JPH0527995U - Sealed housing structure for EL light emitting device - Google Patents

Sealed housing structure for EL light emitting device

Info

Publication number
JPH0527995U
JPH0527995U JP7671091U JP7671091U JPH0527995U JP H0527995 U JPH0527995 U JP H0527995U JP 7671091 U JP7671091 U JP 7671091U JP 7671091 U JP7671091 U JP 7671091U JP H0527995 U JPH0527995 U JP H0527995U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
light emitting
case
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7671091U
Other languages
Japanese (ja)
Inventor
次郎 関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP7671091U priority Critical patent/JPH0527995U/en
Publication of JPH0527995U publication Critical patent/JPH0527995U/en
Pending legal-status Critical Current

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  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

(57)【要約】 【目的】EL発光素子の温度及び湿度の影響を受けにく
くする。 【構成】EL発光素子1がケース4とプリント基板2に
て形成された収納空間内に配置される。上記プリント基
板2の外面に少なくとも電子部品8が実装されている。
プリント基板2の外周とケース4との間などの少なくと
もEL表示素子1の収納部と外気とが連通する連通部
を、完全硬化する1次シール材6でシールする。そし
て、プリント基板2の外面全体を硬化しても柔らかい2
次シール材7で2次シールする。
(57) [Abstract] [Purpose] To make the EL light emitting element less susceptible to temperature and humidity. [Structure] An EL light emitting element 1 is arranged in a storage space formed by a case 4 and a printed circuit board 2. At least an electronic component 8 is mounted on the outer surface of the printed board 2.
At least a communication part, such as a space between the outer periphery of the printed circuit board 2 and the case 4, where the storage space of the EL display element 1 and the outside air communicate with each other is sealed with a completely-curing primary sealing material 6. Even if the entire outer surface of the printed circuit board 2 is hardened, it is soft.
Secondary sealing is performed with the next sealing material 7.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial application]

本考案は、EL発光素子の封止収納構造であって、特に高温,多湿となるよう な場所で使用される装置のEL発光素子の封止収納構造に関するものである。 The present invention relates to a sealed housing structure for an EL light emitting element, and more particularly to a sealed housing structure for an EL light emitting element of an apparatus used in a place exposed to high temperature and high humidity.

【0002】[0002]

【従来の技術】[Prior Art]

EL(エレクトロ・ルミネセンス)発光素子は蛍光体材料で形成され、高電界 を加えるたときに発光する固体発光素子である。このEL発光素子は、低電力、 低発熱特性を有し、且つ薄く自由な形に成形できるため、近年ではOA機器を始 めとして、FA,HA機器などの全般に広く用いられている。 An EL (electroluminescence) light emitting element is a solid-state light emitting element which is made of a phosphor material and emits light when a high electric field is applied. Since this EL light emitting element has low power consumption and low heat generation characteristics and can be formed into a thin and free shape, in recent years, it has been widely used for OA equipment, FA, HA equipment and the like.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

ところが、上記EL発光素子は耐温湿特性が非常に悪く、気温20℃,湿度9 0%の条件下で200時間程度の時間で周辺部から中心部に向かって黒化現象が 発生し、輝度の低下を招く。従って、特に戸外などの高温,多湿となる場所で用 いられる装置などに搭載した場合に問題となっていた。 However, the EL light emitting element has very poor resistance to temperature and humidity, and a blackening phenomenon occurs from the peripheral portion to the central portion in about 200 hours at a temperature of 20 ° C. and a humidity of 90%, resulting in a luminance Result in a decrease. Therefore, it was a problem when it was installed in a device that is used in places with high temperature and high humidity, such as outdoors.

【0004】 本考案は上述の点に鑑みて為されたものであり、その目的とするところは、温 度及び湿度の影響を受けにくいEL発光素子の封止収納構造を提供することにあ る。The present invention has been made in view of the above points, and an object of the present invention is to provide a sealed housing structure for an EL light emitting element that is not easily affected by temperature and humidity. ..

