JPS6017990A - Method of treating waterproof of electronic circuit - Google Patents
Method of treating waterproof of electronic circuitInfo
- Publication number
- JPS6017990A JPS6017990A JP12545683A JP12545683A JPS6017990A JP S6017990 A JPS6017990 A JP S6017990A JP 12545683 A JP12545683 A JP 12545683A JP 12545683 A JP12545683 A JP 12545683A JP S6017990 A JPS6017990 A JP S6017990A
- Authority
- JP
- Japan
- Prior art keywords
- paint
- lead terminal
- tip
- electronic circuit
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は洗濯機や炊飯器等の水を使用する電化 １−
製品の電子回路を構成した基板の防水絶縁処理に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to waterproof insulation treatment of substrates constituting electronic circuits of electrical appliances such as washing machines and rice cookers that use water.
（従来例の構成どその問題点）
洗濯機に電子コン１へ［１−ラを搭載する際には、第１
図に示すように、紙エポキシ等のプリント基板１に電子
部品を実装した後、揺変性（揺変指数３）を付与した粘
度２３００ｃｐｓの溶剤型アクリル系樹脂塗料に浸漬し
て、電子部品とその導体部にコーテング被膜２を形成さ
せ、電子回路の防水絶縁をはかっていた。しかし第１図
に示すような電子部品のリード端子３の切断部までコー
テング被膜２を形成させるために、揺変性を付．ケした
溶剤型アクリル系樹脂塗料にプリント基板全体を浸漬す
るが、粘度が２３００ｃｐｓと高く、余分に付着した塗
料の液切りに長時間を必要とすること、また塗膜の乾燥
を早くするために浸漬後、すぐ加熱乾燥すると溶剤によ
り発泡するので、１２時間以上室温放置後、６０℃で１
２時間乾燥するため自動化が固壁であり、大量生産は不
可能であった。また電子部品のリード端子３には薄いコ
ーテング被膜２を形成２−
するが硬度が４Ｂ程度の軟かいコーテング被膜であるた
めに、洗濯機に絹の込む際に剥雛する等の問題があった
。(Problems with the configuration of the conventional example) When installing the electronic controller 1 in the washing machine, it is necessary to
As shown in the figure, after electronic components are mounted on a printed circuit board 1 made of paper epoxy or the like, the electronic components and their A coating film 2 was formed on the conductor part to provide waterproof insulation for the electronic circuit. However, in order to form the coating film 2 up to the cut portion of the lead terminal 3 of an electronic component as shown in FIG. 1, thixotropy is applied. The entire printed circuit board is immersed in a solvent-based acrylic resin paint, but the viscosity is as high as 2,300 cps, and it takes a long time to remove excess paint, and in order to speed up the drying of the paint film. If you heat dry immediately after soaking, the solvent will foam, so leave it at room temperature for more than 12 hours, then dry it at 60℃ for 1 hour.
Due to the two hour drying time, automation was difficult and mass production was impossible. In addition, a thin coating film 2 is formed on the lead terminals 3 of electronic components, but since it is a soft coating film with a hardness of about 4B, there have been problems such as the silk peeling off when put in a washing machine. .
（発明の目的）
本発明の目的は従来例の欠点を除去し、液切り容易な低
、中粘度塗料を使用（紫外線硬化）することにより、プ
リント基板と電子部品の導体部を防水絶縁するもので、
短時間硬化が可能となり、自動化により大量生産がＲ１
れるものである。(Object of the Invention) The object of the present invention is to eliminate the drawbacks of the conventional example and to provide waterproof insulation between printed circuit boards and conductor parts of electronic components by using a low to medium viscosity paint (cured by ultraviolet rays) that is easy to drain. in,
Curing can be done in a short time, and mass production is now R1 due to automation.
It is something that can be done.
（発明の構成）
本発明の電子回路の防水処理は、基板面よりディスクリ
−１一部品のリード端子先端までの長さを１．５ｍｍ以
−にとなるようにして、最初に高い揺変性（稲麦指数３
．０以上）の紫外線硬化塗料にリード端子だけを浸漬し
て、短時間にリード端子に塗布された塗料を硬化させる
。このとき、リード端子先端切断面の先端部分を完全に
被膜形成させるため、リード端子の先端を重力方向にす
る１１次に、粘度が１ｏｏｃｐｓないし１．．０ＯＯｃ
ｐｓの反応型塗料（たとえばエポキシ系樹脂塗料やウレ
タン系樹脂塗料）３−
または紫外線硬化型塗料（たとえばエポキシ系塗料、ポ
リブタジェン系塗料）に基板を浸漬後硬化させるもので
あり、リ−１・端ｒ先端にキャップ状に厚く被１１ツ１
形成するものである。(Structure of the Invention) Waterproofing of an electronic circuit according to the present invention is performed by first making the length from the board surface to the tip of the lead terminal of the discreet component 1.5 mm or more, and first achieving high thixotropy. (Inagi index 3
．． By immersing only the lead terminals in an ultraviolet curing paint (0 or more), the paint applied to the lead terminals is cured in a short period of time. At this time, in order to completely form a coating on the tip of the cut surface of the lead terminal tip, the tip of the lead terminal is moved in the direction of gravity, and the viscosity is 10ocps to 1. ．． 0OOc
The substrate is immersed in PS reactive paint (e.g. epoxy resin paint or urethane resin paint) or ultraviolet curing paint (e.g. epoxy paint or polybutadiene paint) and then cured. r Thick cap-like covering on the tip 11 pieces 1
It is something that forms.
（実施例の説明）
本発明の一実施例を第２図ないし第３図に基づいて説明
ずろ。(Description of Embodiment) An embodiment of the present invention will be explained based on FIGS. 2 and 3.
第２図に示すように、ディスクリ−１〜部品のリード端
子３を」、（板面より１．５ｍｍ以にとして、次に稲麦
指数６ないし１０、粘度２０ 、 ｎｎｎｃｐｓないし
３０．０ＯＯｃｐｓのエポキシアクリ１）−１・系（紫
外線硬化型）塗料４にリード端７−３だけを浸漬して、
下方より水銀灯５を１！（（り、ｔ Ｌ、紫外線により
短時間に硬化させる。更に第３図に示すように粘度５０
０ｃｐｓないし］ 、 ０００ｃｐｓのポリブタジェン
基（紫外線硬化型）塗料６１１月、３基板１を浸漬して
紫外線により硬化させるものであり、Ｗ（ｉ濯機の４１
：うに、電子コンｉ・ローラ部に水が浸入したり、風呂
場等の高湿度中で使用すると結露して、リード端子３間
でリークすることにより、生ずる誤動作や故障を完全に
４−
防止するとともに、自動化により量産性を確保するもの
である。なお、７は抵抗、８はＬＥＤ、９は銅箔回路、
１０はハンダである。As shown in Fig. 2, the lead terminals 3 of the discs 1 to 3 are set at a distance of 1.5 mm or more from the board surface, and then a Dip only the lead end 7-3 into the epoxy acrylic 1)-1 type (ultraviolet curable) paint 4,
1 mercury lamp 5 from below! ((ri, t L, harden in a short time with ultraviolet rays. Furthermore, as shown in Figure 3, the viscosity is 50.
0 cps to 000 cps polybutadiene-based (ultraviolet curable) paint 61 months, 3 substrates 1 are immersed and cured by ultraviolet rays, W (i washing machine 41
: Completely prevents malfunctions and failures caused by water entering the electronic controller i/roller section or condensation when used in high humidity environments such as a bathroom, resulting in leakage between the lead terminals 3. At the same time, automation will ensure mass productivity. In addition, 7 is a resistor, 8 is an LED, 9 is a copper foil circuit,
10 is solder.
（発明の効果）
本発明によれば、揺変性の高い紫外線硬化塗料にディス
クリ−１・部品のリード端子だけをディップして、リー
ド端子の先端を重力方向に位置するので、リード端子に
は数百μｍ、先端には、重力と塗料の表面張力により、
更に厚く、また紫外線硬化で短時間に硬化させるので熱
による塗料の流れ落ちがなく、確実にリード端子先端周
辺の塗料被膜を形成することができ、次に通常の紫外線
硬化型塗料や反応型塗料に基板を浸漬することにより、
電子コントローラの防水処理ができるものであるから、
高品質、低原価で大量生産も容易な電子回路を得ること
ができるものである。(Effects of the Invention) According to the present invention, only the lead terminals of the Discly-1/component are dipped in a highly thixotropic ultraviolet curing paint, and the tips of the lead terminals are positioned in the direction of gravity, so that the lead terminals are Several hundred μm, at the tip, due to gravity and the surface tension of the paint,
It is also thicker and cures in a short time using UV curing, so there is no paint running off due to heat, and a paint film can be reliably formed around the tip of the lead terminal. By dipping the substrate,
Since the electronic controller can be waterproofed,
It is possible to obtain electronic circuits of high quality, low cost, and easy to mass produce.
