JPS6212601B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a dielectric mesh, and more particularly to a method for manufacturing a dielectric mesh in which the openings of the dielectric mesh have uniform dimensions.

Conventionally, electrostatic recording methods have used a recording method in which ion flow caused by corona discharge or the like is controlled using a dielectric mesh, and when manufacturing such a dielectric mesh, it is necessary to Methods have been used in which an insulating material is attached to one surface by a spray method, a vapor deposition method, a spinner method, or the like. FIG. 1 is a schematic cross-sectional view of a part of a dielectric mesh manufactured by such a conventional method, in which 1 is a conductive mesh base, 2 is an insulating material, 3 is an opening, and 4 is a dielectric mesh base. show. As shown in FIG. 1, in the dielectric mesh manufactured by the conventional method, the insulating material 2 wraps around the opening 3 of the conductive mesh base 1.
The problem was that the adhesive adhered to the inner wall of the opening 3 and even to the opposite surface of the conductive mesh substrate 1, resulting in uneven dimensions of the opening 3.

The present invention has been made in view of the current situation, and its purpose is to solve the drawbacks of the conventional method and provide a method for manufacturing a dielectric mesh in which the dimensions of the openings of the dielectric mesh are uniform. It is.

To summarize the present invention, the method for manufacturing a dielectric mesh of the present invention involves depositing an insulating substance that becomes soluble in a solvent on one side of a conductive mesh base by irradiating it with energy rays, and then It is characterized by irradiating energy rays from the opposite side, and then dissolving and removing the insulating material in the area irradiated with energy rays using a solvent.

In the present invention, a specific polymeric material (resin) that decomposes when irradiated with energy rays and becomes soluble in an appropriate solvent is used as the insulating material, and this is uniformly adhered to one side of the conductive mesh base. let The coating method in this case is not particularly limited, and known vapor deposition methods, spray methods, spinner methods, etc. can be used as appropriate. At this time, some of the insulating material may wrap around the opening of the conductive mesh base and even reach and adhere to the opposite surface of the base. According to the present invention, by irradiating an energy beam such as an ultraviolet ray or an electron beam from the opposite side of the conductive mesh base, the insulation attached to the inner wall of the opening and the opposite side of the base is When only the substance is irradiated, it decomposes (the main chains of its constituent molecules are cut) and becomes soluble in specific solvents.
Next, the conductive mesh substrate that has been treated in this way is immersed in a suitable solvent to dissolve and remove the insulating material in the irradiated area, and uniformly insulate only one side that is not irradiated. A dielectric mesh with a substance attached thereto can be produced. The dielectric mesh thus manufactured has openings with dimensions matching (corresponding to) the mesh of the conductive mesh base, and the passage of ion flow due to corona discharge or the like can be accurately controlled.

The conductive mesh substrate in the present invention includes:
A stainless steel mesh, a stainless steel press mesh, an etched mesh, etc. having about 100 to 400 meshes can be used as appropriate, and the thickness thereof is suitably about 30 μm.

Further, the insulating substance in the present invention is not particularly limited as long as it is a dielectric substance and becomes decomposed by irradiation with energy rays and becomes soluble in a suitable solvent. Such substances include
Various polymer materials that have been conventionally used as positive resists for ion etching can be mentioned, and specifically, polyimide resin-based positive resists (Parylene, sold by Tomoe Kogyo Co., Ltd.), methacrylic acid ester polymers, Use copolymers, novolak resin-based positive resists (manufactured by Shipley Co., Ltd., AZ1350), orthonaphthoquinonediazide-based positive resists (manufactured by Shipley Co., Ltd., AZ series), micropositive resists (manufactured by Eastman Kodak Co., Ltd.), etc. I can do it. The thickness of the coating of these insulating substances is suitably about 50 μm.

In addition to ultraviolet rays, electron beams and the like can be appropriately used as energy rays in the present invention. For example, the purpose can be achieved by irradiating ultraviolet rays with a mercury lamp of about 500 W.

The solvent used in the present invention varies depending on the type of the insulating substance, and in addition to chlorinated solvents such as α-chlornaphthalene and carbon tetrachloride, methyl isobutyl ketone, isopropyl alcohol, and appropriate alkaline solvents may be used as appropriate. It can be used selectively. In the present invention, particularly good results have been obtained using parylene as the insulating material and α-chloronaphthalene as the solvent. in this case,
The operation can be carried out by heating the solvent to a suitable temperature of about 100 to 150°C to obtain a more effective effect.

