JPH0635679B2 - Enamel board manufacturing method - Google Patents
Enamel board manufacturing methodInfo
- Publication number
- JPH0635679B2 JPH0635679B2 JP60260902A JP26090285A JPH0635679B2 JP H0635679 B2 JPH0635679 B2 JP H0635679B2 JP 60260902 A JP60260902 A JP 60260902A JP 26090285 A JP26090285 A JP 26090285A JP H0635679 B2 JPH0635679 B2 JP H0635679B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodeposition
- glaze
- coating film
- organic solvent
- enamel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Glass Compositions (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、ほうろう基板の製造法に関する。The present invention relates to a method for manufacturing an enamel substrate.
（従来の技術） ほうろう基板の製造法としては、塗膜の厚さを一定にし
やすく、またつきまわりが良いこと等から電着法を用い
られることが多い。従来、電着液は、水と釉薬微粉と電
荷付与のための物質例えば、ポリアクリル酸系の塩等
と、粘度調整のための有機物や、とまり性向上のための
粘土質などからなっていた。しかし、最近、ほうろう基
板の性能向上のために、ボイドの原因となる電荷付与の
ための物質などを含まずに電着しうる有機溶剤系電着及
びそれに使用しうる釉薬の検討がなされている。また、
釉薬としては、従来非晶質系釉薬では解決できなかった
基板端部での釉薬層の盛り上りやスルホール内の釉薬の
つきまわりを解決しうる釉薬として、基板製造時の焼成
において結晶化する釉薬も開発されている。(Prior Art) As a method for manufacturing an enamel substrate, an electrodeposition method is often used because it is easy to keep the thickness of the coating film constant and has good throwing power. Conventionally, the electrodeposition liquid has been composed of water, a fine powder of glaze and a substance for imparting an electric charge, for example, a polyacrylic acid-based salt and the like, an organic substance for viscosity adjustment, and a clay substance for improving the stopping property. . However, recently, in order to improve the performance of the enamel substrate, an organic solvent-based electrodeposition that can be electrodeposited without including a substance for imparting electric charges that causes voids and a glaze that can be used therefor have been studied. . Also,
As a glaze, a glaze that crystallizes during firing during substrate production as a glaze that can solve the rise of the glaze layer at the edge of the substrate and the spread of the glaze in the through holes, which could not be solved by conventional amorphous glazes. Is also being developed.
（発明が解決しようとする問題点） 有機溶剤を用いた電着法による場合も、有機溶媒を含む
電着液で、釉薬微粉を電着塗布した金属芯を、乾燥後、
焼成することによりほうろう基板は製造される。電着後
から焼成までの間、金属芯についている釉薬微粉層は、
比較的もろく、製造時に相当な注意を払う必要がある。
また、有機溶剤が蒸発揮散する時、電着後の金属芯より
蒸発潜熱を奪うため、金属芯の温度が低下し、気中の湿
度により結露が起こることがある。この場合には、焼成
前には外観上何ら変化がないが、焼成後筋状に塗膜の切
れたような部分（ひけ）ができる。本発明は、上記の問
題点を解決するほうろう基板の製造法を提供するもので
ある。(Problems to be solved by the invention) Even in the case of the electrodeposition method using an organic solvent, the metal core coated with the glaze fine powder by electrodeposition with an electrodeposition solution containing an organic solvent is dried,
The enamel substrate is manufactured by firing. From the electrodeposition to the firing, the glaze fine powder layer attached to the metal core is
It is relatively brittle and requires considerable care during manufacture.
Further, when the organic solvent evaporates and diffuses, latent heat of vaporization is taken from the metal core after electrodeposition, so that the temperature of the metal core lowers, and dew condensation may occur due to humidity in the air. In this case, there is no change in appearance before firing, but streaky portions (sinks) of the coating film are formed after firing. The present invention provides a method for manufacturing an enamel substrate that solves the above problems.
（問題点を解決するための手段） 本発明は電着後の釉薬微粉からなる塗膜の強化の方法と
して、電着液中に、電着液に用いられている有機溶剤と
相溶性のある非イオン性高分子物質を溶解する方法が効
果があることを見い出したことによりなされたものであ
る。電着液中の釉薬微粉の含有量としては、３００ｇ〜
４００ｇ／ｌ程度が好ましいが、特に制限はない。有機
溶剤としては、単独溶剤でも混合溶剤でも良いが、電着
の容易性からその過半が炭素数８以下のアルコール系溶
剤（代表的なものとしてエチルアルコール、イソプロピ
ルアルコール、ブチルアルコール等）であることが望ま
しい。混合する高分子物質の、空気中での熱分解温度
は、たかだか６００℃程度であり、より望ましくは５０
０℃以下である。又、電着液中に入れる高分子物質の量
は、電着液作成に使用する有機溶剤へ高分子物質を混合
した時の粘度が、２０センチポイズ以下であることが望
ましい。この量よりも混合量が多いと電着がされにくく
なる傾向が出てくるが、全く不可能というわけではな
い。高分子物質を混合した効果が実際にあらわれるの
は、0.2ｇ／ｌからであり、最大量としては５０ｇ／ｌ
である。これを超えて混合した場合には、ほうろう基板
製造時の焼成で、充分に高分子物質がガス化して抜けき
らないためかボイドの発生する傾向が強くなり、ほうろ
う基板としての使用に適さなくなる。使用する高分子が
イオン化するものを使用する場合は、そのイオンを用い
てカチオン型やアニオン型の電着も可能であるが本発明
の主旨であるほうろう釉薬の電荷を用いて電着を行ない
その塗膜を強化するために高分子物質を使用するという
方法に適していない。又、相溶性のない高分子物質を用
いた場合には、電着液が均一とならないために、かえっ
て障害となる。本発明は、釉薬が結晶化釉薬の場合に、
効果が得られる。すなわち非晶質釉薬の場合では、電着
後の小さな欠陥は、その後の焼成により流動するため、
それ程問題とならないことが多いが、結晶化釉薬の場
合、焼成時に急速に結晶化するため、充分に欠陥が修復
することなく固化してしまう。そこで、電着後、焼成ま
での間に、金属芯に付着した釉薬微粉の塗膜にできるか
けやひび割れは小さなものでも致命的欠陥となってしま
う。(Means for Solving Problems) The present invention is, as a method for strengthening a coating film made of fine glaze powder after electrodeposition, compatible with an organic solvent used in the electrodeposition liquid in the electrodeposition liquid. It was made by discovering that a method of dissolving a nonionic polymer substance is effective. The content of the glaze fine powder in the electrodeposition liquid is 300 g to
About 400 g / l is preferable, but there is no particular limitation. The organic solvent may be a single solvent or a mixed solvent, but for ease of electrodeposition, a majority of them is an alcohol solvent having 8 or less carbon atoms (typically ethyl alcohol, isopropyl alcohol, butyl alcohol, etc.). Is desirable. The thermal decomposition temperature of the polymer substance to be mixed in air is at most about 600 ° C., more preferably 50 ° C.
It is 0 ° C or lower. The amount of the polymer substance to be added to the electrodeposition liquid is preferably such that the viscosity when the polymer substance is mixed with the organic solvent used for preparing the electrodeposition liquid is 20 centipoise or less. If the mixing amount is larger than this amount, there is a tendency that electrodeposition becomes difficult, but this is not entirely impossible. The actual effect of mixing polymer substances is from 0.2 g / l, and the maximum amount is 50 g / l.
Is. If the amount exceeds the above range, the polymer material is sufficiently gasified during firing during the production of the enamel substrate, so that voids tend to be generated, which makes it unsuitable for use as an enamel substrate. When the polymer used is an ionizable one, it is possible to use a cationic or anionic electrodeposition using the ions, but the electrodeposition is carried out using the electric charge of the enameled glaze which is the gist of the present invention. It is not suitable for the method of using a polymer material to strengthen the coating film. Further, when a polymer material having incompatibility is used, the electrodeposition liquid is not uniform, which is an obstacle. The present invention, when the glaze is a crystallized glaze,
The effect is obtained. That is, in the case of amorphous glaze, small defects after electrodeposition flow due to subsequent firing,
In many cases, this is not a serious problem, but in the case of a crystallization glaze, it crystallizes rapidly during firing, so that the defects are solidified without being sufficiently repaired. Therefore, even after a small amount of cracks or cracks formed on the coating film of the glaze fine powder adhered to the metal core after electrodeposition and before firing, even a small crack becomes a fatal defect.
本発明によれば、電着後の塗膜強度を強化できそのよう
な欠陥をほとんど完全になくすこともできる。実際に使
用する高分子物質としては分子量が２００以上でありビ
ニルアセタール基（例えばビニルホルマール基やビニル
ブチラール基等）、を含むものが適している。なお、本
発明は、高分子物質を電着液に溶解する点にあり、特性
向上のために、他の物質、例えば、粘土質やフィラー成
分として、SiO2，ZrO2，SiZrO4，Al2O3などを電着液中
に混合することは可能である。According to the present invention, the strength of the coating film after electrodeposition can be enhanced and such defects can be almost completely eliminated. As the polymer substance to be actually used, one having a molecular weight of 200 or more and containing a vinyl acetal group (for example, vinyl formal group, vinyl butyral group, etc.) is suitable. It should be noted that the present invention is in the point of dissolving a polymer substance in an electrodeposition liquid, and in order to improve the characteristics, other substances such as SiO 2 , ZrO 2 , SiZrO 4 , Al 2 as a clay component or a filler component are used. It is possible to mix O 3 and the like into the electrodeposition liquid.
（作用） 電着後の塗膜は、釉薬粒子が密につまり、ある程度の固
さを持っているが、単に粒子どうしのひっかかり合いで
強度を保っているため、わずかの振動や有機溶剤が蒸発
揮散する時の温度低下によるわずかな結露水の影響など
によっても粒子のずれが発生し、ひび割れなどの原因と
なる。本発明は、電着液に高分子物質を溶解させること
により電着後の塗膜粒子間に高分子物質が入りこみ、ク
ッション材的役割と接着剤的役割を持たせ、従来の塗膜
の脆さに起因する欠陥の発生を解決したものである。(Function) Although the glaze particles are densely packed in the coating film after electrodeposition and have a certain degree of hardness, the particles are simply caught in one another to maintain the strength, so slight vibrations and evaporation of organic solvents occur. Even if a small amount of dew condensation water is generated due to the temperature drop when volatilizing, the particles may be displaced, causing cracks. The present invention allows a polymeric substance to enter between coating film particles after electrodeposition by dissolving the polymeric substance in an electrodeposition liquid, thereby providing a cushioning material role and an adhesive function, thereby making the conventional coating film brittle. This is a solution to the occurrence of defects due to
（実施例） 釉薬成分が、酸化物表示でSiO2，B2O3，SrO，MgO，BaO
からなる結晶化釉薬微粉４００ｇと、中重合度（平均重
合度５００〜１０００）のブチラール樹脂５ｇとイソプ
ロピルアルコール１とを混合した電着液中で３００Ｖ
印加し、スルーホールのある鉄芯に電着を行なった。こ
のものを１２０℃１５分乾燥し、電着しなかった鉄芯露
出部に衝撃を与えた後焼成を行なったが、製品に何ら欠
陥は生じなかった。EXAMPLES glaze component, SiO 2, B 2 O 3 oxide view, SrO, MgO, BaO
300 V in an electrodeposition liquid in which 400 g of crystallized glaze fine powder consisting of 5 g of butyral resin having a medium degree of polymerization (average degree of polymerization of 500 to 1000) and isopropyl alcohol 1 are mixed.
It was applied and electrodeposited on the iron core with through holes. This product was dried at 120 ° C. for 15 minutes, impacted on the exposed iron core portion which was not electrodeposited, and then fired, but no defect was found in the product.
一方、上記配合中、ブチラール樹脂を入れなかったもの
では、電着後の塗膜に外観上何の変化ももたらさない程
度の小さな衝撃を与えたものでも、焼成すると、筋状に
塗膜が薄くなり内部の鉄芯が露出していた。On the other hand, in the above formulation, if the butyral resin was not added, even if a small impact was applied to the coating film after electrodeposition so as not to cause any change in appearance, even if it was baked, the coating film became thin in a streak pattern. The inner iron core was exposed.
（発明の効果） 有機溶剤を用いたほうろう釉薬の電着において、その塗
膜のもろさのために、製造時の取り扱いや環境が制限さ
れていたが、本発明により電着後の状態でも充分に塗膜
強度があり、取り扱い方や環境による製品塗膜の欠陥が
大巾に抑えられる。(Effects of the invention) In the electrodeposition of enameled glaze using an organic solvent, the handling and environment during production were limited due to the brittleness of the coating film, but according to the present invention, the state after electrodeposition is sufficient. It has strong coating film strength and can greatly suppress defects in the product coating film due to handling and environment.
Claims (1)
着させてその後焼成する工程を含むほうろう基板の製造
法において、電着液が、その過半がアルコール系溶剤で
ある有機溶剤と、ほうろう釉薬微粉と、０．２〜５０ｇ
／ｌの該有機溶剤と相溶性のある非イオン性高分子物質
であって、ビニルアセタール基を含み分子量が２００以
上である高分子物質とを含むものであることを特徴とす
るほうろう基板の製造法。1. A method for producing a enamel substrate, which comprises a step of adhering fine enamel glaze powder to a metal core by electrodeposition and then baking the same, wherein the electrodeposition solution comprises an organic solvent, the majority of which is an alcohol solvent. Enamel glaze fine powder, 0.2-50g
/ L of a nonionic polymer substance compatible with the organic solvent, which is a polymer substance containing a vinyl acetal group and having a molecular weight of 200 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60260902A JPH0635679B2 (en) | 1985-11-20 | 1985-11-20 | Enamel board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60260902A JPH0635679B2 (en) | 1985-11-20 | 1985-11-20 | Enamel board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62120496A JPS62120496A (en) | 1987-06-01 |
| JPH0635679B2 true JPH0635679B2 (en) | 1994-05-11 |
Family
ID=17354343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60260902A Expired - Lifetime JPH0635679B2 (en) | 1985-11-20 | 1985-11-20 | Enamel board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635679B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0466762U (en) * | 1990-10-19 | 1992-06-12 | ||
| CN111792845B (en) * | 2020-07-08 | 2021-10-12 | 佛山市东鹏陶瓷有限公司 | Preparation method of glazed tile |
| CN111807701B (en) * | 2020-07-08 | 2021-11-02 | 佛山市东鹏陶瓷有限公司 | Preparation method of high-strength ceramic glazed tile and prepared high-strength ceramic glazed tile |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129023A (en) * | 1978-03-30 | 1979-10-06 | Shinto Paint Co Ltd | Electrodeposition coating composition for enamel |
| JPS6033912B2 (en) * | 1982-04-15 | 1985-08-06 | 株式会社東芝 | Manufacturing method of hollow board |
-
1985
- 1985-11-20 JP JP60260902A patent/JPH0635679B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62120496A (en) | 1987-06-01 |
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