JPS6213030A - Vacuum device - Google Patents

Vacuum device

Info

Publication number
JPS6213030A
JPS6213030A JP15268785A JP15268785A JPS6213030A JP S6213030 A JPS6213030 A JP S6213030A JP 15268785 A JP15268785 A JP 15268785A JP 15268785 A JP15268785 A JP 15268785A JP S6213030 A JPS6213030 A JP S6213030A
Authority
JP
Japan
Prior art keywords
vacuum
gas
cover
vacuum pump
connecting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15268785A
Other languages
Japanese (ja)
Inventor
Yoichi Onishi
陽一 大西
Hirozo Shima
島 博三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15268785A priority Critical patent/JPS6213030A/en
Publication of JPS6213030A publication Critical patent/JPS6213030A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To largely improve the safety of a vacuum device by disposing a cover having airtightness and flexibility on the outer periphery of a portion made of a flexible tube of a connecting member, and providing means for detecting the state change of a sealed space. CONSTITUTION:Reacted gas produced in a vacuum vessel 11 is transported through the interior of a connecting part 19a and through a vacuum pump 16, further treated by exhaust gas treating means 18, and exhausted into the atmosphere. Since an airtight cover 19b is disposed on the outer periphery of a connecting member 19a, even if the member 19a is corroded by the transporting gas so that a hole is opened, the gas is not leaked to the atmosphere. Nitrogen gas is sealed at 1.5atm in a space between the member 19a and the cover 19b to detect the pressure change by a pressure sensor 20, and fed back to control system of a vacuum device body. Thus, the safety of the vacuum device can be improved.

Description

【発明の詳細な説明】 産業上の利用分野 2ページ 本発明は、低温プラズマを利用し、被加工物にエツチン
グ加工を施すためのドライエツチング装置並びに、プラ
ズマCV D (Chemical VaporDep
os i t i on)法によって、被加工物の表面
に薄膜を堆積するだめのプラズマCVD装置等に用いる
真空装置に関するものである。
Detailed Description of the Invention: Industrial Field of Application (2 pages) The present invention relates to a dry etching apparatus for etching a workpiece using low-temperature plasma, and a plasma CVD (Chemical VaporDep)
The present invention relates to a vacuum device used in a plasma CVD device or the like for depositing a thin film on the surface of a workpiece by an os i t i on method.

従来の技術 近年、低温プラズマを利用した設備は、半導体。Conventional technology In recent years, equipment that uses low-temperature plasma is semiconductors.

電子部品等の製造工程において、製造上欠くことのでき
ないものとなった。特に、ドライエツチング法、プラズ
マCVD法の製造工程への導入が、急激に目立つように
なった。
It has become indispensable in the manufacturing process of electronic components. In particular, the introduction of dry etching methods and plasma CVD methods into manufacturing processes has rapidly become more prominent.

ドライエツチング法は、真空容器内に基材を保持し、ハ
ロゲン元素を含む化合物ガスを供給し、所定の圧力に一
定に保った後、高周波エネルギまたは直流電力によって
、前記化合物ガスを励起し、すなわち低温プラズマ化し
、基材が、その低温プラズマ中の活性なラジカル粒子ま
たはイオンと接触することによシ、エツチングがなされ
る方法である。
In the dry etching method, a base material is held in a vacuum container, a compound gas containing a halogen element is supplied, the pressure is kept constant at a predetermined level, and then the compound gas is excited with high frequency energy or DC power. This is a method in which etching is performed by generating low-temperature plasma and bringing the substrate into contact with active radical particles or ions in the low-temperature plasma.

