JPS62120496A - Production of enameled substrate - Google Patents

Production of enameled substrate

Info

Publication number
JPS62120496A
JPS62120496A JP26090285A JP26090285A JPS62120496A JP S62120496 A JPS62120496 A JP S62120496A JP 26090285 A JP26090285 A JP 26090285A JP 26090285 A JP26090285 A JP 26090285A JP S62120496 A JPS62120496 A JP S62120496A
Authority
JP
Japan
Prior art keywords
electrodeposition
glaze
polymer
electrodeposited
fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26090285A
Other languages
Japanese (ja)
Other versions
JPH0635679B2 (en
Inventor
Koichi Tsuyama
津山 宏一
Hajime Nakayama
肇 中山
Toshiro Okamura
岡村 寿郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP60260902A priority Critical patent/JPH0635679B2/en
Publication of JPS62120496A publication Critical patent/JPS62120496A/en
Publication of JPH0635679B2 publication Critical patent/JPH0635679B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To prevent the occurrence of defects such as cracking when fine glaze powder is electrodeposited on a metallic core and baked to produce an enameled substrate, by dissolving a specified polymer in a liq. for electrodeposition so as to strengthen the film of the electrodeposited fine glaze powder. CONSTITUTION:When fine glaze powder is electrodeposited on a metallic core for an enameled substrate and baked to produce an enameled substrate, a liq. for electrodeposition is prepd. by adding 300-400g/l fine powder of crystallizable glaze and about 0.2-50g/l nonionic polymer having vinyl acetal groups, vinyl acetate groups or alcohol groups to an alcoholic org. solvent such as ethanol. The polymer has >=200mol.wt. and compatibility with the org. solvent. The polymer is added so as to regulate the viscosity of the liq. for electrodeposition to <=20cps. The polymer acts as cushion and adhesive in the film of the electrodeposited fine glaze powder, so the strength of the film is improved and the occurrence of defects such as cracking can be prevented.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、はうろう基板の製造法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for manufacturing a crawling substrate.

(従来の技術) はうろう基板の製造法としては、塗膜の厚さを一定にし
やすく、またつきまわりが良いこと等からxi法を用い
らnることが多い。従来、電着液は、水と釉薬微粉と電
荷付与の之めの物質例えば、ポリアクリル酸系の塩等と
、粘U14整の次めの有機物や、とまり性向上の友めの
粘土質などからなっていた。しかし、最近、はうろう基
板の性能向上のために、ボイドの原因となる電荷付与の
ための物質などを含まずに電着しうる有機溶剤系電着及
び七〇に使用しうる釉薬の検討がなさrしている。まt
、釉薬としては、従来非晶質系釉薬では解決できたかつ
之基板端部での釉薬層の盛り上りやスルホール内の柚楽
のつきまわI)全解決しうる釉薬として、&沙製造時の
焼成において結晶化する釉薬も開発さiしている。
(Prior Art) The xi method is often used as a method for producing a floating substrate because it is easy to keep the thickness of the coating film constant and has good throwing power. Conventionally, the electrodeposition solution consists of water, glaze fine powder, a substance for imparting a charge, such as a polyacrylic acid salt, an organic substance that has a viscosity of U14, and a clay material that improves binding properties. It consisted of However, recently, in order to improve the performance of floating substrates, studies have been conducted on organic solvent-based electrodeposition and glazes that can be used for electrodeposition without containing charge-imparting substances that cause voids. I'm bored. Yes
As a glaze, it is a glaze that can solve all the problems that could be solved with conventional amorphous glazes, such as the swelling of the glaze layer at the edge of the substrate and the swirling of yuzu in the through holes. We are also developing a glaze that crystallizes during firing.

(発明が解決しようとする問題点) 有機溶媒を用い之1!着法による場合も、有機溶媒ケ含
むN、s液で、釉薬微粉を電★塗布し次金属芯全、乾燥
後、焼成することにLりほうろう基板は製造さnる。電
着後から焼成までの闇、金属芯についている釉薬微粉層
は、比較的もろく、製造時に相当な注意全仏う必要があ
る。!念、有機溶剤が蒸発揮散する時、′IILM後の
金属芯より蒸発a熱金奪うため、金属芯の温度が低下し
、気中の湿度により結縛が起こることがある。この場合
には、焼成前には外観上何ら変化がないが、焼成後筋状
に塗膜の切rシ+ような部分(ひけ)ができる。本発明
は、上記の問題点全解決するほうろう基板の製造法を提
供するものである。
(Problems to be solved by the invention) Using an organic solvent No. 1! Even in the case of the deposition method, the L-enameled substrate is manufactured by electrocoating fine glaze powder with N and S liquids containing organic solvents, drying the entire metal core, and then firing. During the process from electrodeposition to firing, the glaze fine powder layer on the metal core is relatively fragile, and great care must be taken during manufacturing. ! Note that when the organic solvent evaporates and evaporates, the evaporated hot metal is taken away from the metal core after IILM, so the temperature of the metal core decreases and binding may occur due to the humidity in the air. In this case, there is no change in appearance before firing, but after firing, streak-like cuts (sink marks) appear in the coating film. The present invention provides a method for manufacturing an enamel substrate that solves all of the above problems.

(問題点を解決するための手段) 本発明は電着後の釉薬微粉からなる塗膜の強化の方法と
して、電7#液中に、電着液に用いらγしている有機溶
^11と用浴件のある非イオン性高分子物質を溶解する
方法が効果があること金見い出したことに↓りなさ7し
たものである。電着液中の釉薬微粉の含有日としては、
500g〜400 g/l程朋が好ましいが、特に制限
はない。有機溶剤としては、単独浴剤でも混合浴剤でも
良いが、電着の容易性からその過半が炭素数8以下のア
ルコール系溶剤(代表的なものとしてエチルアルコール
、イソプロビルアルコール、ブチルアルコール等〕であ
ることが宅ましい。混合する高分子物質の、空気中での
熱分解温度は、たかだか600℃程度であり、より望ま
しくは500℃以下である。又、′電着(夜中に入nる
高分子物質の目は、電M液作成に使用する有機溶剤へ高
分子物質全混合し念時の粘度が、20センチボイズ以下
であることが望ましい。
(Means for Solving the Problems) The present invention provides a method for strengthening a coating film made of fine powder of glaze after electrodeposition, in which an organic solvent used in the electrodeposition solution is added to the electrodeposition solution. I was thrilled to discover that a method for dissolving non-ionic polymeric substances, which are commonly used in baths, is effective. The date of inclusion of fine glaze powder in the electrodeposition solution is as follows:
The amount is preferably about 500 g/l to 400 g/l, but there is no particular restriction. The organic solvent may be a single bath agent or a mixed bath agent, but from the viewpoint of ease of electrodeposition, the majority is an alcohol solvent with a carbon number of 8 or less (typical examples include ethyl alcohol, isopropyl alcohol, butyl alcohol, etc.) The thermal decomposition temperature of the polymer substance to be mixed in air is approximately 600°C at most, and more preferably 500°C or less. It is desirable that the viscosity of the polymeric material used should be 20 centivoise or less when the polymeric material is completely mixed into the organic solvent used to prepare the electromagnetic liquid.

この量よりも混合量が多いと電着がさγLにくくなる1
頃向が出てくるが、全く不可能というわけではない。高
分子物質を混合した効果が実際にあられγしるのは、C
L2g/βからであり、最大量としては50 g/Aで
ある。こnを超えて混合した場合には、はうろう基板製
造時の焼成で、充分に高分子物質がガス化して抜けきら
ない念めかボイドの発生する傾向が強くなり、はうろう
基板としての使用に通さなくなる。使用する高分子がイ
オン化するものを使用する場合は、そのイオンを用いて
カチオン型やアニオン型の電着も可能であるが本発明の
主旨であるほうろう釉薬の電荷を用いて電着を行ないそ
の塗膜を強化するtめに高分子物質を使用するという方
法に適していない。又、相溶性のない高分子物質を用い
た場合には、電着液が均一とならない念めに、かえって
障害となる。本発明を、結晶化釉薬に適用した場合、特
に効果が太きい。すなわち非晶質釉薬の場合では、電着
後の小さな欠陥は、その後の焼成により流動する定め、
そn程問題とならないことが多いが、結晶化釉薬の場合
、焼成時に急速に結晶化する友め、充分に欠陥が修復す
ることなく固化してしまう。そこで、’flJ着後、焼
成までの間に、金属芯に付着しt釉薬微粉の塗膜にでき
るかけやひび割nは小さなものでも致命的欠陥となりて
しまう。
If the mixing amount is larger than this amount, electrodeposition becomes difficult to increase γL1
It's not impossible at all, although it's possible that it might be difficult to do so. The effect of mixing polymeric substances is actually seen in C
from L2g/β, with a maximum amount of 50 g/A. If the mixture exceeds this n, there is a strong tendency for voids to occur, probably because the polymer substance is not fully gasified and released during firing during the manufacturing of the floating substrate. It becomes unusable. When using a polymer that ionizes, it is possible to perform cationic or anionic electrodeposition using the ions, but the purpose of the present invention is to perform electrodeposition using the electric charge of the enamel glaze. It is not suitable for methods that use polymeric substances to strengthen the coating film. Furthermore, if incompatible polymeric substances are used, the electrodeposited solution may not be uniform, which may be a hindrance. The present invention is particularly effective when applied to crystallized glazes. In other words, in the case of amorphous glazes, small defects after electrodeposition tend to flow during subsequent firing.
Although this is not often a problem, in the case of crystallized glazes, the defects quickly crystallize during firing and solidify without sufficiently repairing defects. Therefore, even small chips or cracks that adhere to the metal core and form in the coating film of the fine glaze powder after the flJ is applied and before firing become fatal defects.

