JPS62124898A - Method of processing substrate for forming electric circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for processing a metal-based board for forming an electric circuit, and more particularly, to a processing method for cutting a board for forming an electric circuit into the dimensions and shapes to be used. .

[Prior Art] In general, a metal-based electric circuit forming board composed of, for example, copper foil, an insulating layer, and an iron substrate needs to be finished by press punching into the dimensions and shape to be used individually.

Therefore, when cutting a board for forming an electric circuit, copper N(
In order to protect the insulation layer (pattern printed circuit) from contacting the mold, conventionally, as shown in Figure 2, the copper foil (pattern)/insulating layer side is placed on the male side of the press.
The iron substrate is placed on the press female die and cut.
At this time, the iron substrate undergoes plastic deformation, causing sagging in the direction of movement of the male press die shown by the arrow, and burrs appearing on the female press die.

Therefore, in a board for forming an electric circuit, the adhesion strength of the insulating layer is lower than the processing strength of normal products due to sagging on the iron substrate on the copper foil (pattern)/insulating layer side. As shown in Figure tjS2, the end part was peeled off from the iron substrate by about 10 meters.

In addition, the insulating layer peeled off during handling of the cut electric circuit forming substrate, and in some cases even the copper foil (pattern) peeled off.

As described above, when assembling an electrical circuit board from which an insulating layer or copper foil (pattern) has been peeled off from a steel substrate, leaks may occur due to contact with conductors such as copper wires, or leaks may occur. During durability tests (continuous environmental operation), rust formed and grew, damaging the insulating layer and causing leaks in most cases.

[Problems to be Solved by the Invention] The present invention solves the problems described above in the conventional cutting process of a metal-based board for forming an electric circuit. To provide a method for processing a substrate for forming an electric circuit, in which layers and metal foils do not peel off, and therefore, leakage does not occur after assembly.

[Means for Solving the Problems 1] The method for processing an electric circuit forming substrate according to the present invention is characterized in that an electric circuit forming substrate composed of a metal foil, an insulating layer, and a metal substrate is press-punched. When carrying out
The metal foil/insulating layer is placed in contact with the female press die, and is cut from the metal substrate side by the male press die.

A method of processing a substrate for forming an electric circuit according to the present invention will be described in detail below.

First, in the method for processing an electric circuit forming substrate according to the present invention, the materials constituting the electric circuit forming substrate will be explained.

Since the metal foil is a conductor, it is naturally made of copper, which has excellent conductivity, and preferably has a thickness of 5 to 70 μm. Further, this metal foil may be made of aluminum, copper alloy, nickel, silver, or a conductive metal or an alloy thereof.

The insulating layer is made of an adhesive, a heat-resistant insulating film, and an adhesive, and the adhesive and the heat-resistant insulating film will be explained below.

It is best to use an epoxy adhesive that has relatively good electrical insulation properties, and other adhesives that have good adhesion to metals and good electrical insulation properties, such as polyamide, etc.
Imide-based, silicone-based, acrylic-based, polyester-based, and polyurethane-based materials can also be used. In addition, the thickness of the adhesive should be determined based on the insulation required for the electrical insulation layer including the heat-resistant insulation film, and is approximately 2.
The thickness is preferably 0 to 200μ.

The heat-resistant insulating film must have heat resistance that does not have defects such as pinholes, does not melt even when heated, is unaffected by adhesives, and has excellent electrical insulation properties.For example, polyimide Films are preferred. The thickness of this heat-resistant insulating film is preferably 5 to 50 microns. In addition to the above-mentioned insulating film, polyester film, polyetherimide, polysulfonate film, etc. can also be used depending on the purpose. This insulating layer is not affected in any way by pattern etching of the metal foil.

In addition, an insulating layer formed with an adhesive on the heat-resistant insulating film described above has a thickness of 20 to 200μ, and an insulating layer made of plush cloth impregnated with an adhesive is also possible.
Its thickness is 20 to 200μ.

As the metal substrate, an ordinary steel plate with a thickness of 0.3 to 3.0 mm or a silicon steel plate with a thickness of 0.1 to 1.0 mm is used. Additionally, aluminum, aluminum alloys, copper, and copper alloys can also be used.

Next, use such materials to create metal foil (pattern).
A method of cutting an electric circuit forming board composed of an insulating layer and a metal board will be explained using an example shown in FIG.

In Fig. 1, a copper N (pattern)/insulating layer is placed in contact with a female press die lined with a cushioning material, such as rubber, and the male press die is advanced in the direction of the arrow, starting from the iron substrate side. This involves cutting the base for forming electrical circuits.

In this case, the iron substrate undergoes plastic deformation and sag occurs in the direction of movement shown by the arrow of the male press die, but this sag has no effect on the insulating layer and the copper foil (pattern). The insulation layer and copper 2F (pattern) do not peel off from the iron substrate, and there is no problem in handling during assembly. A small “
Although burrs are produced, there is no problem in using it as a base for forming an electric circuit.

[Effects of the Invention] As explained above, since the method for processing a substrate for forming an electric circuit according to the present invention has the above configuration, even if the substrate for forming an electric circuit is cut into a desired size and shape, it is not insulated from the iron substrate. Layer or copper? This has an excellent effect in that the i5 (pattern) does not peel off, therefore no leakage occurs, and furthermore, no rust occurs.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram for explaining a method for processing a substrate for forming an electric circuit according to the present invention, and FIG. 2 is an explanatory diagram for explaining a conventional method for cutting a substrate for forming an electric circuit. Fang 1 Figure f2

Claims (1)

[Claims] When press punching a base for forming an electric circuit consisting of a metal foil, an insulating layer, and a metal substrate, the metal foil and insulating layer are placed in contact with the female press die, and the male press die is used to cut from the metal substrate side. A method for processing a substrate for forming an electric circuit, characterized by: