JPS6212305Y2 - - Google Patents

Info

Publication number

JPS6212305Y2

JPS6212305Y2 JP7679578U JP7679578U JPS6212305Y2 JP S6212305 Y2 JPS6212305 Y2 JP S6212305Y2 JP 7679578 U JP7679578 U JP 7679578U JP 7679578 U JP7679578 U JP 7679578U JP S6212305 Y2 JPS6212305 Y2 JP S6212305Y2

Authority

JP

Japan

Prior art keywords

mold frame

circuit

chip

circuit board

electrode patterns

Prior art date

1978-06-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 4
• 239000013078 crystal Substances 0.000 claims description 3
• 238000009413 insulation Methods 0.000 claims description 3
• 238000000465 moulding Methods 0.000 claims description 3
• 230000010355 oscillation Effects 0.000 claims description 3
• 239000003990 capacitor Substances 0.000 description 8
• 210000002858 crystal cell Anatomy 0.000 description 5
• 239000004973 liquid crystal related substance Substances 0.000 description 5
• 238000004519 manufacturing process Methods 0.000 description 4
• 239000003795 chemical substances by application Substances 0.000 description 3
• 238000013461 design Methods 0.000 description 3
• 230000000694 effects Effects 0.000 description 3
• 230000002411 adverse Effects 0.000 description 2
• 229920001971 elastomer Polymers 0.000 description 2
• 239000005060 rubber Substances 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 210000004027 cell Anatomy 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 238000012937 correction Methods 0.000 description 1
• 230000008878 coupling Effects 0.000 description 1
• 238000010168 coupling process Methods 0.000 description 1
• 238000005859 coupling reaction Methods 0.000 description 1
• 230000007812 deficiency Effects 0.000 description 1
• 238000001514 detection method Methods 0.000 description 1
• 238000009510 drug design Methods 0.000 description 1
• 230000005611 electricity Effects 0.000 description 1
• 239000011888 foil Substances 0.000 description 1
• 238000005286 illumination Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 238000012545 processing Methods 0.000 description 1
• 239000010453 quartz Substances 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 239000007787 solid Substances 0.000 description 1
• 238000012360 testing method Methods 0.000 description 1
• 238000003466 welding Methods 0.000 description 1