JPS62127206A - 切断方式 - Google Patents

切断方式

Info

Publication number
JPS62127206A
JPS62127206A JP26815885A JP26815885A JPS62127206A JP S62127206 A JPS62127206 A JP S62127206A JP 26815885 A JP26815885 A JP 26815885A JP 26815885 A JP26815885 A JP 26815885A JP S62127206 A JPS62127206 A JP S62127206A
Authority
JP
Japan
Prior art keywords
cut
cutting
blade
contact
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26815885A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6357203B2 (enrdf_load_stackoverflow
Inventor
小山　喜昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Diamond Industrial Co Ltd
Original Assignee
Asahi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Diamond Industrial Co Ltd filed Critical Asahi Diamond Industrial Co Ltd
Priority to JP26815885A priority Critical patent/JPS62127206A/ja
Publication of JPS62127206A publication Critical patent/JPS62127206A/ja
Publication of JPS6357203B2 publication Critical patent/JPS6357203B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP26815885A 1985-11-28 1985-11-28 切断方式 Granted JPS62127206A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26815885A JPS62127206A (ja) 1985-11-28 1985-11-28 切断方式

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26815885A JPS62127206A (ja) 1985-11-28 1985-11-28 切断方式

Publications (2)

Publication Number Publication Date
JPS62127206A true JPS62127206A (ja) 1987-06-09
JPS6357203B2 JPS6357203B2 (enrdf_load_stackoverflow) 1988-11-10

Family

ID=17454707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26815885A Granted JPS62127206A (ja) 1985-11-28 1985-11-28 切断方式

Country Status (1)

Country Link
JP (1) JPS62127206A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0579227A1 (en) * 1992-07-16 1994-01-19 Tokyo Seimitsu Co.,Ltd. Method and apparatus for slicing semiconductor wafer
KR100337060B1 (ko) * 1999-07-24 2002-05-16 이덕수 헤어 클립

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0579227A1 (en) * 1992-07-16 1994-01-19 Tokyo Seimitsu Co.,Ltd. Method and apparatus for slicing semiconductor wafer
US5524604A (en) * 1992-07-16 1996-06-11 Tokyo Seimitsu Co., Ltd. Method and apparatus for slicing semiconductor wafers
KR100337060B1 (ko) * 1999-07-24 2002-05-16 이덕수 헤어 클립

Also Published As

Publication number Publication date
JPS6357203B2 (enrdf_load_stackoverflow) 1988-11-10

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees