JPS62126690A - Coating of electric circuit board - Google Patents
Coating of electric circuit boardInfo
- Publication number
- JPS62126690A JPS62126690A JP26625985A JP26625985A JPS62126690A JP S62126690 A JPS62126690 A JP S62126690A JP 26625985 A JP26625985 A JP 26625985A JP 26625985 A JP26625985 A JP 26625985A JP S62126690 A JPS62126690 A JP S62126690A
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- coating
- circuit board
- coating agent
- paraffin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
１対象技術分野」
この発明はとくにハイブリッドＩＣ等の電気回路基板の
コーティング方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION 1. Field of the Invention The present invention particularly relates to a method of coating electric circuit boards such as hybrid ICs.
「従来技術」
電気回路基板とくにハイブリッドＩＣは種々の機器に使
用されているが、それが使用される製品あるいは使用さ
れる環境からいろいイ）な実装方法が考えられ、とくに
そのコーティングには問題がある。``Prior art'' Electric circuit boards, especially hybrid ICs, are used in various devices, but there are various mounting methods depending on the product or environment in which they are used, and there are particular problems with the coating. There is.
すなわちコーティング処理を施さないものにあっては言
うまでもなく、湿度に弱く、回路上のリークおよび腐食
が発生し易い。またシリコーンラバー系のコーティング
剤を用いるものにあっては塗布後硬化するまでにかなり
の時間を要するため、生産ラインにおいて休止時間を設
ける必要があり、リードタイムを延す欠点があり、しか
も耐湿性が低く、１年程度でパターンが腐食することが
ある。That is, it goes without saying that those without coating are sensitive to humidity and are prone to leakage and corrosion on the circuit. Furthermore, products that use silicone rubber-based coatings require a considerable amount of time to harden after application, which requires downtime on the production line, which lengthens the lead time. is low, and the pattern may corrode in about a year.
またエポキシ樹脂系のコーティング剤を用いるものにあ
ってはシリコーンラバー系のものと同様、乾燥に多（の
時間を要するばかりでなく、ハイブリッドＩＣのベース
であるセラミックとコーティング剤の熱膨張率の差によ
り、印刷抵抗の剥離やワイヤーボンディングの断線等の
故障を引き起すおそれがある。In addition, similar to silicone rubber-based coatings, epoxy resin-based coatings not only take a long time to dry, but also have a difference in thermal expansion coefficient between the ceramic that is the base of the hybrid IC and the coating. This may cause failures such as peeling of printed resistors and disconnection of wire bonding.
一方金属キャップシーリングを用いるものは耐環境性に
優れている反面、高価であり専用の設備が必要となる。On the other hand, those using metal cap sealing have excellent environmental resistance, but are expensive and require specialized equipment.
「目的」
この発明はこのような従来の欠点にかんがみ、安価で、
かつ耐湿性がよく、さらに乾燥時間の短いコーティング
を提供しようとするものである。``Purpose'' This invention takes into account the drawbacks of the conventional technology and is inexpensive.
The objective is to provide a coating that has good moisture resistance and a short drying time.
「実施例」 以下この発明の一実施例について説明する。"Example" An embodiment of this invention will be described below.
すなわち第１図に示すように電子回路を形成する電気回
路基板１はたとえばハイブリッドＩＣ基板やプリント回
路基板により構成される。一方容器２中にパラフィン系
のコーティング剤たとえばＣ２ｎＨｇｎ十ｇの組成をも
つパラフィンを入れ、これをヒーター３により加熱溶融
し、これを電気回路基板１に刷毛４等により塗布する。That is, as shown in FIG. 1, an electric circuit board 1 forming an electronic circuit is constituted by, for example, a hybrid IC board or a printed circuit board. On the other hand, a paraffin-based coating agent, such as paraffin having a composition of 10 g of C2nHgn, is placed in the container 2, heated and melted by a heater 3, and applied to the electric circuit board 1 with a brush 4 or the like.
次にこれを常温で硬化させる。また第２図に示すように
コーティング剤５中に電気回路基板１を浸すことにより
コーティングすることもできる。Next, this is cured at room temperature. Alternatively, the electrical circuit board 1 can be coated by dipping it into a coating agent 5 as shown in FIG.
さらにコーティング剤５としてワックスたとえば低分子
量ポリエチレンワックスたとえば安原油脂工業株式会社
製のネオワックス（商標名）を混合することにより性能
を変えずに融点を１００度Ｃ以上にすることができる。Further, by mixing a wax such as a low molecular weight polyethylene wax such as Neowax (trade name) manufactured by Yasushi Oil Industries Co., Ltd. as the coating agent 5, the melting point can be increased to 100 degrees C or higher without changing the performance.
「効果」
この発明は上述のようにパラフィン系のコーティング剤
によりコーティングしているので、耐環境性とくに耐湿
性がきわめて良好であり、またコーテイング後、コーテ
ィング剤の融点は半田付けの温度に比し低いため、半田
付けが容易で、しかも半田付けの作業中に、溶融した半
田の表面にパラフィンの膜が存在するため酸化が進まず
良好な半田付けができる。``Effects'' As mentioned above, this invention is coated with a paraffin-based coating agent, so it has extremely good environmental resistance, especially moisture resistance, and after coating, the melting point of the coating agent is lower than the soldering temperature. Since the soldering temperature is low, soldering is easy, and since a paraffin film exists on the surface of the molten solder during soldering, oxidation does not proceed and good soldering can be achieved.
またハイブリッドＩＣにおいては印刷抵抗のトリミング
の必要が生じるが、コーティング剤の膜厚が薄ければそ
の上からザンドトリミングやレーザートリミングを行う
ことが可能であり、しかもトリミング後その部位を熱す
るだけでふたたびパラフィンの膜を形成させることがで
きる。Also, in hybrid ICs, it is necessary to trim the printed resistor, but if the coating material is thin, it is possible to perform sand trimming or laser trimming over it, and after trimming, you can simply heat the area. A paraffin film can be formed again.
塗りにより塗布する方法を示す斜視図、第２図は電気回
路基板をコーティング剤中に浸す方法な示す斜視図であ
る。FIG. 2 is a perspective view showing a method of coating by painting, and FIG. 2 is a perspective view showing a method of dipping an electric circuit board into a coating agent.
１・・・電気回路基板、２・・・容器、３・・・ヒータ
ー、４・・・刷毛、５・・・コーティング剤。−特 許
出 願 人 山武ハネウェル株式会社第１図
第２図DESCRIPTION OF SYMBOLS 1... Electric circuit board, 2... Container, 3... Heater, 4... Brush, 5... Coating agent. -Patent applicant Yamatake Honeywell Co., Ltd. Figure 1 Figure 2
Claims (2)
フィン系コーティング剤によりコーティングした電気回
路基板のコーティング方法。(1) A method of coating an electric circuit board, in which the surface of the electric circuit board on which an electric circuit is formed is coated with a paraffin-based coating agent.
フィンに低分子量ポリエチレンワックスを混合したコー
ティング剤によりコーティングした電気回路基板のコー
ティング方法。(2) A method of coating an electric circuit board, in which the surface of the electric circuit board on which an electric circuit is formed is coated with a coating agent containing a mixture of paraffin and low molecular weight polyethylene wax.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26625985A JPS62126690A (en) | 1985-11-28 | 1985-11-28 | Coating of electric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26625985A JPS62126690A (en) | 1985-11-28 | 1985-11-28 | Coating of electric circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62126690A true JPS62126690A (en) | 1987-06-08 |
Family
ID=17428492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26625985A Pending JPS62126690A (en) | 1985-11-28 | 1985-11-28 | Coating of electric circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62126690A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5489268A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of damppproofing printed board |
-
1985
- 1985-11-28 JP JP26625985A patent/JPS62126690A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5489268A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of damppproofing printed board |
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