JPS62122192A - Flexible circuit board - Google Patents

Flexible circuit board

Info

Publication number
JPS62122192A
JPS62122192A JP26164885A JP26164885A JPS62122192A JP S62122192 A JPS62122192 A JP S62122192A JP 26164885 A JP26164885 A JP 26164885A JP 26164885 A JP26164885 A JP 26164885A JP S62122192 A JPS62122192 A JP S62122192A
Authority
JP
Japan
Prior art keywords
copper foil
light transmittance
circuit board
flexible circuit
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26164885A
Other languages
Japanese (ja)
Inventor
吉次 栄口
勝 宮下
均 新井
大串 芳美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP26164885A priority Critical patent/JPS62122192A/en
Priority to US06/928,396 priority patent/US4806432A/en
Priority to DE8686402584T priority patent/DE3677714D1/en
Priority to EP19860402584 priority patent/EP0223716B1/en
Publication of JPS62122192A publication Critical patent/JPS62122192A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はフレキシブル回路板に関するものである。近年
情報機器の発達に伴い、人力の容易化のため、ディスプ
レイ1−から直接ペンや指頭で人力するモ面ディスプレ
イ方式が注1−15れ、これに用いる透明4市フィルム
が種々検11・1されている。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to flexible circuit boards. In recent years, with the development of information devices, in order to facilitate human labor, a screen display system in which manual input is performed directly from the display 1-1 using a pen or fingertip has been introduced. has been done.

未発1!11は透明導゛市フィルムの1種としてフレキ
シブル回路板を提供しようとするものである。
Unpublished 1!11 is intended to provide a flexible circuit board as a type of transparent conductive film.

(従来の技術と問題点) フレキシブル銅張り積層板は、汀通ポリエチレンテレフ
タレート(PET)、ポリイミド等のプラスチックフィ
ルムを基材として、これに銅箔が接ノ1剤で積層された
構成である。
(Prior Art and Problems) A flexible copper-clad laminate has a base material made of a plastic film such as Tingtong polyethylene terephthalate (PET) or polyimide, on which copper foil is laminated using an adhesive.

−gに銅箔としては゛市解銅箔またはロール圧延法によ
る圧延銅箔が使用される。゛市解銅箔を使用した場合に
はその表面がモ滑でないため接着性に問題ないので、粗
面化せずそのまま用いられているが、これに印刷回路を
形成した場合には透明性が悪く、上行光線透過率が40
%以ドしか11られないという問題点があった。
As the copper foil for g, a commercial copper foil or a rolled copper foil by a roll rolling method is used.゛When using copper foil, the surface is not smooth, so there is no problem with adhesion, so it is used as is without roughening it, but when a printed circuit is formed on it, it becomes transparent. Bad, ascending light transmittance is 40
There was a problem that only numbers less than % could be added.

一力、圧延銅箔は表面が中滑であるため表面を相面化加
−Iニせずそのままを4J一層板として用いた場合には
接着性が悪いので実用化されておらず、接71性をよく
するために通常この表面を粗面化加圧(粗面IBto以
1ニ)シたものが用いられている。
First, rolled copper foil has a medium-smooth surface, so if the surface is used as a 4J single-layer board without phasing, it has poor adhesion and has not been put into practical use. In order to improve the properties, a material whose surface has been roughened and pressed (rough surface IBto or more) is usually used.

しかしながらこのような銅張り積層板は表面を相面加工
した銅箔を使用しているので、これをエツチングによっ
て銅を取り除くと接着剤面がすりガラス状の半透明とし
て表われ、フィルム基材の平行光線透過率は20%以下
となる。これは銅箔の粗面度が高いので、この粗面がそ
のまま転写された状態になるという理由によるものと考
えられる。
However, since such copper-clad laminates use copper foil whose surface has been treated with a double-sided surface, when the copper is removed by etching, the adhesive surface appears as a frosted glass-like translucent surface, and the parallel of the film base material The light transmittance is 20% or less. This is thought to be due to the fact that the copper foil has a high degree of roughness, so this rough surface is transferred as is.

ヒ記したとおり従来の銅張り積層板は印刷回路を形成さ
せたとき平行光線透過率がよくないという問題点があっ
た。
As mentioned above, conventional copper-clad laminates had the problem of poor parallel light transmittance when printed circuits were formed.

(発明の構成) 本発明は、このような問題点を解決できる透明性に優れ
たフレキシブル回路板を提供するものであって、その要
旨とすることろは、透明性のフィルム基材に、接着剤を
介して、表面粗度が5〜5の範囲内にある圧延銅箔の印
刷回路が積層一体化されてなり一彼印刷回路面積が全面
積の30%以下であり、かつ平行光線透過率が50%以
上、全モ行光線透過率が70%以上であることを特徴と
するフレキシブル回路板にある。
(Structure of the Invention) The present invention provides a highly transparent flexible circuit board that can solve these problems. A printed circuit made of rolled copper foil with a surface roughness in the range of 5 to 5 is laminated and integrated through the agent, and the printed circuit area is 30% or less of the total area, and the parallel light transmittance is is 50% or more, and the total beam transmittance is 70% or more.