Next, the present invention will be described by way of examples with reference to the drawings, but the present invention is not limited thereto in any way.

Example FIG. 2a is a schematic cross-sectional view of a portion of the conductive mesh substrate shown in this example with an insulating material attached to one surface, and b is a schematic cross-sectional view of the conductive mesh shown in a. A schematic cross-sectional view showing a state in which energy rays are irradiated from the opposite side of the substrate, and c is a cross-sectional diagram showing a state in which the conductive mesh substrate of the present invention with an insulating material attached is immersed in a solvent after being irradiated with energy rays. 1 is a schematic cross-sectional view of a dielectric mesh, in which 1 is a conductive mesh base, 2 is an insulating material, 3 is an opening, and 4 is a schematic cross-sectional view of a dielectric mesh;
5 indicates a dielectric mesh, and 5 indicates an energy line.

An insulating material (sold by Tomoe Kogyo Co., Ltd., parylene: polyimide resin) 2 is vapor-deposited on one side of a conductive mesh base (stainless steel mesh) 1 with a mesh size of 200 mesh and a thickness of 30 μm. A vapor deposited film was formed. In this case, as shown in FIG.
It was also formed on the inner wall and part of the opposite side. Next, as shown in FIG. 2b, an energy beam (ultraviolet light from a 500 W mercury lamp) 5 was irradiated from the opposite surface of the conductor mesh substrate 1. When this product was immersed in a solvent (α-chlornaphthalene) heated to 150°C, the insulating material 2 (hatched area) attached to the inner wall of the opening 3 and the opposite surface of the base 1 was dissolved. As a result, it was possible to manufacture a dielectric mesh 4 in which the insulating material 2 was uniformly adhered to only one side of the conductive mesh base 1 as shown in FIG. 2c.

As explained above, according to the present invention, an insulating material is uniformly adhered to one side of a conductive mesh base, and then an energy beam is irradiated from the opposite side to form a conductive mesh base. Only the insulating material that has gone around the opening and adhered to the opposite side and the inner wall of the opening is irradiated with energy rays and becomes soluble in the solvent, and then immersed in the solvent to dissolve the insulating material that has adhered to one side. It is possible to dissolve and remove the insulating material in other parts, leaving only the insulating material in place. Therefore, the dielectric mesh obtained according to the present invention has openings with a diameter matching that of the mesh of the conductive mesh base, and has an insulating material of uniform thickness on one side, so that it is free from corona. The passage of ion current due to discharge or the like can be accurately controlled, and it can be effectively used as a component in electrostatic recording methods.

[Brief explanation of the drawing]

Fig. 1 is a schematic cross-sectional view of a part of a dielectric mesh manufactured by a conventional method, and Fig. 2 a shows a state in which an insulating material is attached to one surface of a conductive mesh base according to the present invention. Partial cross-sectional schematic diagram, 2nd
Figure b is a schematic cross-sectional view showing the state in which energy rays are irradiated from the opposite side of the conductive mesh substrate shown in a, and Figure 2c is a schematic cross-sectional view showing the state in which an insulating material is attached after irradiation with energy rays. 1 is a schematic cross-sectional view of a dielectric mesh of the present invention manufactured by immersing a conductive mesh substrate in a solvent. DESCRIPTION OF SYMBOLS 1... Conductive mesh base, 2... Insulating material, 3... Opening, 4... Dielectric mesh, 5...
...Energy lines.

Claims (1)

[Scope of Claims] 1. An insulating substance that becomes soluble in a solvent is attached to one side of a conductive mesh base by irradiation with energy rays, and then an energy ray is irradiated from the opposite side of the conductive mesh base, A method for manufacturing a dielectric mesh, characterized in that the insulating material in the portion irradiated with energy rays is then dissolved and removed using a solvent. 2. Claim No. 2, in which parylene is attached as an insulating material to a conductive mesh base, irradiated with ultraviolet rays as energy rays, and then the insulating material in the portions irradiated with ultraviolet rays is dissolved and removed using α-chlornaphthalene as a solvent. A method for manufacturing a dielectric mesh according to item 1.