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

本考案では、上記目的を達成するために、プリント基板の外周とケースとの間 などの少なくともEL表示素子の収納部と外気とが連通する連通部を、完全硬化 する樹脂で1次シールし、プリント基板の外面全体を硬化しても柔らかい樹脂で 2次シールしている。 According to the present invention, in order to achieve the above object, at least a communication part, such as a space between an outer periphery of a printed circuit board and a case, in which the storage area of the EL display element communicates with the outside air is primary-sealed with a completely curable resin, Even if the entire outer surface of the printed circuit board is cured, it is secondarily sealed with a soft resin.

【0006】[0006]

【作用】 本考案は、上述のように構成することにより、EL発光素子がケースとプリン ト基板にて形成された収納空間内に配置され、上記プリント基板の外面に少なく とも電子部品が実装された装置において、プリント基板とケースとを封止状態を 完全にして、戸外などの高温,多湿となる場所で使用しても温度及び湿度の影響 を受けにくいようにしたものである。According to the present invention, the EL light emitting device is arranged in the storage space formed by the case and the printed circuit board, and the electronic components are mounted on the outer surface of the printed circuit board by the above-mentioned configuration. In this device, the printed circuit board and the case are completely sealed so that they are not easily affected by temperature and humidity even when used in places with high temperature and humidity such as outdoors.

【0007】[0007]

【実施例】【Example】

図1に本考案の一実施例を示す。本実施例は、テンキーを備える装置に本考案 を適用した場合を示す。このような装置では、テンキーで入力される数値を表示 する表示部を備え、この表示部を液晶表示素子3を用いて構成し、液晶表示素子 3の簡便な照明としてEL発光素子1を用いてある。 FIG. 1 shows an embodiment of the present invention. This embodiment shows a case where the present invention is applied to a device provided with a numeric keypad. Such a device is provided with a display unit for displaying a numerical value input with a ten-key pad, the display unit is configured by using the liquid crystal display element 3, and the EL light emitting element 1 is used as simple illumination of the liquid crystal display element 3. is there.

【0008】 図1はその種の装置の表示部の断面を示すもので、この表示部では箱状のケー ス4の開口する背面に、EL発光素子1が前面に実装されたプリント基板2をね じ止めして取り付け、ケース4の前面に形成された表示窓4a部に取り付けられ た液晶表示素子3をEL発光素子1が後方から照明する。つまり、EL発光素子 1をいわゆるバックライトとして用いてある。なお、液晶表示素子3及びEL発 光素子1の収納部の図1の紙面に直交する方向もケース1で閉塞されている。ま た、液晶表示素子3もプリント基板2に対して取り付けてある。FIG. 1 shows a cross section of a display portion of such a device. In this display portion, a printed board 2 having an EL light emitting element 1 mounted on the front surface is provided on the rear surface of an opening of a box-shaped case 4. The EL light-emitting element 1 illuminates the liquid crystal display element 3 attached to the display window 4a formed on the front surface of the case 4 from the rear side by screwing. That is, the EL light emitting element 1 is used as a so-called backlight. The case 1 also closes the direction in which the liquid crystal display element 3 and the EL light emitting element 1 are accommodated, which is orthogonal to the plane of FIG. The liquid crystal display element 3 is also attached to the printed board 2.

【0009】 ところで、従来のこの種の表示部では、液晶表示素子3とケース4との間、あ るいはプリント基板1とケース4との間に隙間ができ、この隙間を通して通気が 行われ、EL発光素子1の収納部、つまりケース4、プリント基板2及び液晶表 示素子3とで囲まれた空間内が高温,多湿状態となる。この場合には、上述した ように耐温湿特性の悪いEL発光素子1では黒化現象が起こる。By the way, in the conventional display unit of this type, a gap is formed between the liquid crystal display element 3 and the case 4, or between the printed circuit board 1 and the case 4, and ventilation is performed through this gap. The housing portion of the EL light emitting element 1, that is, the space surrounded by the case 4, the printed circuit board 2, and the liquid crystal display element 3 is in a high temperature and high humidity state. In this case, as described above, the blackening phenomenon occurs in the EL light emitting element 1 having poor temperature and humidity resistance.