以ドこれについて詳しく説明すると、末完1jはi’i
(視光線透過率が85%以−にでフレキシブル回路板と
してト分なフレキシブル特性をもつプラスチックフィル
ムを基材とし、これに接着剤を介して表面粗度(真の表
面積を見掛けの幾何学的面積で割ったイ直)がが5〜5
好ましくはが5〜3の範囲の圧延銅箔を積層一体化する
ものであって、前記プラスチックフィルムは、ポリカー
ポーネート、ポリエーテルエーテルケトン、ポリエーテ
ルスルホン、ポリエチレンテレフタレートCPET)等
であって無色透明のものが用いられ、このなかでもPE
Tフィルムが優れている。
To explain this in detail, final perfect 1j is i'i
(A plastic film with visual light transmittance of 85% or more and sufficient flexibility as a flexible circuit board is used as a base material, and surface roughness (the true surface area Divided by area) is 5 to 5
Preferably, rolled copper foils having a diameter of 5 to 3 are laminated and integrated, and the plastic film is made of polycarbonate, polyether ether ketone, polyether sulfone, polyethylene terephthalate (CPET), etc., and is colorless and transparent. Among these, PE
T film is superior.

[−述のフィルム基材はそのまま使用できるが、あらか
じめ%、機ガス中で低温プラズマ処理して、その表面を
活性化するのが望ましい、これにより圧延銅箔との強固
な接着が得られる。
[-Although the film base material described above can be used as it is, it is preferable to activate its surface by subjecting it to low-temperature plasma treatment in advance in machine gas.This will provide strong adhesion to the rolled copper foil.

この場合の処理は、減圧可能な低温プラズマ発生型を内
にフィルムを保持し、 o、ot −t o トルの低
圧下に無機ガスを通気しながら電極間に、例えば10K
Hz −100MHz)高J4波電力を印加することに
よって行われる。放電周波数帯としては前記高周波のほ
かに低周波、マイクロ波、さらには直流なども用いるこ
とができる。
In this case, the film is held in a low-temperature plasma generation type that can be depressurized, and the film is heated between the electrodes at a temperature of, for example, 10 K while passing an inorganic gas under a low pressure of o, ot - to torr.
Hz - 100 MHz) by applying high J4 wave power. As the discharge frequency band, in addition to the above-mentioned high frequency, low frequency, microwave, and even direct current can be used.

フィルム基材透明度はこの処理によって影響されず、処
理前と同じ光線透過率である。
The film substrate transparency is not affected by this treatment and has the same light transmittance as before treatment.

圧延銅箔の表面粗度が5以上ではフィルムの透明性が失
なわれ、が5以下は製箔が困難となる。
If the surface roughness of the rolled copper foil is 5 or more, the transparency of the film will be lost, and if it is less than 5, it will be difficult to form the foil.

接着剤としては無色透明で熱硬化性のものが必要であり
1例えば熱硬化性アクリル樹脂、熱硬化性ポリエステル
樹脂等が適当である。
The adhesive must be colorless, transparent, and thermosetting; for example, thermosetting acrylic resin, thermosetting polyester resin, etc. are suitable.

本発明のフレキシブル回路板はフィルム基材面に、接着
剤を塗布乾燥した後、これに圧延銅箔を積層し、加熱ロ
ールで圧着一体化して得たフレキシブル銅張り基板がベ
ースであって、この銅箔上にホトレジスト法、スクリー
ン印刷法によって印刷回路を形成したものである。なお
1本発明のフレキシブル回路板はあらかじめ低温プラズ
マ処理したフィルムを用いるのが好ましい。
The flexible circuit board of the present invention is based on a flexible copper-clad board obtained by applying an adhesive to a film base material surface, drying it, laminating a rolled copper foil thereon, and integrating the rolled copper foil by pressing with a heating roll. A printed circuit is formed on copper foil using a photoresist method or a screen printing method. Note that the flexible circuit board of the present invention preferably uses a film that has been subjected to low-temperature plasma treatment in advance.

本発明の目的を達成するには、印刷回路の銅面積が全面
積の30%以下であり、かつ平行光線透過率が50%以
l−1全光線透過率が70%以上あることが必要である
0本発明のフレキシブル回路板をディスプレイ等に応用
した場合には、線幅が大きいと透明性が損われるので、
高い光線透過率を確保するために線間隙は銅の線幅の2
倍以上であることが好ましい、また線間隙は1000g
m以ドが好ましい。
In order to achieve the purpose of the present invention, it is necessary that the copper area of the printed circuit is 30% or less of the total area, and that the parallel light transmittance is 50% or more and the l-1 total light transmittance is 70% or more. When the flexible circuit board of the present invention is applied to a display etc., transparency will be impaired if the line width is large.
To ensure high light transmittance, the line gap is 2 times the copper line width.
It is preferable that it is twice or more, and the line gap is 1000g
m or less is preferable.