本発明によγLは、電着後の本編強度全強化できそのよ
うな欠陥全はとんど完全になくすこともできる。実際に
使用する高分子物質としては分子量が200以上であり
ビニルアセタール基(世Jえばビニルホルマール基やビ
ニルブチラール基等)、酢酸ビニル基、アルコール基(
例えば、ビニルアルコール基、グリコール等)を含むも
のが通している。なお、本発明は、高分子物質を電着液
に溶屏する点にあり、特性向上のために、他の物質、例
えば、粘土質やフィラー成分として、5j02.  Z
rO2,5iZr04゜Altos などを電着液中に
混合することは司能である。
According to the present invention, γL can completely strengthen the main body strength after electrodeposition, and all such defects can be almost completely eliminated. The polymer substances actually used have a molecular weight of 200 or more, and include vinyl acetal groups (such as vinyl formal and vinyl butyral groups), vinyl acetate groups, and alcohol groups (
For example, those containing vinyl alcohol groups, glycol, etc. are allowed. The present invention is to dissolve a polymeric substance in the electrodeposition solution, and in order to improve the properties, other substances such as clay or filler components may be added to 5j02. Z
It is convenient to mix rO2,5iZr04°Altos, etc. into the electrodeposition solution.

(作用) 電着後の塗膜は、釉薬粒子が密につまり、ある程度の固
さを持りているが、単に粒子どうしのひっかかり合いで
強度を保っているため、わずかの振動や有機溶剤が蒸発
揮散する時の温度低下によるわずかな結露水の影響など
によりても粒子のずrしが発生し、ひび割1しなどの原
因となる。本発明は、電着液に高分子物質全溶解させる
ことにより電着後の塗膜粒子間に高分子物質が入シこみ
、クッション材的役割と接着剤的役割を持たせ、従来の
塗膜の脆さに起因する欠陥の発生を解決し念ものである
(Function) The coating film after electrodeposition is densely packed with glaze particles and has a certain degree of hardness, but since it maintains its strength simply by the particles catching on each other, even slight vibrations and organic solvents will not affect it. Even the influence of a slight amount of condensed water due to a drop in temperature during evaporation and transpiration can cause particles to shift, causing cracks and the like. In the present invention, by completely dissolving the polymeric substance in the electrodeposition liquid, the polymeric substance is infiltrated between the particles of the coating film after electrodeposition, and has the role of a cushioning material and an adhesive. This is intended to solve the problem of defects caused by the fragility of the steel.

(実施例) 釉薬成分が、酸化物表示で5iOz+ B2031Sr
O,MgO,BaOからなる結晶化釉薬微粉4aQgと
、中重合度(平均重合度500〜1QOO)のブチラー
ル樹脂5gとイソプロピルアルコール11と全混合しt
電着液中で500V印加し、スルーホールのある鉄芯に
電着全行なった。このものを120℃15分乾燥し、t
8しなかった鉄芯露出部に衝撃を与え九後焼成を行なり
友が、製品に何ら欠陥は生じなかった。
(Example) Glaze component is 5iOz+ B2031Sr in oxide representation
4aQg of crystallized glaze fine powder consisting of O, MgO, and BaO, 5g of butyral resin with a medium degree of polymerization (average degree of polymerization 500 to 1QOO), and isopropyl alcohol 11 were completely mixed.
A voltage of 500 V was applied in an electrodeposition solution, and all electrodeposition was performed on an iron core with a through hole. Dry this at 120°C for 15 minutes,
After applying an impact to the exposed part of the iron core that had not been heated, the product was fired, and no defects were found in the product.

一方、上記配合中、ブチラール樹脂を入社なかったもの
では、電着後の塗膜に外観上何の変化もも之らさない程
度の小さな衝撃を与えたものでも、焼成すると、筋状に
塗膜が4〈なり内部の鉄芯が露出していた。
On the other hand, if butyral resin is not included in the above formulation, even if a small impact is applied to the electrodeposited coating without causing any change in appearance, the coating will form streaks after baking. The membrane was 4〈 and the internal iron core was exposed.

(発明の効果) 有機溶剤を用い念はうろう釉薬の電着において、その塗
膜のもろさの定めに、製造時の取り扱いや環境が制限さ
γしていたが、本発明にニジ電着後の状態でも充分にm
膜強度があり、取り扱い方や環境による製品塗膜の欠陥
が大巾に抑えらrしる。
(Effects of the invention) In the electrodeposition of glazes using organic solvents, handling and environment during production were limited due to the brittleness of the coating film, but the present invention has been developed to improve m is sufficient even in the state of
The film is strong, and defects in the product coating due to handling or environment are largely suppressed.

・−ノ′・−ノ′

Claims (1)

【特許請求の範囲】 1、金属芯に電着法で、ほうろう釉薬微粉を付着させそ
の後焼成する工程を含むほうろう基板の製造法において
、電着液が有機溶剤とほうろう釉薬微粉と0.2〜50
g/lの該有機溶剤と相溶性のある非イオン性高分子物
質とを含むものであることを特徴とするほうろう基板の
製造法。 2、有機溶剤の過半がアルコール系溶剤である特許請求
範囲第1項記載のほうろう基板の製造法。 3、ほうろう釉薬が、結晶化釉薬である特許請求範囲第
1項又は第2項記載のほうろう基板の製造法。 4、非イオン性の高分子物質が、ビニルアセタール基、
酢酸ビニル基、アルコール基のいずれかを含み分子量が
200以上である高分子物質である特許請求範囲第1項
、第2項又は第3項記載のほうろう基板の製造法。
[Claims] 1. A method for manufacturing an enamel substrate, which includes a step of depositing fine powder of enamel glaze on a metal core by electrodeposition and then firing, wherein the electrodeposition liquid contains an organic solvent and fine powder of enamel glaze of 0.2 to 0.2%. 50
A method for producing an enamel substrate, characterized in that it contains a nonionic polymeric substance that is compatible with the organic solvent in an amount of g/l. 2. The method for manufacturing an enamel substrate according to claim 1, wherein the majority of the organic solvent is an alcohol solvent. 3. The method for producing an enamel substrate according to claim 1 or 2, wherein the enamel glaze is a crystallized glaze. 4. The nonionic polymer substance has a vinyl acetal group,
The method for producing an enamel substrate according to claim 1, 2 or 3, which is a polymeric substance containing either a vinyl acetate group or an alcohol group and having a molecular weight of 200 or more.
JP60260902A 1985-11-20 1985-11-20 Enamel board manufacturing method Expired - Lifetime JPH0635679B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60260902A JPH0635679B2 (en) 1985-11-20 1985-11-20 Enamel board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60260902A JPH0635679B2 (en) 1985-11-20 1985-11-20 Enamel board manufacturing method

Publications (2)

Publication Number Publication Date
JPS62120496A true JPS62120496A (en) 1987-06-01
JPH0635679B2 JPH0635679B2 (en) 1994-05-11

Family

ID=17354343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60260902A Expired - Lifetime JPH0635679B2 (en) 1985-11-20 1985-11-20 Enamel board manufacturing method

Country Status (1)

Country Link
JP (1) JPH0635679B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0466762U (en) * 1990-10-19 1992-06-12
CN111792845A (en) * 2020-07-08 2020-10-20 佛山市东鹏陶瓷有限公司 Preparation method of glazed tile
CN111807701A (en) * 2020-07-08 2020-10-23 佛山市东鹏陶瓷有限公司 Preparation method of high-strength ceramic glazed tile and prepared high-strength ceramic glazed tile

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54129023A (en) * 1978-03-30 1979-10-06 Shinto Paint Co Ltd Electrodeposition coating composition for enamel
JPS58181897A (en) * 1982-04-15 1983-10-24 Toshiba Corp Preparation of enamel base plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54129023A (en) * 1978-03-30 1979-10-06 Shinto Paint Co Ltd Electrodeposition coating composition for enamel
JPS58181897A (en) * 1982-04-15 1983-10-24 Toshiba Corp Preparation of enamel base plate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0466762U (en) * 1990-10-19 1992-06-12
CN111792845A (en) * 2020-07-08 2020-10-20 佛山市东鹏陶瓷有限公司 Preparation method of glazed tile
CN111807701A (en) * 2020-07-08 2020-10-23 佛山市东鹏陶瓷有限公司 Preparation method of high-strength ceramic glazed tile and prepared high-strength ceramic glazed tile
CN111807701B (en) * 2020-07-08 2021-11-02 佛山市东鹏陶瓷有限公司 Preparation method of high-strength ceramic glazed tile and prepared high-strength ceramic glazed tile

Also Published As

Publication number Publication date
JPH0635679B2 (en) 1994-05-11

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