3−・ プラズマCVD法は、真空容器内に基材を保持し、形成
すべき薄膜の組成元素を含む化合物ガスを供給した後、
高周波エネルギ等によって、前記化合物ガスを励起し、
すなわち、低温プラズマ化し、基材を低温プラズマの雰
囲気に配置することによって、基材表面に薄膜を堆積す
る方法である。
3-. In the plasma CVD method, after holding a base material in a vacuum container and supplying a compound gas containing the constituent elements of the thin film to be formed,
Exciting the compound gas by high frequency energy or the like,
That is, this is a method of depositing a thin film on the surface of a substrate by turning it into a low-temperature plasma and placing the substrate in an atmosphere of low-temperature plasma.

ところで、それらのドライエツチング装置、プラズマC
VD装置は、真空ポンプ等の排気手段をクリーンルーム
外に設置するととによって、クリーンルームの占有面積
を小さくすると共に、クリーンルーム内のダストの低減
化を図る取組みが行なわれるようになってきた。クリー
ンルーム内の装置本体とクリーンルーム外に配置された
ガス排気装置間を気密に接続するチューブは、配管工事
費の節約、メンテナンス容易性等の点からフレキシブル
チューブを用いることが多い。
By the way, those dry etching devices, plasma C
Efforts have been made to reduce the area occupied by the clean room and to reduce dust in the clean room by installing an evacuation means such as a vacuum pump outside the clean room in the VD device. Flexible tubes are often used to airtightly connect the device body in the clean room and the gas exhaust device located outside the clean room, from the viewpoint of saving piping construction costs and ease of maintenance.

以下図面を参照しながら、上述した従来の低温プラズマ
反応装置等に用いる真空装置の一例について説明する。
An example of a vacuum apparatus used in the conventional low-temperature plasma reactor described above will be described below with reference to the drawings.

第2図は、従来の低温プラズマ反応装置のうちの、ドラ
イエツチング装置に用いる真空装置の概略断面図を示す
ものである。
FIG. 2 shows a schematic cross-sectional view of a vacuum device used in a dry etching device, which is a conventional low-temperature plasma reactor.

第2図において、1は真空状態の維持が可能な真空容器
、2は真空容器1内にガスプラズマを発生することが可
能であり、高周波電力が供給される電極、3は電極2上
に保持され、ドライエツチングされる被加工物である基
材、4はアース接地された電極、5は真空容器1内にガ
スを導入するだめのガス供給用のノズル、6は真空容器
1内を減圧排気するための真空ポンプ、7は配管内のコ
ンダクタンスを可変にし、真空容器1内の圧力を制御す
るための圧力制御装置、8は排ガス処理装置、9は真空
容器1と真空ポンプ6および真空ポンプ6と排ガス処理
手段8とを気密に接続し、かつ、容易に方向を変えるこ
とを可能にするため、薄肉構造であるフレキシブルチュ
ーブである。
In Figure 2, 1 is a vacuum container that can maintain a vacuum state, 2 is an electrode that can generate gas plasma in the vacuum container 1 and is supplied with high-frequency power, and 3 is held on electrode 2. 4 is a grounded electrode, 5 is a gas supply nozzle for introducing gas into the vacuum container 1, and 6 is a vacuum pump for evacuating the inside of the vacuum container 1. 7 is a pressure control device for making the conductance in the piping variable and controlling the pressure in the vacuum container 1; 8 is an exhaust gas treatment device; 9 is a vacuum container 1, a vacuum pump 6, and a vacuum pump 6; It is a flexible tube with a thin wall structure in order to connect the exhaust gas treatment means 8 and the exhaust gas treatment means 8 airtightly and to easily change the direction.

以上のように構成されたドライエツチング装置について
以下、基材3上のアルミニウム膜をドライエツチングす
るための動作について説明する。
The operation of the dry etching apparatus configured as described above for dry etching the aluminum film on the base material 3 will be described below.

まず、真空容器1内を真空ポンプ6により5ベージ 1mTorr以下に真空排気した後、真空容器1内に、
ノズル6を通して、塩素基を含むガス、すなわち塩素と
塩化はう素の混合ガスを導入し、真空容器1内の圧力を
圧力制御装置7により10 mTo r r程度の一定
圧力に保持する。次に、電極2に周波数13.56MH
2の高周波電力を供給することによって、基材3を含む
空間、すなわち電極2とアース電極4との空間に低温プ
ラズマを発生させ、塩素と塩化はう素の混合ガスを電気
的に励起し活性状態にする。基材3は、レジストマスク
によシ、アルミニウムがパターン状に露呈しており、ア
ルミニウムが前記活性状態のガスと接触する。その結果
、パターン通りにアルミニウムはエツチングされ、アル
ミニウム配線回路を形成することが可能である。ここで
、エツチングに際し、有効に使用され々かった励起状態
のガスや励起され力かった混合ガス、およびドライエツ
チングの結果生成される反応生成ガスは、フレキシブル
チューブ9を通して真空ポンプ6並びに排ガス処理手段
8の経路を通り、大気に放出される。
First, the inside of the vacuum container 1 is evacuated to 5 pages and 1 mTorr or less by the vacuum pump 6, and then, inside the vacuum container 1,
A gas containing chlorine groups, that is, a mixed gas of chlorine and boron chloride, is introduced through the nozzle 6, and the pressure inside the vacuum container 1 is maintained at a constant pressure of about 10 mTorr by the pressure control device 7. Next, the frequency of 13.56MH was applied to electrode 2.
By supplying high-frequency power 2, low-temperature plasma is generated in the space containing the base material 3, that is, the space between the electrode 2 and the earth electrode 4, and the mixed gas of chlorine and boron chloride is electrically excited and activated. state. The base material 3 has aluminum exposed in a pattern through a resist mask, and the aluminum comes into contact with the activated gas. As a result, the aluminum is etched according to the pattern, making it possible to form an aluminum wiring circuit. Here, during etching, the excited gas that has been used effectively, the excited mixed gas, and the reaction product gas generated as a result of dry etching are passed through the flexible tube 9 to the vacuum pump 6 and the exhaust gas treatment means. It passes through route 8 and is released into the atmosphere.

6ページ ところで、フレキシブルチューブ9は、フレキシブル性
を持たせるために、その肉厚を1鴎以下に薄くして製作
するのが一般的である。また、前記活性ガスに対応すべ
くその材質を5US316等の耐食性のステンレスを使
用することが多い。
Page 6 Incidentally, the flexible tube 9 is generally manufactured with a wall thickness of 1 mm or less in order to provide flexibility. Further, in order to cope with the active gas, corrosion-resistant stainless steel such as 5US316 is often used as the material.

発明が解決しようとする問題点 しかし表から上記のような構成では、フレキシブルチュ
ーブ9の材質として耐食性を有するものを用いても、塩
素系の励起状態のガスは活性度が高く、化学反応が生じ
やすい。特如、曲シ部等応力集中している部分は反応し
やすく、さらに、肉厚が薄い場合には、腐食が進むと、
ガス輸送経路外に人体に有害々塩素系ガスがもれる危険
性が大きくなるという問題点を有していた。
Problems to be Solved by the Invention However, as shown in the table above, in the configuration shown above, even if a corrosion-resistant material is used for the flexible tube 9, the chlorine-based excited gas is highly active and a chemical reaction occurs. Cheap. Particularly, areas where stress is concentrated, such as curved parts, are more likely to react, and if the wall thickness is thin, as corrosion progresses,
This has the problem of increasing the risk of chlorine-based gas leaking outside the gas transport route, which is harmful to the human body.

本発明は、上記問題点に鑑み、ガス輸送経路外に、輸送
ガスがもれることがなく、装置の安全性を大巾に向上さ
せることが可能な真空装置を提供      ゛するも
のである。
In view of the above-mentioned problems, the present invention provides a vacuum device that prevents transport gas from leaking outside the gas transport path and greatly improves the safety of the device.

問題点を解決するための手段 上記問題点を解決するために本発明の真空装置7 ヘー
・ は、真空容器と真空ポンプおよび真空ポンプと排ガス処
理手段を気密に接続するだめのガス輸送用の接続部材の
少くとも一部分がフレキシブルチューブからなり、前記
接続部材の少くとも7レキシプルチユーブからなる部分
の外周部には、気密かつ柔軟性を有するカバーを配置し
、さらに前記接続部材と前記カバーとの間の密封空間の
状態変化を検知する手段を設けたものである。
Means for Solving the Problems In order to solve the above-mentioned problems, the vacuum device 7 of the present invention has a gas transport connection for airtightly connecting the vacuum container and the vacuum pump, and the vacuum pump and the exhaust gas treatment means. At least a part of the member is made of a flexible tube, and an airtight and flexible cover is disposed on the outer periphery of the part of the connecting member that is made up of at least seven flexiple tubes, and a cover that is airtight and flexible is arranged between the connecting member and the cover. The system is equipped with means for detecting changes in the state of the sealed space between the two.

作  用 本発明は、上記した構成によって、接続部材の管路壁が
腐食され穴が生じた場合においても、接続部材の外周部
の気密性を有したカバーを配置しているため、ガス輸送
経路以外へ輸送ガスがもれる危険性が大巾に低減できる
。また、接続部材とカバーとの間の空間の状態変化、例
えば、圧力変化を検知することによって、接続部材の管
路壁が腐食され穴があ−たかどうかを検出することがで
き、その検出信号によって低温プラズマ反応装置の安全
動作を自動で行うことが可能となるため、装置の安全性
を大巾に向上することが可能となる。
Effect of the Invention According to the above-described structure, even if the pipe wall of the connecting member is corroded and a hole is formed, an airtight cover is provided on the outer periphery of the connecting member, so that the gas transport path can be maintained. The risk of transport gas leaking to other areas can be greatly reduced. Furthermore, by detecting changes in the state of the space between the connecting member and the cover, such as changes in pressure, it is possible to detect whether or not the conduit wall of the connecting member has corroded and a hole has formed, and the detection signal This makes it possible to automatically perform safe operation of the low-temperature plasma reactor, thereby making it possible to greatly improve the safety of the device.

実施例 以下本発明の一実施例の真空装置について、図面を参照
しながら説明する。
EXAMPLE Hereinafter, a vacuum apparatus according to an example of the present invention will be described with reference to the drawings.

第1図は本発明の第1の実施例における真空装置の概略
正面断面図を示すものである。
FIG. 1 shows a schematic front sectional view of a vacuum apparatus in a first embodiment of the present invention.

第1図において、11は真空状態の維持が可能な真空容
器、12は真空容器11内に低温プラズマを発生するこ
とが可能であり、周波数13.56MHzの高周波電力
が供給される電極、13は電極12に保持され、ドライ
エツチングされる被加工物であるところの基材、14は
アース接地されたアース電極、16は真空容器11内に
ガスを導入するだめのガス供給用のノズル、16は真空
容器11内を真空排気するための真空ポンプ、17は配
管内のコンダクタンスを可変にし、真空容器11内の圧
力を制御するための圧力制御装置、18は真空ポンプ1
6により排気される排気ガスを人体に無害にし、たとえ
ば、吸着法の採用によって排気ガスを処理した後に大気
へ放出するだめの排ガス処理手段、19はガス輸送用の
フレキシブルチューブーノ ープの外周部に気密なカバーを有したパイプ、19aは
少なくとも一部が7レキシプルチユーブからなる接続部
材、19bはカバー、20は接続部材19aとカバー1
9bとの間の空間の状態変化すなわち圧力変化を検知す
る手段としての圧力センサーである。
In FIG. 1, 11 is a vacuum container that can maintain a vacuum state, 12 is an electrode that can generate low-temperature plasma in the vacuum container 11 and is supplied with high-frequency power at a frequency of 13.56 MHz, and 13 is an electrode that can generate low-temperature plasma in the vacuum container 11. A base material which is held by an electrode 12 and is a workpiece to be dry etched; 14 is a grounded electrode; 16 is a gas supply nozzle for introducing gas into the vacuum container 11; A vacuum pump for evacuating the inside of the vacuum container 11, 17 a pressure control device for varying the conductance in the piping and controlling the pressure inside the vacuum container 11, and 18 a vacuum pump 1.
6 is an exhaust gas treatment means for making the exhaust gas harmless to the human body and releasing it into the atmosphere after treating the exhaust gas by employing an adsorption method, for example; 19 is the outer periphery of a flexible tube nope for gas transportation; 19a is a connecting member at least partially composed of 7 lexiple tubes; 19b is a cover; 20 is a connecting member 19a and cover 1;
This is a pressure sensor that serves as a means for detecting a change in the state of the space, that is, a change in pressure, between the holder and the holder 9b.

