JP2013247200A - Edge formation method of metal base circuit board, and metal base circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an edge formation method of a metal base circuit board, and a metal base circuit board capable of restraining influences of pressing sags even in a press-punching processing.SOLUTION: In an edge formation method of a metal base circuit board 1, a press-punched section 1a or an edge 9 due to a step near a press-punched hole section is formed on the other side face 3b of the metal base circuit board 1 in which a wiring pattern 7 is formed on one side face 3a of a metal substrate 3 via an insulation layer 5. Before forming the press-punched section 1a, a step-coping recess 15 is formed to include a press-punched schedule section 10a that becomes the press-punched section 1a, and is press-punched at the press-punched schedule section 10a in the step-coping recess 15, so as to form the press-punched section 1a and the edge 9 due to the step near it.

Description

  The present invention relates to a method for forming an edge of a metal base circuit board used for a metal base circuit board for LED lighting or the like, and a metal base circuit board.

  As a conventional metal base circuit board, for example, there is the one shown in FIGS. 11 to 13 similar to that described in Patent Document 1. FIG. 11 is a cross-sectional view of a main part of a metal base circuit board showing a press sag, FIG. 12 is a cross-sectional view of a main part of a resin-sealed metal base circuit board, and FIG. It is a principal part top view.

  As shown in FIG. 11, the metal base circuit board 101 has a wiring pattern 107 formed on one side surface 103a of a metal board 103 made of aluminum or the like through an insulating layer 105, and a plurality of them are integrally formed. Manufactured as an assembly, each metal base circuit board 101 is stamped.

  In this press punching process, as shown in FIG. 11, after press punching, a press sag 109 or the like is invited to the press punching part 101a, and after assembling to a case (not shown), resin sealing as shown in FIGS. In some cases, the shape of the edge portion 111 a of the insulating resin 111 is not determined, and may be formed on the other side surface 103 b of the metal substrate 103.

  When the edge portion 111a is protruded, the appearance is impaired, and the adhesion is impaired when the heat sink is attached to the other side surface 103b, and the heat radiation may be insufficient.

JP-A-2005-123606

  A problem to be solved is that press sagging is caused in the peripheral portion by press punching.

  In the edge forming method of the metal base circuit board according to the present invention, a wiring pattern is formed on one side of the metal board via an insulating layer in order to be able to regulate the influence of the press sag in the peripheral part even if the punching process is performed. An edge forming method for a metal base circuit board in which an edge due to a step is formed in the vicinity of a press punched part on the other side of the metal base circuit board, and the press punching scheduled to be the press punched part before the press punched part is formed A step-corresponding concave portion is formed including the portion, and an edge is formed by the press-punched portion and a step in the vicinity thereof by performing press-punching at a portion to be punched in the step-corresponding concave portion.

  The metal base circuit board of the present invention is a metal base circuit board formed by forming a wiring pattern on one side surface of the metal substrate via an insulating layer, and being separated from the assembly at the peripheral punched portion by press punching, The other side surface of the metal substrate is provided with an edge due to a step in the vicinity of the press punched portion, and the edge restricts the influence of the press punched portion on the other side surface.

  Since the edge forming method for a metal base circuit board according to the present invention has the above-described configuration, it is possible to restrict the influence of press sagging outside the edge by a step.

  Since the metal base circuit board of the present invention has the above configuration, the influence of press sagging on the other side surface outside the edge can be regulated by the step.

It is principal part sectional drawing of the metal base circuit board sealed with resin. Example 1 It is a principal part top view of the metal base circuit board sealed with resin. Example 1 It is a top view of the metal base circuit board in an aggregate. Example 1 It is a perspective view of the metal base circuit board cut away by press punching. Example 1 (A) is a fragmentary cross-sectional view of a state in which a step-corresponding concave portion is formed in a press-punched portion of a metal base circuit board in an assembly, and (B) is a fragmentary cross-sectional view of a metal base circuit board that has been stamped. It is. Example 1 It is principal part sectional drawing which forms the recessed part corresponding to a level | step difference by press work. Example 1 It is a perspective view of a metal base circuit board. (Example 2) It is a perspective view of a metal base circuit board. (Example 2) (A) is a sectional view taken along line IX-IX in FIG. 8, and (B) is a sectional view showing fixation to a housing or the like in the same section. (Example 2) (A) is principal part sectional drawing of the state which formed the counterbore corresponding recessed part in the press punching plan part of a metal base circuit board, (B) is principal part sectional drawing of the metal base circuit board after press punching. . (Example 2) It is principal part sectional drawing of the metal base circuit board which shows press sagging. (Conventional example) It is principal part sectional drawing of the metal base circuit board sealed with resin. (Conventional example) It is a principal part top view of the metal base circuit board sealed with resin. (Conventional example)

  The purpose of allowing the press sagging of the peripheral part to be regulated even after the punching process is realized by forming a step-corresponding recess including the part to be pressed before the punching process.

[Metal base circuit board]
FIG. 1 is a cross-sectional view of a principal part of a resin-sealed metal base circuit board, and FIG. 2 is a plan view of a principal part of the resin-sealed metal base circuit board.

  As shown in FIGS. 1 and 2, the metal base circuit board 1 has a copper wiring pattern 7 formed on one side surface 3 a of a metal substrate 3 made of copper or the like via an insulating layer 5. The metal base circuit board 1 is manufactured as an assembly in which a plurality is integrally formed as will be described later, and each metal base circuit board 1 is cut off by press punching.

  An edge 9 is formed on the other side surface 3 b of the metal substrate 3 along the stamped portion 1 a of the metal base circuit board 1. This edge 9 regulates the press sag 11 by the press punching of the press punching part 1a so that the press sag 11 does not affect the other side surface 3b.

  The metal base circuit board 1 is filled with an insulating resin 13 from the punched portion 1a to the edge 9 in a case (not shown) and sealed with resin. The insulating resin 13 has a portion 13 a that is flush with the other side surface 3 b of the metal substrate 3. Although not shown, a circuit element is attached to a predetermined portion of the wiring pattern 7 and is sealed with resin in the insulating resin 13.

  The insulating resin 13 formed from the punched portion 1a to the edge 9 is received by the edge 9 and prevented from rising to the other side surface 3b. As a result, the terminal of the insulating resin 13 is formed in an orderly and straight line following the edge 9 and has a configuration having a portion 13 a flush with the other side surface 3 b of the metal substrate 3.

  In this way, the influence of press sagging outside the edge 9 is regulated. The insulating resin 13 is formed in an orderly and linear manner following the edge 9, and the appearance is adjusted, and the other side surface 3 b of the metal substrate 3. When the heat sink is attached with the portion 13a of the insulating resin 13 being flush with each other, the adhesiveness is good and the heat dissipation can be improved.

[Metal-based circuit board edge forming method]
3 is a plan view of the metal base circuit board in the assembly, FIG. 4 is a perspective view of the metal base circuit board cut away by press punching, and FIG. 5A is a diagram of the metal base circuit board in the assembly. FIG. 5B is a cross-sectional view of a main part in a state in which a concave portion is formed in a part to be punched, and FIG.

  As shown in FIG. 3, before the metal base circuit board 1 is punched out, the metal base circuit boards 1 are formed as an assembly 10 integrally formed, and are punched out at a planned punching portion 10a (broken line). Thus, the metal base circuit board 1 is obtained.

  In this case, the metal base circuit board 1 is formed by the edge forming method shown in FIG. An edge 9 is formed by the step 15a in the vicinity of the portion 1a.

  First, as shown in FIGS. 3 and 5A, the step-corresponding recess 15 is formed including the pre-pressed portion 10a. This step corresponding recess 15 is formed by etching in this embodiment. However, the step-corresponding recess 15 does not necessarily have to be formed in a lattice shape, and can be formed at an arbitrary place and range in the place including the scheduled punching portion 10a.

  By forming the step-corresponding recess 15 by etching, no stress acts on the metal substrate 3 at the portion corresponding to the step-corresponding recess 15, so that the insulating layer 5 on the one side surface 3a is not damaged, and the step on the one side surface 3a is not damaged. The wiring pattern 7 can also be formed at a location corresponding to the corresponding recess 15.

  Next, the punching scheduled portion 10a is punched, and the metal base circuit board 1 is extracted as shown in FIG. As a result of this extraction, the space between the portions 10a to be pressed is a portion 10b that is discarded as scrap. The edge 9 by the level | step difference 15a is formed in the vicinity of the stamping part 1a by the stamping process.

  The punched portion 1a is used when the metal base circuit board 1 is cut out and separated from an assembly in which a plurality of the metal base circuit boards 1 are integrally formed by the scheduled punching portion 10a. The number of aggregates is not particularly limited, and may be two or more.

  A press sag 11 is generated on the stepped portion 15a of each metal base circuit board 1 on the side of the step 15a, but the effect of the press sag on the other side surface 3b beyond the edge 9 can be regulated by the step 15a.

  It should be noted that the cutting from the assembly of the metal base circuit board 1 is not limited to pressing, but can be cut by cutting or the like. In this case, the burr protrudes toward the step 15a instead of the press sagging. This burr can also regulate the influence on the other side surface 3b beyond the edge 9 by the step 15a.

  FIG. 6 is a cross-sectional view of a main part for forming a step-corresponding recess by press working.

  The step-corresponding recess 15 can be formed by pressing using a punch 17 as shown in FIG. 6 instead of etching. 6 shows the metal base circuit board 1 after punching, the step-corresponding recess 15 is formed in the assembly 10 as shown in FIG. In this case, the wiring pattern 7 may not be formed on the one side surface 3a at the portion corresponding to the step corresponding recess 15. Moreover, since the depth of the press working of the step corresponding recess 15 is shallow, the influence on the other side surface 3b can be suppressed with respect to the press punched portion 1a. The step corresponding recess 15 can also be formed by cutting. Also in this case, the processing depth is slight, and the influence on the other side surface 3b due to the processing can be suppressed with respect to the press punched portion 1a.

  7 to 10 relate to a second embodiment of the present invention, FIGS. 7 and 8 are perspective views of a metal base circuit board, FIG. 9A is a cross-sectional view taken along line IX-IX in FIG. (B) is a cross-sectional view showing fixing to a housing or the like in the same cross section, FIG. 10 (A) is a cross-sectional view of the main part in a state in which a counterbore corresponding concave portion is formed in a press punched portion of a metal base circuit board, (B) is principal part sectional drawing of the metal base circuit board after a press punching process.

  In addition, the same code | symbol is attached | subjected to the same component as Example 1, and the same code | symbol is attached | subjected and demonstrated to a corresponding component, and the overlapping description is abbreviate | omitted.

  The metal base circuit board 1A shown in FIG. 7 has an edge 9A formed by a step 15Aa on the entire circumference. The metal base circuit board 1B of FIG. 8 partially formed an edge 9B due to a step 15Ba.

  As shown in FIGS. 7 and 8, the metal base circuit boards 1 </ b> A and 1 </ b> B have a screw insertion hole 19 as a through-hole, and the other side surfaces 3 </ b> Ab and 3 </ b> Bb of the metal boards 3 </ b> A and 3 </ b> B with respect to the screw insertion hole 19. Both counterbore 23 is formed.

  Referring to the metal base circuit board 1B in FIG. 8, the screw 25 is inserted into the screw insertion hole 19 as shown in FIG. 9B, and the one side surface 3Ba side is fastened and fixed to the housing 27 or the like. The head 25 a of the screw 25 is accommodated in the counterbore 23. Thus, by accommodating the head 25a of the screw 25 in the counterbore 23, the protrusion of the head 25a on the other side surface 3Bb of the metal substrate 3B is eliminated, and a heat sink or the like heat sink such as a heat sink that contacts the other side surface 3Bb ( It is not necessary to carry out a concave process to avoid the head 25a or screw it from above the heat dissipating part.

  Further, the counterbore 23 can restrict the press sag at the periphery of the screw insertion hole 19 that is a press punched portion from affecting the other side surface 3Bb of the metal substrate 3B. By this restriction, for example, a hole to which the screw 25 is not attached, the edge of the counterbore 23 can be obtained on the other side surface 3Bb, and the surface accuracy of the other side surface 3Bb can be improved.

  By the edge forming method of the metal base circuit board 1B of the present embodiment, the wiring pattern 7B (FIG. 9) is formed on one side surface 3Ba of the metal board 3B via the insulating layer 5B, and the screw is inserted through the metal base circuit board 1B. The counterbore 23 is formed together with the hole 19 on the other side surface 3Bb of the metal substrate 3B.

  First, a counterbore corresponding recess 21 is formed including a press punching scheduled portion 19aa of the screw insertion hole 19 shown in FIG. The counterbore corresponding concave portion 21 is formed in an aggregate as shown in FIG. In this embodiment, the counterbore corresponding concave portion 21 is formed by etching when the step corresponding concave portion corresponding to the partial step 15Ba shown in FIG. The effect of etching is the same as described above.

  Next, as shown by an arrow B in FIG. 10A, the punched hole 19aa is punched by a punch (not shown), and the screw is inserted into the metal base circuit board 1A as shown in FIG. 10B. Hole 19 is formed. With this formation, a counterbore 23 is formed on the other side surface 3Bb of the metal substrate 3B with respect to the screw insertion hole 19.

  In addition, in the metal base circuit board 1B of FIG. 10A, the screw insertion hole 19 and the counterbore 23 can be formed in each metal base circuit board 1B in an assembly in which the metal base circuit boards 1B are integrally formed. . The punching process of the screw insertion holes 19 in the assembly can be performed in a later process after the metal base circuit board 1B is pressed from the assembly, or can be performed simultaneously. Further, the screw insertion hole 19 and the counterbore 23 can be formed on the single metal base circuit board 1B.

  The stamping process from the assembly of the metal base circuit board 1B and the resin sealing with the insulating resin 13 are the same as described above.

  The counterbore corresponding concave portion 21 can be formed by a press using a punch together with the step corresponding concave portion 15 instead of etching, or can be formed by cutting as described above. In this case, since the depth of the counterbore 23 is shallow and it is not a punching process, the influence on the other side surface 3 b can be suppressed with respect to the process of the screw insertion hole 19.

  Formation of the screw insertion hole 19 as a hole by press punching can also be performed from one side surface 3a. In this case, burr due to punching protrudes into the counterbore 23, but the counterbore 23 can suppress the influence on the other side surface 3b. The holes can also be formed by drilling.

  The method of FIG. 10 and the metal base circuit board 1B are similarly applied to the metal base circuit board 1A.

DESCRIPTION OF SYMBOLS 1, 1A, 1B Metal base circuit board 1a Stamping part 1aa Stamping part 3 Metal substrate 5 Insulating layer 7 Wiring patterns 9, 9A, 9B Edge 11, 21a Pressing 13 Insulating resin 15 Step corresponding recess 15a, 15Aa, 15Ba Step 19 Screw insertion hole (hole)
19aa Press punched portion 21 Counterbore corresponding recess 23 Counterbore

Claims (7)

An edge forming method for a metal base circuit board, wherein an edge due to a step is formed on the other side surface of the metal base circuit board in which a wiring pattern is formed on one side face of the metal board via an insulating layer, in the vicinity of the press-release portion,
Before forming the press punched portion, forming a step corresponding concave portion including the press punched portion to be the press punched portion,
Forming an edge by the stepped portion in the vicinity of the stamped portion by pressing in the portion to be stamped in the step corresponding recess.
An edge forming method for a metal base circuit board. The metal base circuit board edge forming method according to claim 1,
The punching part is a part when the metal base circuit board is cut out and separated from an assembly in which a plurality of the metal base circuit boards are integrally formed by a part to be punched out.
An edge forming method for a metal base circuit board. A method for forming an edge of a metal base circuit board according to claim 1 or 2,
The step corresponding recess is formed by either etching, pressing, or cutting,
An edge forming method for a metal base circuit board. An edge forming method for a metal base circuit board according to claim 3,
When the metal base circuit board is provided with a hole through which the counterbore is formed on the other side of the metal board with respect to the hole,
When the step-corresponding recess is formed by etching, the counterbore-corresponding recess is formed by etching together with the other side surface of the metal substrate, including the press punching scheduled portion before press punching of the hole,
Forming the hole and the counterbore by press punching at a press hole punching scheduled part in the counterbore corresponding recess;
An edge forming method for a metal base circuit board. A metal base circuit board formed by forming a wiring pattern on one side surface of a metal substrate through an insulating layer and separated from the assembly by a punching process at the peripheral edge,
On the other side of the metal substrate, provided with an edge due to a step in the vicinity of the punched portion,
With the edge, the influence on the other side of the press punched portion was regulated,
A metal-based circuit board characterized by that. The metal base circuit board according to claim 5,
Comprising a hole penetrating the metal substrate;
With the counterbore on the other side of the metal substrate against this hole,
The counterbore regulates the influence on the other side surface due to the processing of the hole,
A metal-based circuit board characterized by that. The metal base circuit board according to claim 5 or 6,
Resin-sealed with an insulating resin having a portion flush with the other side surface of the metal substrate from the punched portion to the edge,
A metal-based circuit board characterized by that.

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