【0010】 そこで、本実施例ではケース4と液晶表示素子3との間にゴム製のシールシー ト5を間に挟み、且つプリント基板2とケース4との接合部などに生じる隙間な どをシールするようにしてある。 ところで、プリント基板2とケース4とのシールに関しては、まずプリント基 板2の外周とケース4との間の隙間や、図示しないスルーホール孔などの少なく ともEL表示素子の収納部と外気とが連通する連通部を、例えば硬化性のエポキ シ樹脂などの1次シール材6で1次シールする。そして、その1次シール材6の 硬化後に、ウレタン樹脂などの硬化しても柔らかい樹脂である2次シール材7を 用いてプリント基板2の電子部品8の実装面側全体をを完全シールする。Therefore, in this embodiment, a rubber seal sheet 5 is sandwiched between the case 4 and the liquid crystal display element 3, and a gap such as a joint portion between the printed circuit board 2 and the case 4 is sealed. I am doing it. By the way, regarding the seal between the printed circuit board 2 and the case 4, first, there is a gap between the outer periphery of the printed circuit board 2 and the case 4, a through hole hole (not shown), and the like. The communicating portion that communicates is primarily sealed with a primary sealing material 6 such as a curable epoxy resin. Then, after the primary sealing material 6 is cured, the entire mounting surface side of the electronic component 8 of the printed circuit board 2 is completely sealed by using the secondary sealing material 7 which is a soft resin such as urethane resin even when cured.

【0011】 上述のように1次シール後に2次シールを行うのは次の理由による。つまり、 電子部品8が実装された部分を上記硬化性のエポキシ樹脂などの完全硬化するも のでシールすることは好ましくない。そこで、比較的に柔らかい樹脂を使用する ことが考えられるが、この場合には樹脂の流れ性が良く、プリント基板2とケー ス4とで形成される液晶表示素子3を収めた空間内に入り込み、液晶表示素子3 の表示面を汚す恐れがある。このため、本実施例では、完全硬化する樹脂を用い て1次シールした後に、硬化しても柔らかい樹脂で2次シールするようにしてあ る。The secondary sealing is performed after the primary sealing as described above for the following reason. That is, it is not preferable to seal the portion on which the electronic component 8 is mounted because it is completely cured with the above-mentioned curable epoxy resin or the like. Therefore, it is conceivable to use a relatively soft resin, but in this case the resin flowability is good and it enters the space containing the liquid crystal display element 3 formed by the printed circuit board 2 and the case 4. The display surface of the liquid crystal display element 3 may be soiled. For this reason, in the present embodiment, after the primary sealing is performed using the completely curable resin, the secondary sealing is performed using the soft resin even if it is cured.

【0012】 このようにすれば、EL発光素子1を完全に密閉収納することができる。この ようにして形成された装置で、液晶表示素子3の黒化現象を測定すると、20℃ ,90%の条件化で、700時間以上にならないと黒化現象が生じないという結 果が得られた。この装置が、例えば1回当たりの使用時間が1分で、日に30回 使用され、20℃,90%以上の日が年に半分とした場合、7.7年間は黒化現 象が生じないことになる。With this configuration, the EL light emitting element 1 can be completely enclosed and housed. When the blackening phenomenon of the liquid crystal display element 3 is measured by the device thus formed, the result is that the blackening phenomenon does not occur unless it is 700 hours or more under the condition of 20 ° C. and 90%. It was If this device is used for 30 minutes a day, for example, with a usage time of 1 minute each time, and if the temperature at 20 ° C and 90% or more is halved a year, blackening will occur for 7.7 years. There will be no.

【0013】[0013]

【考案の効果】[Effect of the device]

本考案は上述のように、プリント基板の外周とケースとの間などの少なくとも EL表示素子の収納部と外気とが連通する連通部を、完全硬化する樹脂で1次シ ールし、プリント基板の外面全体を硬化しても柔らかい樹脂で2次シールしてい るので、EL発光素子がケースとプリント基板にて形成された収納空間内に配置 され、上記プリント基板の外面に少なくとも電子部品が実装された装置において 、プリント基板とケースとを封止状態を完全にすることができ、戸外などの高温 ,多湿となる場所で使用しても温度及び湿度の影響を受けにくくすることができ る。 As described above, according to the present invention, at least a communication portion, such as a space between the outer periphery of the printed circuit board and the case, which communicates between the housing of the EL display element and the outside air is primary-sealed with a completely curable resin. Even if the entire outer surface of the device is cured, it is secondarily sealed with a soft resin, so the EL light emitting element is placed in the storage space formed by the case and the printed circuit board, and at least electronic components are mounted on the outer surface of the printed circuit board. In this device, the printed circuit board and the case can be completely sealed, making it less susceptible to the effects of temperature and humidity even when used in places with high temperature and high humidity such as outdoors.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例の構造を示す断面図である。FIG. 1 is a sectional view showing the structure of an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 EL発光素子 2 プリント基板 4 ケース 6 1次シール材 7 2次シール材 8 電子部品 1 EL Light Emitting Element 2 Printed Circuit Board 4 Case 6 Primary Sealing Material 7 Secondary Sealing Material 8 Electronic Parts

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 EL発光素子がケースとプリント基板に
て形成された収納空間内に配置され、上記プリント基板
の外面に少なくとも電子部品が実装された装置におい
て、プリント基板の外周とケースとの間などの少なくと
もEL表示素子の収納部と外気とが連通する連通部を、
完全硬化する樹脂で1次シールし、プリント基板の外面
全体を硬化しても柔らかい樹脂で2次シールして成るこ
とを特徴とするEL発光素子の封止収納構造。
1. An apparatus in which an EL light emitting element is arranged in a storage space formed by a case and a printed circuit board, and at least an electronic component is mounted on an outer surface of the printed circuit board, between an outer periphery of the printed circuit board and the case. At least a communication part for communicating the storage part of the EL display element with the outside air,
A sealed housing structure for an EL light-emitting element, characterized in that a primary seal is made with a completely curable resin, and a secondary seal is made with a soft resin even if the entire outer surface of the printed circuit board is cured.
JP7671091U 1991-09-25 1991-09-25 Sealed housing structure for EL light emitting device Pending JPH0527995U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7671091U JPH0527995U (en) 1991-09-25 1991-09-25 Sealed housing structure for EL light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7671091U JPH0527995U (en) 1991-09-25 1991-09-25 Sealed housing structure for EL light emitting device

Publications (1)

Publication Number Publication Date
JPH0527995U true JPH0527995U (en) 1993-04-09

Family

ID=13613098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7671091U Pending JPH0527995U (en) 1991-09-25 1991-09-25 Sealed housing structure for EL light emitting device

Country Status (1)

Country Link
JP (1) JPH0527995U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194482A (en) * 1981-05-26 1982-11-30 Omron Tateisi Electronics Co Electric field light emitting element
JPS6017990A (en) * 1983-07-12 1985-01-29 松下電器産業株式会社 Method of treating waterproof of electronic circuit
JPS636896A (en) * 1986-06-26 1988-01-12 松下電器産業株式会社 Printed board device
JPH01175794A (en) * 1987-12-29 1989-07-12 Matsushita Electric Ind Co Ltd Method of water-proofing of printed board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194482A (en) * 1981-05-26 1982-11-30 Omron Tateisi Electronics Co Electric field light emitting element
JPS6017990A (en) * 1983-07-12 1985-01-29 松下電器産業株式会社 Method of treating waterproof of electronic circuit
JPS636896A (en) * 1986-06-26 1988-01-12 松下電器産業株式会社 Printed board device
JPH01175794A (en) * 1987-12-29 1989-07-12 Matsushita Electric Ind Co Ltd Method of water-proofing of printed board

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