以下本発明の実施例をあげる。Examples of the present invention will be given below.

実施例 厚さ100gmのPETフィルム(東し製ルミラーT)
に、ポリエステル系の熱硬化型接着剤を乾燥時で15g
mになるような厚さに塗布乾燥した後120℃の加熱ロ
ールで35ルm厚の圧延銅箔(表面粗度3)を連続的に
ラミネートしながら巻取り、銅箔−ポリエステル積層フ
ィルムを製造した。
Example PET film with a thickness of 100 gm (Lumirror T manufactured by Toshi)
15g of polyester thermosetting adhesive when dry
After coating and drying to a thickness of 1.5 m, a 35 m thick rolled copper foil (surface roughness 3) was continuously laminated and rolled up using a heated roll at 120°C to produce a copper foil-polyester laminated film. did.

この積層フィルムLに常法によって回路を印刷し、エン
チングすることによって、線幅50ルm、!a間隔50
0 pmの回路を形成しく銅回路面積17%)その透明
性を測定した。その結果は次のとおりであった。
By printing a circuit on this laminated film L using a conventional method and etching it, a line width of 50 lm was achieved! a interval 50
A copper circuit area of 17% was formed to form a circuit of 0 pm and its transparency was measured. The results were as follows.

全光線透過率85%、平行光線透過率65%比較例 実施例における圧延銅箔の代りに、18pm厚の電解銅
箔(表面相度約10)を用いたほかは実施例と同様に行
って銅箔−ポリエステル積層フィルムを得た。この積層
フィルムの銅箔上に回路を印刷し、エツチングによって
線幅50pm、線間隙500pmの回路(銅回路面a1
7%)を形成した。このものの透過性を測定したところ
、全光線透過率は約85%、平行光線涛過率は40%で
あった。
Total light transmittance 85%, parallel light transmittance 65% Comparative Example The procedure was carried out in the same manner as in the example except that an 18 pm thick electrolytic copper foil (surface phase degree of about 10) was used instead of the rolled copper foil in the example. A copper foil-polyester laminate film was obtained. A circuit is printed on the copper foil of this laminated film, and etched to form a circuit with a line width of 50 pm and a line gap of 500 pm (copper circuit surface a1
7%). When the transmittance of this material was measured, the total light transmittance was about 85% and the parallel light transmission rate was 40%.

Claims (1)

【特許請求の範囲】 1、透明性フィルム基材に、接着剤を介して表面粗度1
.5〜5の範囲内にある圧延銅箔の印刷回路が積層一体
化されてなり、該印刷回路面積が全面積の30%以下で
あり、かつ平行光線透過率が50%以上、全光線透過率
が70%以上であることを特徴とするフレキシブル回路
板。 2、印刷回路の銅線幅が100μm以下、線間隔が10
00μm以下である特許請求の範囲第1項記載のフレキ
シブル回路板。
[Claims] 1. A surface roughness of 1 is applied to a transparent film base material via an adhesive.
.. Printed circuits of rolled copper foil within the range of 5 to 5 are laminated and integrated, the printed circuit area is 30% or less of the total area, and the parallel light transmittance is 50% or more, and the total light transmittance 70% or more. 2. The copper line width of the printed circuit is 100 μm or less, and the line spacing is 10
The flexible circuit board according to claim 1, which has a thickness of 00 μm or less.
JP26164885A 1985-11-21 1985-11-21 Flexible circuit board Pending JPS62122192A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP26164885A JPS62122192A (en) 1985-11-21 1985-11-21 Flexible circuit board
US06/928,396 US4806432A (en) 1985-11-21 1986-11-10 Copper-foiled laminated sheet for flexible printed circuit board
DE8686402584T DE3677714D1 (en) 1985-11-21 1986-11-20 PLATE LAMINATED WITH COPPER FOR FLEXIBLE PRINTED CIRCUIT BOARD.
EP19860402584 EP0223716B1 (en) 1985-11-21 1986-11-20 A copper-foiled laminated sheet for flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26164885A JPS62122192A (en) 1985-11-21 1985-11-21 Flexible circuit board

Publications (1)

Publication Number Publication Date
JPS62122192A true JPS62122192A (en) 1987-06-03

Family

ID=17364821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26164885A Pending JPS62122192A (en) 1985-11-21 1985-11-21 Flexible circuit board

Country Status (1)

Country Link
JP (1) JPS62122192A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59205791A (en) * 1983-05-09 1984-11-21 住友電気工業株式会社 Transparent printed circuit board
JPS59218789A (en) * 1983-05-06 1984-12-10 信越化学工業株式会社 Flexible printed circuit board and method of producing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59218789A (en) * 1983-05-06 1984-12-10 信越化学工業株式会社 Flexible printed circuit board and method of producing same
JPS59205791A (en) * 1983-05-09 1984-11-21 住友電気工業株式会社 Transparent printed circuit board

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