以上のように構成された真空装置について、以下その動
作について説明する。
The operation of the vacuum apparatus configured as described above will be explained below.

まず、真空容器11内を真空ポンプ16により1mTo
rr  以下に真空排気した後、真空容器11内にノズ
ル15を通して、塩素基を含むガス、すなわち塩素と塩
化はう素の混合ガスを導入し、かつ圧力制御装置17に
よって真空容器11内の圧力を10mTorr  に一
定に保持する。次に、電極12に13.56MHzの高
周波電力を供給することによって、基材13を含む空間
、すなわち電極12とアース電極14との空間に低温プ
ラズマを発生させ、塩素と塩化はう素の混合ガスを電気
的に励起し、す々わち低温プラズマ状態にし、それらを
活性にする。この動作により、基材13上のアル10ペ
ージ ミニラム膜は、この励起された活性ガスによってエツチ
ングされる。ここで、エツチングに際し、有効に使用さ
れなかった励起状態のガスおよび励起されなかった塩素
と塩化はう素の混合ガスおよび、ドライエツチングの結
果生成された反応生成ガスは、接続部品19aの内部を
通って輸送され、真空ポンプ16を通り、さらに排ガス
処理手段18で処理された後、大気に放出される。
First, the inside of the vacuum container 11 is heated to 1 mTo by the vacuum pump 16.
After evacuation to below rr, a gas containing a chlorine group, that is, a mixed gas of chlorine and boron chloride, is introduced into the vacuum container 11 through the nozzle 15, and the pressure inside the vacuum container 11 is controlled by the pressure controller 17. The pressure is kept constant at 10 mTorr. Next, by supplying high-frequency power of 13.56 MHz to the electrode 12, low-temperature plasma is generated in the space containing the base material 13, that is, the space between the electrode 12 and the earth electrode 14, and the mixture of chlorine and boron chloride is generated. The gases are excited electrically, turning them into a low-temperature plasma state and making them active. By this operation, the aluminum 10-page minilam film on the substrate 13 is etched by the excited active gas. Here, during the etching, the excited state gas that was not used effectively, the unexcited mixed gas of chlorine and boron chloride, and the reaction product gas that was generated as a result of dry etching, the inside of the connecting part 19a. After passing through the vacuum pump 16 and being further treated by the exhaust gas treatment means 18, it is discharged into the atmosphere.

ここで、接続部材19aの外周部には気密なカバー19
bが配置されているため、接続部材19aが輸送ガスに
よって腐食され、穴があいたとしても、輸送ガスが大気
にもれることはない。また、本実施例では、接続部材1
9aとカバー19bとの間の空間には、窒素ガスを1.
6気圧に封入し、その圧力変化を圧力センサー20で検
出し、装置本体の制御系にフィードバックするようにし
た。
Here, an airtight cover 19 is provided on the outer periphery of the connecting member 19a.
b is arranged, even if the connecting member 19a is corroded by the transport gas and a hole is formed, the transport gas will not leak into the atmosphere. Furthermore, in this embodiment, the connecting member 1
The space between the cover 9a and the cover 19b is filled with nitrogen gas.
It was sealed at 6 atmospheres, and the pressure change was detected by a pressure sensor 20 and fed back to the control system of the main body of the device.

