JPS62122372U - - Google Patents
Info
- Publication number
- JPS62122372U JPS62122372U JP900286U JP900286U JPS62122372U JP S62122372 U JPS62122372 U JP S62122372U JP 900286 U JP900286 U JP 900286U JP 900286 U JP900286 U JP 900286U JP S62122372 U JPS62122372 U JP S62122372U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- integrated circuit
- circuit device
- resistor
- capacitors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 1
- 238000009966 trimming Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
第1図は本考案の印刷基板に部品を搭載した平
面図、第2図は本考案の特価回路の例を示す図、
第3図は従来の印刷基板に部品を搭載した平面図
である。
1,11……セラミツク基板、2,22……導
電体、3〜4,13〜14,18……抵抗体、5
,15……保護体、6,16……ミニモールドト
ランジスタ、7,17……リード端子、8……チ
ツプ型抵抗器。
Fig. 1 is a plan view of parts mounted on the printed circuit board of the present invention, Fig. 2 is a diagram showing an example of the special price circuit of the present invention,
FIG. 3 is a plan view of a conventional printed circuit board with components mounted thereon. 1, 11... Ceramic substrate, 2, 22... Conductor, 3-4, 13-14, 18... Resistor, 5
, 15... Protector, 6, 16... Mini mold transistor, 7, 17... Lead terminal, 8... Chip resistor.
Claims (1)
とが形成され、コンデンサー、トランジスタ等の
回路素子を構成してなる混成集積回路装置におい
てチツプ型抵抗器をフアンクシヨントリミング用
抵抗としたことを特徴とする混成集積回路装置。 A chip resistor is used as a function trimming resistor in a hybrid integrated circuit device in which conductors and resistors forming an electric circuit are formed on an insulating substrate, and circuit elements such as capacitors and transistors are formed. Features of hybrid integrated circuit device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP900286U JPS62122372U (en) | 1986-01-24 | 1986-01-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP900286U JPS62122372U (en) | 1986-01-24 | 1986-01-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62122372U true JPS62122372U (en) | 1987-08-03 |
Family
ID=30793904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP900286U Pending JPS62122372U (en) | 1986-01-24 | 1986-01-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62122372U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01119047A (en) * | 1987-10-30 | 1989-05-11 | Nec Corp | Integrated circuit device |
-
1986
- 1986-01-24 JP JP900286U patent/JPS62122372U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01119047A (en) * | 1987-10-30 | 1989-05-11 | Nec Corp | Integrated circuit device |
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