JPS62122357U - - Google Patents

Info

Publication number
JPS62122357U
JPS62122357U JP1986009024U JP902486U JPS62122357U JP S62122357 U JPS62122357 U JP S62122357U JP 1986009024 U JP1986009024 U JP 1986009024U JP 902486 U JP902486 U JP 902486U JP S62122357 U JPS62122357 U JP S62122357U
Authority
JP
Japan
Prior art keywords
lead
bonding
wiring
ground side
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986009024U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986009024U priority Critical patent/JPS62122357U/ja
Publication of JPS62122357U publication Critical patent/JPS62122357U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5445Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/547Dispositions of multiple bond wires
    • H10W72/5473Dispositions of multiple bond wires multiple bond wires connected to a common bond pad

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1986009024U 1986-01-24 1986-01-24 Pending JPS62122357U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986009024U JPS62122357U (enExample) 1986-01-24 1986-01-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986009024U JPS62122357U (enExample) 1986-01-24 1986-01-24

Publications (1)

Publication Number Publication Date
JPS62122357U true JPS62122357U (enExample) 1987-08-03

Family

ID=30793948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986009024U Pending JPS62122357U (enExample) 1986-01-24 1986-01-24

Country Status (1)

Country Link
JP (1) JPS62122357U (enExample)

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