negative DC input terminals 1.2 and three-phase AC output terminals 3a to 3c are the main electrodes that require large currents.
Since it is necessary to connect and wire the base signal terminals 48 to 4f and emitter signal terminals 5a to 5f, which require a small current, to the control board (not shown) in close proximity to There were problems such as the amount of water required.

This invention was made in order to solve the above-mentioned problems, and it eliminates the connection wiring to the base signal terminal and the emitter signal terminal, making it possible to use printed wiring, and to create a semiconductor that can be mounted in high density. The purpose is to obtain equipment.

[Means for solving problems]

In the semiconductor device according to the present invention, the base No. 49 terminal and the emitter signal terminal can be taken out from the side of the semiconductor device by bending them horizontally to the mounting direction or vertically from the horizontal direction of the side of the semiconductor device. .

[Effect]

In this invention, since the semiconductor device is bent horizontally from the 6tlJ plane or bent vertically from the horizontal direction, it is easy to connect it to the board by directly attaching it to the board or by using printed wiring using a connector, etc. This eliminates the need for connection wiring and enables high-density packaging.

〔Example〕

1 and 2 are perspective views showing an embodiment of the present invention, and the same reference numerals as in FIG. 3 indicate the same parts, but in the embodiment of FIG. Emitter signal terminals 5a-5'' are taken out horizontally from both sides of the semiconductor device, and in the embodiment of FIG. 2, base signal terminals 4a-4f and emitter signal terminals 58-5f.
from both sides of the semiconductor device horizontally to the bottom surface,
That is, it is bent vertically and taken out. and,
These semiconductor devices are fixed to a heat sink 6.

The connection between the semiconductor device and the control board 7 in FIG.
This is done by inserting the f and emitter signal terminals 58 to 51 into the connector 8 fixed on the control board 7.

In addition, in FIG. 2, the connection between the semiconductor device and the control board 7 is made by base signal terminals 4a to 4f and emitter signal terminals 58 bent downward from the side surface of the semiconductor device.
~5 [is performed by soldering, etc. directly to the control board 7.

As described above, according to this embodiment, the semiconductor device has base signal terminals 4a to 4f and emitter signal terminals 58 to 5.
Since r is connected to the control board 7 without any connection wiring or the like, it is also possible to achieve high-density mounting and improve workability.

In the above embodiment, a six-element transistor module for an inverter has been described, but any power semiconductor module or power semiconductor device may be used, and the same effects as in the above embodiment can be achieved. is clear.

〔Effect of the invention〕

As explained above, this invention is configured so that the base signal terminal and the terminal No. 3 of the connector are taken out from both sides of the semiconductor device in the horizontal direction or by bending from the horizontal direction to the vertical direction, so that they can be directly connected to the control board. can be done. Therefore, there is an effect that high-density packaging of semiconductor devices and control boards and improvement of workability can be achieved.

[Brief explanation of drawings]

FIGS. 1 and 2 are perspective views showing a connection process between a semiconductor device and a control board, respectively showing one embodiment of the present invention, and FIG. 3 is a perspective view showing a conventional semiconductor device. In the figure, 1 and 2 are DC input terminals, 3a to 3c are three-phase AC output terminals, 41st to 4th are the base (t-i terminal, 5th
a to 5f are emitter signal terminals, and 6 is a power source heating plate. Note that the same reference numerals in each figure indicate corresponding parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] A semiconductor device comprising a required number of main electrodes and signal terminals and sealed with resin, characterized in that each of the signal terminals is taken out from a side surface of the semiconductor device by bending it horizontally or from the horizontal direction to the vertical direction. semiconductor devices.