JPS62126836U - - Google Patents
Info
- Publication number
- JPS62126836U JPS62126836U JP1986011799U JP1179986U JPS62126836U JP S62126836 U JPS62126836 U JP S62126836U JP 1986011799 U JP1986011799 U JP 1986011799U JP 1179986 U JP1179986 U JP 1179986U JP S62126836 U JPS62126836 U JP S62126836U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- terminal portion
- wiring board
- connecting terminal
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/074—
-
- H10W72/325—
-
- H10W72/352—
-
- H10W72/354—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986011799U JPS62126836U (cg-RX-API-DMAC10.html) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986011799U JPS62126836U (cg-RX-API-DMAC10.html) | 1986-01-31 | 1986-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62126836U true JPS62126836U (cg-RX-API-DMAC10.html) | 1987-08-12 |
Family
ID=30799342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986011799U Pending JPS62126836U (cg-RX-API-DMAC10.html) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62126836U (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01132120U (cg-RX-API-DMAC10.html) * | 1988-03-01 | 1989-09-07 | ||
| JP2001094227A (ja) * | 1999-09-20 | 2001-04-06 | Shinko Electric Ind Co Ltd | 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法 |
| JP2023023434A (ja) * | 2021-08-05 | 2023-02-16 | 富士電機株式会社 | 半導体装置及びその製造方法 |
-
1986
- 1986-01-31 JP JP1986011799U patent/JPS62126836U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01132120U (cg-RX-API-DMAC10.html) * | 1988-03-01 | 1989-09-07 | ||
| JP2001094227A (ja) * | 1999-09-20 | 2001-04-06 | Shinko Electric Ind Co Ltd | 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法 |
| JP2023023434A (ja) * | 2021-08-05 | 2023-02-16 | 富士電機株式会社 | 半導体装置及びその製造方法 |