従がって、接続部材19aが輸送ガスによって腐食され
、接続部材19aに穴があいた場合には、すみやかに接
続部材19aとカバー19bとの間の空間の圧力状態が
変化する。この圧力変化を圧11ベー/゛ 力センサ−2oで検知し、装置制御系の安全回路を動作
させることが可能となり、装置の安全性を向上できる。
Therefore, if the connecting member 19a is corroded by the transport gas and a hole is formed in the connecting member 19a, the pressure state of the space between the connecting member 19a and the cover 19b changes immediately. This pressure change can be detected by the pressure 11b/force sensor 2o, and the safety circuit of the device control system can be operated, thereby improving the safety of the device.

さらに、接続部材19aの穴が真空容器11と真空ポン
プ16との間か、真空ポンプ16と排ガス処理手段18
との間かを圧力センサーの表示により、容易に発見でき
装置のメンテナンス性を向上することが可能である。
Furthermore, whether the hole in the connecting member 19a is between the vacuum container 11 and the vacuum pump 16 or between the vacuum pump 16 and the exhaust gas treatment means 18
By displaying the pressure sensor, it is possible to easily discover whether there is a gap between the

ところで、カバー19bに例えば機械的な衝撃が加わシ
穴があいた場合においても、接続部材19aとカバー1
9bとの間の圧力は、大気圧以上となっているため、(
本実施例では、窒素ガス雰囲気1. ei 蛇/cni
)圧力センサー2oの指示値の変化を検出することによ
って検知することができる。
Incidentally, even if a hole is formed in the cover 19b due to mechanical impact, for example, the connecting member 19a and the cover 1
Since the pressure between 9b and 9b is above atmospheric pressure, (
In this example, nitrogen gas atmosphere 1. ei snake/cni
) It can be detected by detecting a change in the indicated value of the pressure sensor 2o.

以上のように、本実施例によれば、真空容器11と、低
温プラズマを発生することが可能な電極12と、真空ポ
ンプ16と、排ガス処理手段18と、ガス輸送用の少な
くとも一部分がフレキシブルチューブからなる接続部材
19aの外周部に、少なくとも1つ気密かつフレキシブ
ル性を有するカバー19bを有し、また接続部材19 
aとカバー19bとの間の空間の圧力変化を検出する圧
力センサー20とを設けることによって、接続部材19
aのフレキシブルチューブ部分が輸送ガスによって腐食
された場合においても輸送ガスがもれることがないため
、装置の安全性さらにメンテナンス性を大巾に向上する
ことができる。
As described above, according to this embodiment, the vacuum container 11, the electrode 12 capable of generating low-temperature plasma, the vacuum pump 16, the exhaust gas treatment means 18, and at least a portion of the gas transporting portion are made of a flexible tube. The connecting member 19a has at least one airtight and flexible cover 19b on the outer periphery of the connecting member 19a.
By providing a pressure sensor 20 that detects a change in pressure in the space between the connecting member 19a and the cover 19b,
Even if the flexible tube part a is corroded by the transport gas, the transport gas will not leak, so the safety and maintainability of the device can be greatly improved.

なお、本実施例では、真空容器11と真空ポンプ16と
の間の接続部材19aおよび真空ポンプ16と排ガス処
理手段18との間の接続部材19aが両方共にフレキシ
ブル性を必要とする場合について記述したが、例えばガ
ス輸送経路上にガス吸着用のトラップなどを設け、排ガ
ス処理手段18が不用の場合並びに、真空ポンプ16と
排ガス処理手段18との接続がフレキシブル性を必要と
せず、固定するものである場合は、真空容器11と真空
ポンプ16の区間に本発明を適用すれば良い。
In this embodiment, a case is described in which the connecting member 19a between the vacuum container 11 and the vacuum pump 16 and the connecting member 19a between the vacuum pump 16 and the exhaust gas treatment means 18 both require flexibility. However, for example, if a gas adsorption trap or the like is provided on the gas transport route and the exhaust gas treatment means 18 is not required, or the connection between the vacuum pump 16 and the exhaust gas treatment means 18 does not require flexibility and may be fixed. In some cases, the present invention may be applied to the section between the vacuum container 11 and the vacuum pump 16.

また、同様に真空容器11と真空ポンプ16との接続に
おいてフレキシブル性が必要としない場合は、真空ポン
プ16と排ガス処理手段18の区間13′−ジ に本発明を適用すれば良い。
Similarly, if flexibility is not required in the connection between the vacuum container 11 and the vacuum pump 16, the present invention may be applied to the section 13' between the vacuum pump 16 and the exhaust gas treatment means 18.

なお、本実施例では、圧力センサー2oを用いて、接続
部材19aとカバー19bとの間の圧力状態の変化を検
出することによって、接続部材19aのフレキシブルチ
ューブ部分に穴があいたかどうかを検知したが、ガス分
析器やガスもれ検知器などのセンサーを適用し、接続部
材19aとカバー19bとの間のガス組成を検知しても
良く、要は、接続部材19aとカバー19bとの間の空
間の状態変化が検知されれば良い。
In this example, the pressure sensor 2o is used to detect a change in the pressure state between the connection member 19a and the cover 19b, thereby detecting whether or not there is a hole in the flexible tube portion of the connection member 19a. However, a sensor such as a gas analyzer or a gas leak detector may be applied to detect the gas composition between the connecting member 19a and the cover 19b. It suffices if a change in the state of the space is detected.

また、本実施例では、真空容器11と真空ポンプ16と
の間にある圧力センサー2oと、真空ポンプ16と排ガ
ス処理手段18との間にある圧力センサー20とを同じ
ものとしたが、異種の性能をもつものとしても良い。
Furthermore, in this embodiment, the pressure sensor 2o located between the vacuum container 11 and the vacuum pump 16 and the pressure sensor 20 located between the vacuum pump 16 and the exhaust gas treatment means 18 are the same; It may also be something with performance.

なお、本実施例では、基材13上のアルミニウム膜をエ
ツチングするためのドライエツチング装置としたが、基
材13を加熱手段によって100℃から500℃の適切
な温度に保持し、かつ、堆積すべき膜の組成元素を含む
化合物ガス例えば、モ14ページ ノシラン(SiH)とアンモニア(NH3)との混合ガ
スを供給して、基材13上に窒化シリコン膜を堆積する
ためのプラズマCVD装置としても良い。     □
発明の効果 以上のように本発明は、真空容器と真空ポンプおよび真
空ポンプと排ガス処理手段とを気密に接続するガス輸送
用の接続部材の外周部のうち少くともフレキシブルチュ
ーブからなる部分に、気密性とフレキシブル柔軟性を有
するカバーを設け、さらに、接続部材とカバーとの間の
状態変化を検知する手段を設けることにより、ガス輸送
経路外に輸送ガスがもれることなく、装置の安全性およ
びメンテナンス容易性を大d]に向上することかできる
In this example, a dry etching apparatus was used for etching the aluminum film on the base material 13, but the base material 13 was maintained at an appropriate temperature of 100° C. to 500° C. by heating means, and the deposition was performed using a dry etching device. It can also be used as a plasma CVD apparatus for depositing a silicon nitride film on the base material 13 by supplying a compound gas containing the compositional elements of the desired film, for example, a mixed gas of monosilane (SiH) and ammonia (NH3). good. □
Effects of the Invention As described above, the present invention has an airtight structure in which at least a portion of the outer periphery of a connecting member for gas transportation, which airtightly connects a vacuum container and a vacuum pump, and a vacuum pump and an exhaust gas treatment means, is made of a flexible tube. By providing a cover with flexibility and flexibility, and further providing a means for detecting changes in the state between the connecting member and the cover, the safety of the equipment is improved by preventing the transport gas from leaking outside the gas transport path. The ease of maintenance can be greatly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の第1の実施例における真空装置の概略
正面断面図、第2図は従来の真空装置の      ′
□概略正面断面図である。 11・・・・・・真空容器、12・・・・・・電極、1
3・・・・・・基材、16・・・・・・真空ポンプ、1
8・・・・・・排ガス処理手15′(−・ 段、19・・・・・・パイプ、19a・・・・・・接続
部材、19b・・・・・・カバー、20・・・・・・圧
力センサー。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名+2
−’t& f3−一一基柾
Fig. 1 is a schematic front sectional view of a vacuum device according to a first embodiment of the present invention, and Fig. 2 is a schematic front sectional view of a conventional vacuum device.
□Schematic front sectional view. 11... Vacuum container, 12... Electrode, 1
3...Base material, 16...Vacuum pump, 1
8...Exhaust gas treatment means 15' (--stage, 19...pipe, 19a...connecting member, 19b...cover, 20... ...Pressure sensor. Name of agent: Patent attorney Toshio Nakao and 1 other person + 2
-'t&f3-11 base