第１図は従来例のプリン１〜基板を用いた電子回路の断
面図、第２図は本発明による一実施例のプリン１〜基板
を用いた電子回路の、断面図、第３図は−５〜
同紫外線硬化塗料に浸漬し硬化さ仕た断面図である。
１ ・・ プリン１へ基板、２ ・・溶剤型アクリル系
樹脂？ｍ １１、 ３ ・・ディスクリ−１〜部品のリ
ード端子、４ ・・・高幅変性紫外線硬化塗料、５ ・
・・水銀灯、 ６ ・・ 紫外線硬化塗料、７ ・・・
抵抗、８ ・・１、ＩＥＤ、９ ・・・銅箔回路、１０
・・・ハンダ。
特許出願人 松下電器産業株式会社
−〔ｊ−
第１図
８
第２図
第３図
４１１−FIG. 1 is a sectional view of an electronic circuit using a conventional printer 1 to a substrate, FIG. 2 is a sectional view of an electronic circuit using an embodiment of the printer 1 to a substrate according to the present invention, and FIG. 5~ It is a sectional view after being immersed and cured in the same ultraviolet curing paint. 1... substrate to pudding 1, 2... solvent-based acrylic resin? m 11, 3...Discreary 1~Lead terminal of parts, 4...High width modified ultraviolet curing paint, 5...
...Mercury lamp, 6 ... Ultraviolet curing paint, 7 ...
Resistance, 8...1, IED, 9...Copper foil circuit, 10
...Solder. Patent applicant Matsushita Electric Industrial Co., Ltd. - [j- Figure 1 8 Figure 2 Figure 3 411-
Claims (1)
ために、基板面よりディスクリート部品のリード端子先
端までの長さが１．５ｍｍ以上になるようにして、揺変
指数３．０以−にの紫外線硬化型塗料中に前記ディスク
リート部品のリード端子を浸漬後、そのリード端子先端
を重力方向に位置させた状態で、コーテング樹脂を紫外
線により硬化させ、更に粘度がｌ００ｃｐｓないし１
、０ＯＯｃｐｓの反応型エポキシ系樹脂塗料反応型つ１
ノタン系樹脂塗料または５００ｃｐｓないし１ 、００
０ｃｐｓのエポキシ系、ポリブタジェン系等の紫外線硬
化型塗料で基板の導体部をコーテングすることを４−１
−徴とする電子回路の防水処理方法。In order to completely waterproof and insulate the conductor part of the board that constitutes the electronic circuit, the length from the board surface to the tip of the lead terminal of the discrete component is 1.5 mm or more, and the thixotropy index is 3.0 or more. After immersing the lead terminal of the discrete component in the ultraviolet curable paint, the coating resin is cured with ultraviolet light with the tip of the lead terminal positioned in the direction of gravity, and the viscosity is further reduced to 100 cps to 1
, 0OOcps reactive epoxy resin paint reactive type 1
Notane resin paint or 500cps to 1.00
4-1 Coating the conductor part of the board with a UV-curable paint such as 0cps epoxy or polybutadiene.
- A waterproofing method for electronic circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12545683A JPS6017990A (en) | 1983-07-12 | 1983-07-12 | Method of treating waterproof of electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12545683A JPS6017990A (en) | 1983-07-12 | 1983-07-12 | Method of treating waterproof of electronic circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6017990A true JPS6017990A (en) | 1985-01-29 |
Family
ID=14910544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12545683A Pending JPS6017990A (en) | 1983-07-12 | 1983-07-12 | Method of treating waterproof of electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6017990A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0527995U (en) * | 1991-09-25 | 1993-04-09 | 松下電工株式会社 | Sealed housing structure for EL light emitting device |
| DE19818452B4 (en) * | 1997-04-28 | 2004-03-25 | Yazaki Corp. | Electronic circuit with a circuit board embedded in cast resin and process for its production |
| CN102368893A (en) * | 2011-10-31 | 2012-03-07 | 成都鑫三洋科技发展有限公司 | Anti-corrosion hydropower station monitoring device |
-
1983
- 1983-07-12 JP JP12545683A patent/JPS6017990A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0527995U (en) * | 1991-09-25 | 1993-04-09 | 松下電工株式会社 | Sealed housing structure for EL light emitting device |
| DE19818452B4 (en) * | 1997-04-28 | 2004-03-25 | Yazaki Corp. | Electronic circuit with a circuit board embedded in cast resin and process for its production |
| CN102368893A (en) * | 2011-10-31 | 2012-03-07 | 成都鑫三洋科技发展有限公司 | Anti-corrosion hydropower station monitoring device |
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