Claims (1)

【特許請求の範囲】[Claims] 真空状態の維持が可能な真空容器と、前記真空容器を真
空排気する真空ポンプと、高周波電力または直流電力が
供給され、前記真空容器内に低温プラズマを発生する電
極と、前記真空ポンプより排出されるガスを処理する排
ガス処理手段と、前記真空容器と前記真空ポンプおよび
前記真空ポンプと前記排ガス処理手段を気密に接続する
ガス輸送用の接続部材とからなる真空装置において、前
記接続部材の少くとも一部分がフレキシブルチューブか
らなり、前記接続部材の少くともフレキシブルチューブ
からなる部分の外周部には、気密性と柔軟性を有するカ
バーを設け、さらに前記接続部品と前記カバーとの間の
密封空間の状態変化を検知する手段を備えたことを特徴
とする真空装置。
A vacuum container capable of maintaining a vacuum state, a vacuum pump that evacuates the vacuum container, an electrode to which high-frequency power or DC power is supplied and generates low-temperature plasma in the vacuum container, and a plasma discharged from the vacuum pump. A vacuum device comprising: an exhaust gas treatment means for treating gas; and a connection member for gas transport that airtightly connects the vacuum container, the vacuum pump, and the vacuum pump and the exhaust gas treatment means; A portion of the connection member is made of a flexible tube, and a cover having airtightness and flexibility is provided on the outer periphery of at least the portion of the connection member that is made of the flexible tube, and the condition of a sealed space between the connection component and the cover is further provided. A vacuum device characterized by comprising means for detecting a change.
JP15268785A 1985-07-11 1985-07-11 Vacuum device Pending JPS6213030A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15268785A JPS6213030A (en) 1985-07-11 1985-07-11 Vacuum device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15268785A JPS6213030A (en) 1985-07-11 1985-07-11 Vacuum device

Publications (1)

Publication Number Publication Date
JPS6213030A true JPS6213030A (en) 1987-01-21

Family

ID=15545930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15268785A Pending JPS6213030A (en) 1985-07-11 1985-07-11 Vacuum device

Country Status (1)

Country Link
JP (1) JPS6213030A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06112164A (en) * 1992-09-29 1994-04-22 Tokyo Ohka Kogyo Co Ltd Plasma processor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5291745A (en) * 1976-01-29 1977-08-02 Tokyo Shibaura Electric Co Device for gas plasma etching

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5291745A (en) * 1976-01-29 1977-08-02 Tokyo Shibaura Electric Co Device for gas plasma etching

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06112164A (en) * 1992-09-29 1994-04-22 Tokyo Ohka Kogyo Co Ltd Plasma processor

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